专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5070041A Method of removing flash from a semiconductor leadframe using coated leadframe and solvent 失效
标题翻译：使用涂覆的铅笔和溶剂从半导体引线去除闪光的方法
公开(公告)号：US5070041A
公开(公告)日：1991-12-03
申请号：US391986
申请日：1989-08-10
申请人： Shigeru Katayama , Kaoru Tominaga , Toshio Suetsugu , Kazumi Matsumoto
发明人： Shigeru Katayama , Kaoru Tominaga , Toshio Suetsugu , Kazumi Matsumoto
IPC分类号： H01L21/48 , H01L21/50 , H01L23/10
CPC分类号： H01L21/50 , H01L21/4835 , H01L23/10 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/16195 , Y10T29/49121
摘要： In accordance with the present invention, semiconductor devices are produced by the process involving the steps of obtaining a core-box resin molded item integrated with a lead frame by coating said lead frame on its portions expected to be in non-contact with said core-box resin molded item with an organic high molecular substance having a melting or softening point higher than the molding temperature of the resin constituting said core-box resin molded item and soluble in a solvent which does not dissolve said core-box resin molded item, placing the thus coated lead frame in position within a mold and injecting the resin into the mold thereby carrying out injection or transfer molding and immersing the lead frame bearing core-box resin molded item obtained in the foregoing step in said solvent to remove by dissolving said organic high molecular substance. On that account, flashes of the resin formed on the lead frame can be removed with facility or the formation of said flashes can be suppressed without damaging the resin molded portion, whereby a good electrical connection between the lead frame and the semiconductor element can be accomplished.
摘要翻译：半导体器件通过以下方法制造，该方法包括以下步骤：通过在预期与所述芯盒树脂模制品不接触的部分上涂覆所述引线框架以获得与引线框架一体化的芯盒树脂模塑件，熔点或软化点高于构成所述芯盒树脂成型品的树脂的成型温度并溶解在不溶解所述芯盒树脂成型品的溶剂中的高分子物质，将这样涂覆的引线框架放置在位在模具内并将树脂注入模具中，从而进行注射或转印成型，并将在上述步骤中获得的引线框架轴承芯盒树脂模制品浸入所述溶剂中，以通过溶解所述有机高分子物质除去。因此，可以抑制在引线框架上形成的树脂闪光，同时可以抑制闪光形成的设备，而不会损坏树脂模制部分，从而可以实现引线框架和半导体元件之间良好的电连接。本发明的另外的方法涉及使用超声波帮助消除闪光，并且还可以选择引线框架和树脂盒的材料，其线性膨胀系数相差小于所选择的量，以便实现良好的相互粘合和耐湿性。

2. 发明授权

US5343076A Semiconductor device with an airtight space formed internally within a hollow package 失效
标题翻译：半导体器件具有在中空封装内部形成的气密空间
公开(公告)号：US5343076A
公开(公告)日：1994-08-30
申请号：US155539
申请日：1993-11-22
申请人： Shigeru Katayama , Kaoru Tominaga , Junichi Yoshitake
发明人： Shigeru Katayama , Kaoru Tominaga , Junichi Yoshitake
IPC分类号： H01L23/00 , H01L23/057 , H01L23/495 , H01L23/48 , H01L23/02 , H01L23/12 , H01L29/40
CPC分类号： H01L23/564 , H01L23/057 , H01L23/49551 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12033 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195
摘要： This invention relates to a package construction of a semiconductor device, and provides a semiconductor device in which a vapor-impermeable moistureproof plate is embedded in a bottom surface of a hollow package or an inner surface wallthicknesswise therefrom to provide an excellent moisture-proofness in terms of the package construction.
摘要翻译：本发明涉及一种半导体器件的封装结构，并且提供了一种半导体器件，其中将不透气防潮板嵌入中空封装的底表面或其内表面壁，从而提供优异的防潮性的包装结构。

3. 发明授权

US4929708A Epoxy resin compositions 失效
标题翻译：环氧树脂组合物
公开(公告)号：US4929708A
公开(公告)日：1990-05-29
申请号：US935303
申请日：1986-11-26
申请人： Kaoru Tominaga , Tadao Iwata
发明人： Kaoru Tominaga , Tadao Iwata
IPC分类号： C08G59/50 , C08G59/62
CPC分类号： C08G59/5073 , C08G59/621
摘要： Disclosed are epoxy resin compositions comprising a 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin, hydroquinone and a reaction catalyst, or a 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin and N-aminoalkyl-substituted piperazine or a modified product thereof. These epoxy resin compositions as prepared are in a liquid state and hence resin moldings can be manufactured therefrom by such a simple technique as casting. It is also possible to cure these resin compositions at a temperature below 150.degree. C., and the resin moldings obtained therefrom are tough and excellent in impact resistance as well as in heat resistance.
摘要翻译：公开了包含1,1-双（4-羟基芳基）低级烷烃型环氧树脂，氢醌和反应催化剂或1,1-双（4-羟基芳基）低级烷烃型环氧树脂和N-氨基烷基的环氧树脂组合物 - 取代的哌嗪或其改性产物。制备的这些环氧树脂组合物处于液态，因此通过铸造这样简单的技术可以制造树脂模制品。也可以在低于150℃的温度下固化这些树脂组合物，并且由此得到的树脂成形品具有坚韧性和耐冲击性以及耐热性。

4. 发明授权

US4885329A Polyimide resin compositions 失效
标题翻译：聚酰亚胺树脂组合物
公开(公告)号：US4885329A
公开(公告)日：1989-12-05
申请号：US181529
申请日：1988-04-14
申请人： Kaoru Tominaga , Kojiro Kan , Toshimasa Takata , Toru Tomoshige
发明人： Kaoru Tominaga , Kojiro Kan , Toshimasa Takata , Toru Tomoshige
IPC分类号： C08G73/12 , C08G77/455 , C08L79/08
CPC分类号： C08L79/085 , C08G73/12 , C08G77/455
摘要： A semiconductor encapsulating material is obtained from a polyimide resin composition comprising (A) a polyaminobismaleimide resin, (B) a silicone monomer and/or oligomer having a hydroxyl or alkoxyl group bonded to a silicon atom and mixtures thereof, and (C) an inorganic filler wherein the weight ratio of polyaminobismaleimide resin (A) to silicone component (B) ranges from 99.5/0.5 to 70/30, and the weight ratio of polyaminobismaleimide resin (A) to inorganic filler (C) ranges from 100/50 to 100/1000.

5. 发明授权

US6048754A Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package 失效
标题翻译：制造具有在中空封装内部形成的气密空间的半导体器件的方法
公开(公告)号：US6048754A
公开(公告)日：2000-04-11
申请号：US260977
申请日：1994-06-15
申请人： Shigeru Katayama , Kaoru Tominaga , Junichi Yoshitake
发明人： Shigeru Katayama , Kaoru Tominaga , Junichi Yoshitake
IPC分类号： H01L23/00 , H01L23/057 , H01L23/495 , H01L21/52 , H01L21/56 , H01L21/58 , H01L21/60
CPC分类号： H01L23/564 , H01L23/057 , H01L23/49551 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12033 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195
摘要： A process for manufacturing a package of a semiconductor device, and providing a semiconductor device in which a vapor-impermeable moistureproof plate is embedded in a bottom surface of a hollow package or an inner surface wallthicknesswise therefrom to provide moisture-proofness.
摘要翻译：一种用于制造半导体器件的封装的方法，并且提供一种半导体器件，其中将不透气的防潮板嵌入到中空封装的底表面或其内表面壁上以提供防潮性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式