专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06551676B1 Silicone-based adhesive sheet method for manufacturing same and semiconductor device 有权
标题翻译：用于制造其硅酮基粘合片的方法和半导体器件
公开(公告)号：US06551676B1
公开(公告)日：2003-04-22
申请号：US09384152
申请日：1999-08-27
申请人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
IPC分类号： B32B904
CPC分类号： H01L24/83 , C09J7/10 , C09J183/04 , C09J2203/326 , C09J2483/00 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/29291 , H01L2224/29386 , H01L2224/29388 , H01L2224/2939 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/83855 , H01L2224/83856 , H01L2224/85424 , H01L2224/85444 , H01L2224/8547 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , Y10S428/914 , Y10T428/14 , Y10T428/1452 , Y10T428/1457 , Y10T428/1462 , Y10T428/1471 , Y10T428/1476 , Y10T428/31663 , Y10T428/31786 , H01L2924/0715 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A semiconductor device comprising a semiconductor chip, a chip attachment component, and the above-mentioned silicone-based adhesive sheet, wherein the semiconductor chip is bonded to the chip attachment component with the silicone-based adhesive sheet.
摘要翻译：一种通过包括（i）固化硅氧烷组合物以形成基本固化的产品同时组合物位于背衬材料之间的硅氧烷基粘合片，其中至少一种背衬材料具有包含氧原子和/或硫的表面与硅氧烷组合物和背衬材料接触的原子可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种制造硅氧烷基粘合片的方法，包括（i）固化硅氧烷组合物以形成固化产物，同时组合物位于背衬材料之间，其中至少一种背衬材料具有包含氧原子和/或硫原子的表面与硅氧烷组合物接触并且背衬材料可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种半导体器件，包括半导体芯片，芯片附着部件和上述硅氧烷基粘合片，其中半导体芯片与硅氧烷基粘合片结合到芯片附接部件。

2. 发明授权

US6040395A Electrical components and method for the fabrication thereof 失效
标题翻译：电气部件及其制造方法
公开(公告)号：US6040395A
公开(公告)日：2000-03-21
申请号：US316217
申请日：1999-05-21
申请人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
IPC分类号： C09D5/00 , C09D163/00 , C09D183/04 , C09D183/06 , H01G13/00 , H01L23/29 , H01L23/31 , C08F283/12
CPC分类号： H01L23/3142 , C09D183/04 , C09D183/06 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L24/73 , H01L2924/14 , H01L2924/19041
摘要： This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula: (R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.3 is selected from the group consisting of hydrogen and alkyl groups of 1 to 4 carbon atoms; a, b, and d are each a positive number; and c is 0 or a positive number.
摘要翻译：本发明涉及改善固化树脂密封剂对电气元件上固化的硅氧烷涂层的粘附性的底漆，其中所述底漆选自：（i）组分（a）和（b）的混合物，（ⅱ）组分（a）和（b），（ⅲ）组分（c），（ⅳ）组分（c）和组分（a）和（b）的混合物和（ⅴ） c）和组分（a）和（b）的反应混合物，其中组分（a）是硅烷醇官能的有机聚硅氧烷; 组分（b）是环氧官能的有机烷氧基硅烷; 组分（c）是平均单元式为（R1SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（R3O1 / 2）d的有机聚硅氧烷，其中R1为环氧官能单价有机基团; 每个R 2独立地为一价烃基，R 3选自氢和1至4个碳原子的烷基; a，b和d分别为正数; c为0或正数。

3. 发明授权

US06518204B2 Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition 有权
公开(公告)号：US06518204B2
公开(公告)日：2003-02-11
申请号：US10094231
申请日：2002-03-07
申请人： Kimio Yamakawa , Kazumi Nakayoshi , Hiroki Ishikawa , Ryoto Shima , Junji Nakanishi , Tomoko Kato , Minoru Isshiki , Katsutoshi Mine
发明人： Kimio Yamakawa , Kazumi Nakayoshi , Hiroki Ishikawa , Ryoto Shima , Junji Nakanishi , Tomoko Kato , Minoru Isshiki , Katsutoshi Mine
IPC分类号： H01L2131
CPC分类号： H01L23/3135 , C08F283/12 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/3122 , H01L23/293 , H01L2224/48091 , H01L2924/1301 , H01L2924/19041 , C08F230/08 , H01L2924/00014 , H01L2924/00
摘要： A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.

4. 发明授权

US06410642B1 Adhesive and semiconductor devices 有权
标题翻译：粘合剂和半导体器件
公开(公告)号：US06410642B1
公开(公告)日：2002-06-25
申请号：US09597061
申请日：2000-06-20
申请人： Kimio Yamakawa , Minoru Isshiki , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Katsutoshi Mine
IPC分类号： C08K300
CPC分类号： H01L24/32 , C08K7/18 , C08K2201/016 , C08L2666/54 , C09J11/02 , C09J183/04 , H01L21/563 , H01L24/83 , H01L2224/16225 , H01L2224/27013 , H01L2224/2919 , H01L2224/73203 , H01L2224/83051 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T428/31511 , Y10T428/31663 , H01L2924/00
摘要： An adhesive composition for bonding of semiconductor chips to their chip mounting component comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.
摘要翻译：一种用于将半导体芯片粘接到其芯片安装部件上的粘合剂组合物，其包含可固化聚合物组合物，其包含平均粒径大于100至1,000μm，长宽比为1至1.5的球形填料。根据本发明的半导体器件的特征在于，其中的半导体芯片通过上述粘合剂结合到用于所述芯片的安装部件。

5. 发明授权

US06225433B1 Curable silicone composition and electronic components 有权
标题翻译：可固化有机硅组合物和电子元件
公开(公告)号：US06225433B1
公开(公告)日：2001-05-01
申请号：US09168811
申请日：1998-10-08
申请人： Minoru Isshiki , Katsutoshi Mine , Yoshiko Otani , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Yoshiko Otani , Kimio Yamakawa
IPC分类号： C08G7708
CPC分类号： H01L24/32 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08L83/00 , C08L83/04 , C09J183/04 , H01L21/563 , H01L24/83 , H01L2224/16225 , H01L2224/27013 , H01L2224/2919 , H01L2224/29191 , H01L2224/73203 , H01L2224/83051 , H01L2224/8319 , H01L2224/83855 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , Y10T428/31663 , H01L2924/0715 , H01L2924/00 , H01L2924/3512
摘要： A curable silicon composition, comprising (A) 100 parts by weight of an organopolysiloxane containing silicon-bonded aryl groups and at least two alkenyl groups per molecule, and having a viscosity of from 0.01 to 1,000 Pa.s at 25° C., wherein the aryl groups comprise from 1 to 40 mole % of the total silicon-bonded organic groups in the organopolysiloxane; (B) an organopolysiloxane having a viscosity of from 0.001 to 10 Pa.s at 25° C. and containing at least 2 silicon-bonded hydrogen atoms per molecule, in a quantity sufficient to cure the composition; (C) a platinum catalyst in a quantity sufficient to cure the composition; and (D) 0.00001 to 100 parts by weight of an organopolysiloxane having a viscosity of from 0.01 to 10,000 Pa.s at 25° C., with the proviso that when the organopolysiloxane contains aryl groups, the aryl groups comprise less than 1 mole % or more than 40 mole % of the total silicon-bonded organic groups in the organopolysiloxane, and wherein the organopolysiloxane cures to form a silicone having a complex modulus≦1×108 Pa at −65° C. and a shear frequency of 10 Hz or a cured silicone having a Young's modulus≦2.9×108 Pa at −65° C.
摘要翻译：一种可固化硅组合物，其包含（A）100重量份的每分子含硅键合芳基和至少两个烯基的有机聚硅氧烷，并且在25℃下具有0.01至1,000Pa.s的粘度，其中所述芳基包含有机聚硅氧烷中总硅键合有机基团的1至40摩尔％（B）在25℃下粘度为0.001至10Pa.s并且每分子含有至少2个硅键合的氢原子的有机聚硅氧烷，其量足以固化该组合物; （C）足以固化组合物的量的铂催化剂; 和（D）0.00001至100重量份在25℃下粘度为0.01至10,000Pa.s的有机聚硅氧烷，条件是当有机聚硅氧烷含有芳基时，芳基包含小于1摩尔％或多于40摩尔％的有机聚硅氧烷中总硅结合的有机基团，并且其中有机聚硅氧烷固化以形成在-65℃下的复数模量<= 1×108Pa和10Hz的剪切频率或在-65℃下具有杨氏模量<= 2.9×10 8 Pa的固化的硅氧烷

6. 发明授权

US5958176A Electrical parts and method for manufacturing the same 失效
标题翻译：电气部件及其制造方法
公开(公告)号：US5958176A
公开(公告)日：1999-09-28
申请号：US899967
申请日：1997-07-24
申请人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
IPC分类号： C08L83/06 , C08G59/18 , C08G77/14 , C08G77/22 , C08L83/04 , H01G4/224 , H01L23/24 , H01L23/29 , H01L23/31 , B27G11/02
CPC分类号： H01L23/296 , C08L83/04 , H01L23/24 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/09701
摘要： An electrical part containing an electrical element, a cured silicone resin which has been treated with ultraviolet light, a cured sealing resin which has been integrally bonded to the UV treated silicone resin. The cured silicone resin is prepared from an addition reaction curable silicone composition which is a mixture or reaction mixture of (a) an organosiloxane which has silanol groups and (b) an alkoxysilane which has epoxy groups, and/or (c) an organosiloxane which can be expressed by the average unit formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwherein R.sup.1 is an epoxy group containing monovalent organic group R.sup.2 is monovalent hydrocarbon group, R.sup.3 is a hydrogen atom or an alkyl group with 1 to 4 carbon atoms, a, b and d are>0 and c is.gtoreq.0.A method for manufacturing an electrical part containing the steps (I) covering an electrical element with the above mentioned silicone composition; (ii) curing the silicone composition to form a cured silicone resin; (iii) subjecting the cured silicone resin to ultraviolet irradiation treatment; and (iv) sealing the cured silicone resin with a sealing resin.
摘要翻译：含有电气元件的电气部件，已经用紫外线处理过的固化的硅氧烷树脂，已固化的密封树脂已经与紫外线处理过的硅树脂整体结合。固化的有机硅树脂由加成反应固化的硅氧烷组合物制备，该组合物是（a）具有硅烷醇基的有机硅氧烷和（b）具有环氧基的烷氧基硅烷的混合物或反应混合物，和/或（c）有机硅氧烷，可以由平均单元式（R1SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（R3O1 / 2）d表示，其中R1是含有一价有机基团的环氧基，R2是一价烃基，R3是氢原子或碳原子数1〜4的烷基，a，b，d分别为0以上且c为0以上。一种制造电气部件的方法，该电气部件包含用上述硅酮组合物覆盖电气元件的步骤（I）（ii）固化硅氧烷组合物以形成固化的有机硅树脂; （iii）对固化的有机硅树脂进行紫外线照射处理; 和（iv）用密封树脂密封固化的硅氧烷树脂。

7. 发明授权

US5872194A Curable liquid-form composition, cured product of the same, and electronic part 失效
标题翻译：可固化的液态组合物，固化产物和电子部件
公开(公告)号：US5872194A
公开(公告)日：1999-02-16
申请号：US889377
申请日：1997-07-08
申请人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
IPC分类号： C08L63/00 , C08L83/04 , C08L83/07 , H01L23/29 , H01L23/31 , C08F283/12
CPC分类号： C08L63/00 , C08L83/04 , C08G77/045 , C08G77/10 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/70 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , Y10T428/31663
摘要： A curable composition containing a curable liquid-form organopolysiloxane composition and a curable liquid-form organic resin composition. The organic resin composition is contained as liquid particles in the organopolysiloxane composition. A cured product formed by curing the abovementioned curable liquid composition such that the cured product contains fine particles of a cured organic resin in a cured organopolysiloxane matrix. An electronic part which is covered by the cured product of the abovementioned curable liquid-form composition.
摘要翻译：一种含有可固化液体形式的有机基聚硅氧烷组合物和可固化液体形式的有机树脂组合物的可固化组合物。有机树脂组合物作为液体颗粒包含在有机聚硅氧烷组合物中。通过固化上述可固化液体组合物形成的固化产物，使得固化产物在固化的有机聚硅氧烷基质中含有固化的有机树脂的细颗粒。由上述可固化液体形式组合物的固化产物覆盖的电子部件。

8. 发明授权

US06621173B1 Semiconductor device having an adhesive and a sealant 有权
标题翻译：具有粘合剂和密封剂的半导体器件
公开(公告)号：US06621173B1
公开(公告)日：2003-09-16
申请号：US09483752
申请日：2000-01-14
申请人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
IPC分类号： H01L2328
CPC分类号： H01L23/3114 , H01L23/293 , H01L23/296 , H01L2224/05548 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2224/05599
摘要： A semiconductor device having a semiconductor chip; a semiconductor chip attachment element facing the semiconductor chip, at least one interconnect on the surface of the semiconductor chip attachment element; and at least one member consisting of a metal or metal alloy that electrically connects the semiconductor chip with the interconnects; wherein the semiconductor chip is bonded to the semiconductor chip attachment element by an adhesive and at least a portion of at least one member that electrically connects the semiconductor chip with at least one interconnect is sealed or imbedded with a sealant/filling agent, and the complex modulus of at least one of the adhesive and the sealant/filling agent is not greater than 1×108 Pa at −65° C. and a shear frequency of 10 Hz.
摘要翻译：一种具有半导体芯片的半导体器件; 面对所述半导体芯片的半导体芯片附接元件，所述半导体芯片附接元件的表面上的至少一个互连; 以及由将半导体芯片与互连电连接的金属或金属合金构成的至少一个构件; 其中所述半导体芯片通过粘合剂结合到所述半导体芯片附接元件，并且将所述半导体芯片与至少一个互连件电连接的至少一个部件的至少一部分用密封剂/填充剂密封或嵌入，并且所述复合物粘合剂和密封剂/填充剂中的至少一种的模量在-65℃和10Hz的剪切频率下不大于1×10 8 Pa。

9. 发明授权

US5958515A Electrical components and method for the fabrication thereof 失效
标题翻译：电气部件及其制造方法
公开(公告)号：US5958515A
公开(公告)日：1999-09-28
申请号：US923074
申请日：1997-09-03
申请人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
IPC分类号： C09D5/00 , C09D163/00 , C09D183/04 , C09D183/06 , H01G13/00 , H01L23/29 , H01L23/31 , B05D3/02
CPC分类号： H01L23/3142 , C09D183/04 , C09D183/06 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L24/73 , H01L2924/14 , H01L2924/19041
摘要： This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula:(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.3 is selected from the group consisting of hydrogen and alkyl groups of 1 to 4 carbon atoms; a, b, and d are each a positive number; and c is 0 or a positive number.
摘要翻译：本发明涉及改善固化树脂密封剂对电气元件上固化的硅氧烷涂层的粘附性的底漆，其中所述底漆选自：（i）组分（a）和（b）的混合物，（ⅱ）组分（a）和（b），（ⅲ）组分（c），（ⅳ）组分（c）和组分（a）和（b）的混合物和（ⅴ） c）和组分（a）和（b）的反应混合物，其中组分（a）是硅烷醇官能的有机聚硅氧烷; 组分（b）是环氧官能的有机烷氧基硅烷; 组分（c）是具有平均单元式的有机聚硅氧烷：（R1SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（R3O1 / 2）d其中R1是环氧官能的单价有机基团; 每个R 2独立地为一价烃基，R 3选自氢和1至4个碳原子的烷基; a，b和d分别为正数; c为0或正数。

10. 发明授权

US06761947B2 Silicone-based adhesive sheet, method for manufacturing same, and semiconductor device 失效
标题翻译：硅酮系粘合片及其制造方法以及半导体装置
公开(公告)号：US06761947B2
公开(公告)日：2004-07-13
申请号：US10347564
申请日：2003-01-17
申请人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
IPC分类号： B32B3300
CPC分类号： H01L24/83 , C09J7/10 , C09J183/04 , C09J2203/326 , C09J2483/00 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/29291 , H01L2224/29386 , H01L2224/29388 , H01L2224/2939 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/83855 , H01L2224/83856 , H01L2224/85424 , H01L2224/85444 , H01L2224/8547 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , Y10S428/914 , Y10T428/14 , Y10T428/1452 , Y10T428/1457 , Y10T428/1462 , Y10T428/1471 , Y10T428/1476 , Y10T428/31663 , Y10T428/31786 , H01L2924/0715 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A semiconductor device comprising a semiconductor chip, a chip attachment component, and the above-mentioned silicone-based adhesive sheet, wherein the semiconductor chip is bonded to the chip attachment component with the silicone-based adhesive sheet.
摘要翻译：一种通过包括（i）固化硅氧烷组合物以形成基本上固化的产品同时组合物位于背衬材料之间的硅氧烷基粘合片，其中至少一种背衬材料具有包含氧原子和/或硫的表面与硅氧烷组合物和背衬材料接触的原子可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种制造硅氧烷基粘合片的方法，包括（i）固化硅氧烷组合物以形成固化产物，同时组合物位于背衬材料之间，其中至少一种背衬材料具有包含氧原子和/或硫原子的表面与硅氧烷组合物接触并且背衬材料可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种半导体器件，包括半导体芯片，芯片附着部件和上述硅氧烷基粘合片，其中半导体芯片与硅氧烷基粘合片结合到芯片附接部件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式