会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 6. 发明授权
    • Epoxy resin compositions
    • 环氧树脂组合物
    • US4929708A
    • 1990-05-29
    • US935303
    • 1986-11-26
    • Kaoru TominagaTadao Iwata
    • Kaoru TominagaTadao Iwata
    • C08G59/50C08G59/62
    • C08G59/5073C08G59/621
    • Disclosed are epoxy resin compositions comprising a 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin, hydroquinone and a reaction catalyst, or a 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin and N-aminoalkyl-substituted piperazine or a modified product thereof. These epoxy resin compositions as prepared are in a liquid state and hence resin moldings can be manufactured therefrom by such a simple technique as casting. It is also possible to cure these resin compositions at a temperature below 150.degree. C., and the resin moldings obtained therefrom are tough and excellent in impact resistance as well as in heat resistance.
    • 公开了包含1,1-双(4-羟基芳基)低级烷烃型环氧树脂,氢醌和反应催化剂或1,1-双(4-羟基芳基)低级烷烃型环氧树脂和N-氨基烷基的环氧树脂组合物 - 取代的哌嗪或其改性产物。 制备的这些环氧树脂组合物处于液态,因此通过铸造这样简单的技术可以制造树脂模制品。 也可以在低于150℃的温度下固化这些树脂组合物,并且由此得到的树脂成形品具有坚韧性和耐冲击性以及耐热性。