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1. 发明授权

US06551676B1 Silicone-based adhesive sheet method for manufacturing same and semiconductor device 有权
标题翻译：用于制造其硅酮基粘合片的方法和半导体器件
公开(公告)号：US06551676B1
公开(公告)日：2003-04-22
申请号：US09384152
申请日：1999-08-27
申请人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
IPC分类号： B32B904
CPC分类号： H01L24/83 , C09J7/10 , C09J183/04 , C09J2203/326 , C09J2483/00 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/29291 , H01L2224/29386 , H01L2224/29388 , H01L2224/2939 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/83855 , H01L2224/83856 , H01L2224/85424 , H01L2224/85444 , H01L2224/8547 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , Y10S428/914 , Y10T428/14 , Y10T428/1452 , Y10T428/1457 , Y10T428/1462 , Y10T428/1471 , Y10T428/1476 , Y10T428/31663 , Y10T428/31786 , H01L2924/0715 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A semiconductor device comprising a semiconductor chip, a chip attachment component, and the above-mentioned silicone-based adhesive sheet, wherein the semiconductor chip is bonded to the chip attachment component with the silicone-based adhesive sheet.
摘要翻译：一种通过包括（i）固化硅氧烷组合物以形成基本固化的产品同时组合物位于背衬材料之间的硅氧烷基粘合片，其中至少一种背衬材料具有包含氧原子和/或硫的表面与硅氧烷组合物和背衬材料接触的原子可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种制造硅氧烷基粘合片的方法，包括（i）固化硅氧烷组合物以形成固化产物，同时组合物位于背衬材料之间，其中至少一种背衬材料具有包含氧原子和/或硫原子的表面与硅氧烷组合物接触并且背衬材料可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种半导体器件，包括半导体芯片，芯片附着部件和上述硅氧烷基粘合片，其中半导体芯片与硅氧烷基粘合片结合到芯片附接部件。

2. 发明授权

US6040395A Electrical components and method for the fabrication thereof 失效
标题翻译：电气部件及其制造方法
公开(公告)号：US6040395A
公开(公告)日：2000-03-21
申请号：US316217
申请日：1999-05-21
申请人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
IPC分类号： C09D5/00 , C09D163/00 , C09D183/04 , C09D183/06 , H01G13/00 , H01L23/29 , H01L23/31 , C08F283/12
CPC分类号： H01L23/3142 , C09D183/04 , C09D183/06 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L24/73 , H01L2924/14 , H01L2924/19041
摘要： This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula: (R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.3 is selected from the group consisting of hydrogen and alkyl groups of 1 to 4 carbon atoms; a, b, and d are each a positive number; and c is 0 or a positive number.
摘要翻译：本发明涉及改善固化树脂密封剂对电气元件上固化的硅氧烷涂层的粘附性的底漆，其中所述底漆选自：（i）组分（a）和（b）的混合物，（ⅱ）组分（a）和（b），（ⅲ）组分（c），（ⅳ）组分（c）和组分（a）和（b）的混合物和（ⅴ） c）和组分（a）和（b）的反应混合物，其中组分（a）是硅烷醇官能的有机聚硅氧烷; 组分（b）是环氧官能的有机烷氧基硅烷; 组分（c）是平均单元式为（R1SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（R3O1 / 2）d的有机聚硅氧烷，其中R1为环氧官能单价有机基团; 每个R 2独立地为一价烃基，R 3选自氢和1至4个碳原子的烷基; a，b和d分别为正数; c为0或正数。

3. 发明授权

US06761947B2 Silicone-based adhesive sheet, method for manufacturing same, and semiconductor device 失效
标题翻译：硅酮系粘合片及其制造方法以及半导体装置
公开(公告)号：US06761947B2
公开(公告)日：2004-07-13
申请号：US10347564
申请日：2003-01-17
申请人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
IPC分类号： B32B3300
CPC分类号： H01L24/83 , C09J7/10 , C09J183/04 , C09J2203/326 , C09J2483/00 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/29291 , H01L2224/29386 , H01L2224/29388 , H01L2224/2939 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/83855 , H01L2224/83856 , H01L2224/85424 , H01L2224/85444 , H01L2224/8547 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , Y10S428/914 , Y10T428/14 , Y10T428/1452 , Y10T428/1457 , Y10T428/1462 , Y10T428/1471 , Y10T428/1476 , Y10T428/31663 , Y10T428/31786 , H01L2924/0715 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A semiconductor device comprising a semiconductor chip, a chip attachment component, and the above-mentioned silicone-based adhesive sheet, wherein the semiconductor chip is bonded to the chip attachment component with the silicone-based adhesive sheet.
摘要翻译：一种通过包括（i）固化硅氧烷组合物以形成基本上固化的产品同时组合物位于背衬材料之间的硅氧烷基粘合片，其中至少一种背衬材料具有包含氧原子和/或硫的表面与硅氧烷组合物和背衬材料接触的原子可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种制造硅氧烷基粘合片的方法，包括（i）固化硅氧烷组合物以形成固化产物，同时组合物位于背衬材料之间，其中至少一种背衬材料具有包含氧原子和/或硫原子的表面与硅氧烷组合物接触并且背衬材料可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种半导体器件，包括半导体芯片，芯片附着部件和上述硅氧烷基粘合片，其中半导体芯片与硅氧烷基粘合片结合到芯片附接部件。

4. 发明授权

US06750550B1 Adhesive and semiconductor devices 失效
标题翻译：粘合剂和半导体器件
公开(公告)号：US06750550B1
公开(公告)日：2004-06-15
申请号：US09597218
申请日：2000-06-20
申请人： Kimio Yamakawa , Minoru Isshiki , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Katsutoshi Mine
IPC分类号： H01L2348
CPC分类号： H01L24/32 , C08G59/306 , C08G59/3254 , C08K7/18 , C08L2666/54 , C09J11/02 , C09J183/04 , H01L21/563 , H01L24/83 , H01L2224/16225 , H01L2224/27013 , H01L2224/2919 , H01L2224/73203 , H01L2224/73204 , H01L2224/83051 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/00
摘要： An adhesive composition for bonding semiconductor chips to their chip mounting components comprising a curable polymer composition comprising from 1 to 900 weight-ppm spherical filler having an average particle size of from 10 to 100 &mgr;m and a major axis-to-minor axis ratio of from 1 to 1.5. Also, semiconductor devices in which a semiconductor chip therein is bonded to its chip mounting component by the aforesaid adhesive composition.
摘要翻译：一种用于将半导体芯片接合到其芯片安装部件的粘合剂组合物，其包含可固化聚合物组合物，其包含1至900重量ppm的平均粒度为10至100μm的球形填料，并且长轴与短轴比为 1〜1.5。此外，其中通过上述粘合剂组合物将其中的半导体芯片结合到其芯片安装部件的半导体器件。

5. 发明授权

US06304000B1 Semiconductor device comprising silicone adhesive sheet 失效
标题翻译：包括硅酮粘合片的半导体装置
公开(公告)号：US06304000B1
公开(公告)日：2001-10-16
申请号：US09706561
申请日：2000-11-06
申请人： Minoru Isshiki , Katsutoshi Mine , Yoshiko Otani , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Yoshiko Otani , Kimio Yamakawa
IPC分类号： H01L2348
CPC分类号： H01L24/29 , C08L83/00 , C09J7/10 , C09J183/04 , C09J2203/326 , C09J2483/00 , H01L24/73 , H01L24/83 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A semiconductor device comprising a semiconductor chip, a semiconductor chip attachment site facing the semiconductor chip, and an adhesive silicone sheet bonding the semiconductor chip to the chip attachment site, wherein at least the surfaces of the sheet that connect the semiconductor chip and chip attachment site are a semi-cured product of a curable silicone composition.
摘要翻译：一种半导体器件，包括半导体芯片，面向半导体芯片的半导体芯片附着部位和将半导体芯片接合到芯片安装部位的粘合性硅树脂片，其中至少连接半导体芯片和芯片附接部位的片材的表面是可固化的有机硅组合物的半固化产物。

6. 发明授权

US06235862B1 Adhesive silicone sheet, method for the preparation thereof and semiconductor devices 失效
标题翻译：粘合硅胶片，其制备方法和半导体装置
公开(公告)号：US06235862B1
公开(公告)日：2001-05-22
申请号：US09070078
申请日：1998-04-30
申请人： Minoru Isshiki , Katsutoshi Mine , Yoshiko Otani , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Yoshiko Otani , Kimio Yamakawa
IPC分类号： H01L2144
CPC分类号： H01L24/29 , C08L83/00 , C09J7/10 , C09J183/04 , C09J2203/326 , C09J2483/00 , H01L24/73 , H01L24/83 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An adhesive silicone sheet that enroute to its complete cure is inhibited from releasing low-viscosity silicone oil, that provides excellent bond between a semiconductor chip and the corresponding chip attachment site, and that as a consequence of these features supports the fabrication of highly reliable semiconductor devices, The adhesive silicone sheet is produced by a very efficient method which yields an adhesive silicone sheet having particularly good adhesiveness. The siliocone adhesive sheet is used to produce highly reliable semiconductor devices in which the semiconductor chip has been bonded to its attachment site using the subject adhesive silicone sheet.
摘要翻译：阻止其完全固化的粘性硅树脂片材释放出低粘度硅油，从而在半导体芯片和相应的芯片附着部位之间提供优异的粘合性，并且作为这些特征的结果支持制造高度可靠的半导体粘合性硅胶片是通过非常有效的方法制造的，其产生具有特别好的粘合性的粘合性硅树脂片。硅胶粘合片用于制造高可靠性的半导体器件，其中半导体芯片已经使用主题粘合性硅树脂片粘合到其附着位置。

7. 发明授权

US06231974B1 Hot-melt adhesive sheet and semiconductor devices 失效
标题翻译：热熔胶片和半导体装置
公开(公告)号：US06231974B1
公开(公告)日：2001-05-15
申请号：US09082889
申请日：1998-05-21
申请人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
IPC分类号： B32B712
CPC分类号： H01L24/83 , C09J7/22 , C09J7/35 , C09J2201/128 , C09J2483/00 , H01L24/29 , H01L24/73 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83101 , H01L2224/8319 , H01L2224/8388 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , Y10T428/28 , Y10T428/2813 , Y10T428/2848 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： To provides a hot-melt adhesive sheet that provides very precise bonding and a stress-relaxation capacity. Also, to provide highly reliable semiconductor devices in which the semiconductor element is bonded to its element attachment site using this hot-melt adhesive sheet. Hot-melt adhesive sheet that characteristically has hot-melt adhesive on both surfaces of the sheet and spacer within the sheet. Also, semiconductor device characterized in that the semiconductor element therein is bonded to its element attachment site by the above-described hot-melt adhesive sheet.
摘要翻译：提供提供非常精确的结合和应力松弛能力的热熔粘合片。此外，为了提供使用该热熔粘合片将半导体元件结合到其元件安装部位的高度可靠的半导体器件。在片材的两个表面上特征性地具有热熔粘合剂的熔融粘合片和位于片。此外，半导体器件的特征在于，其中的半导体元件通过上述热熔粘合片粘合到其元件附着位置。

8. 发明授权

US06518204B2 Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition 有权
公开(公告)号：US06518204B2
公开(公告)日：2003-02-11
申请号：US10094231
申请日：2002-03-07
申请人： Kimio Yamakawa , Kazumi Nakayoshi , Hiroki Ishikawa , Ryoto Shima , Junji Nakanishi , Tomoko Kato , Minoru Isshiki , Katsutoshi Mine
发明人： Kimio Yamakawa , Kazumi Nakayoshi , Hiroki Ishikawa , Ryoto Shima , Junji Nakanishi , Tomoko Kato , Minoru Isshiki , Katsutoshi Mine
IPC分类号： H01L2131
CPC分类号： H01L23/3135 , C08F283/12 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/3122 , H01L23/293 , H01L2224/48091 , H01L2924/1301 , H01L2924/19041 , C08F230/08 , H01L2924/00014 , H01L2924/00
摘要： A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.

9. 发明授权

US06410642B1 Adhesive and semiconductor devices 有权
标题翻译：粘合剂和半导体器件
公开(公告)号：US06410642B1
公开(公告)日：2002-06-25
申请号：US09597061
申请日：2000-06-20
申请人： Kimio Yamakawa , Minoru Isshiki , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Katsutoshi Mine
IPC分类号： C08K300
CPC分类号： H01L24/32 , C08K7/18 , C08K2201/016 , C08L2666/54 , C09J11/02 , C09J183/04 , H01L21/563 , H01L24/83 , H01L2224/16225 , H01L2224/27013 , H01L2224/2919 , H01L2224/73203 , H01L2224/83051 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T428/31511 , Y10T428/31663 , H01L2924/00
摘要： An adhesive composition for bonding of semiconductor chips to their chip mounting component comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.
摘要翻译：一种用于将半导体芯片粘接到其芯片安装部件上的粘合剂组合物，其包含可固化聚合物组合物，其包含平均粒径大于100至1,000μm，长宽比为1至1.5的球形填料。根据本发明的半导体器件的特征在于，其中的半导体芯片通过上述粘合剂结合到用于所述芯片的安装部件。

10. 发明授权

US06225433B1 Curable silicone composition and electronic components 有权
标题翻译：可固化有机硅组合物和电子元件
公开(公告)号：US06225433B1
公开(公告)日：2001-05-01
申请号：US09168811
申请日：1998-10-08
申请人： Minoru Isshiki , Katsutoshi Mine , Yoshiko Otani , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Yoshiko Otani , Kimio Yamakawa
IPC分类号： C08G7708
CPC分类号： H01L24/32 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08L83/00 , C08L83/04 , C09J183/04 , H01L21/563 , H01L24/83 , H01L2224/16225 , H01L2224/27013 , H01L2224/2919 , H01L2224/29191 , H01L2224/73203 , H01L2224/83051 , H01L2224/8319 , H01L2224/83855 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , Y10T428/31663 , H01L2924/0715 , H01L2924/00 , H01L2924/3512
摘要： A curable silicon composition, comprising (A) 100 parts by weight of an organopolysiloxane containing silicon-bonded aryl groups and at least two alkenyl groups per molecule, and having a viscosity of from 0.01 to 1,000 Pa.s at 25° C., wherein the aryl groups comprise from 1 to 40 mole % of the total silicon-bonded organic groups in the organopolysiloxane; (B) an organopolysiloxane having a viscosity of from 0.001 to 10 Pa.s at 25° C. and containing at least 2 silicon-bonded hydrogen atoms per molecule, in a quantity sufficient to cure the composition; (C) a platinum catalyst in a quantity sufficient to cure the composition; and (D) 0.00001 to 100 parts by weight of an organopolysiloxane having a viscosity of from 0.01 to 10,000 Pa.s at 25° C., with the proviso that when the organopolysiloxane contains aryl groups, the aryl groups comprise less than 1 mole % or more than 40 mole % of the total silicon-bonded organic groups in the organopolysiloxane, and wherein the organopolysiloxane cures to form a silicone having a complex modulus≦1×108 Pa at −65° C. and a shear frequency of 10 Hz or a cured silicone having a Young's modulus≦2.9×108 Pa at −65° C.
摘要翻译：一种可固化硅组合物，其包含（A）100重量份的每分子含硅键合芳基和至少两个烯基的有机聚硅氧烷，并且在25℃下具有0.01至1,000Pa.s的粘度，其中所述芳基包含有机聚硅氧烷中总硅键合有机基团的1至40摩尔％（B）在25℃下粘度为0.001至10Pa.s并且每分子含有至少2个硅键合的氢原子的有机聚硅氧烷，其量足以固化该组合物; （C）足以固化组合物的量的铂催化剂; 和（D）0.00001至100重量份在25℃下粘度为0.01至10,000Pa.s的有机聚硅氧烷，条件是当有机聚硅氧烷含有芳基时，芳基包含小于1摩尔％或多于40摩尔％的有机聚硅氧烷中总硅结合的有机基团，并且其中有机聚硅氧烷固化以形成在-65℃下的复数模量<= 1×108Pa和10Hz的剪切频率或在-65℃下具有杨氏模量<= 2.9×10 8 Pa的固化的硅氧烷

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