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1. 发明申请

US20070184582A1 Method of flip-chip mounting 有权
标题翻译：倒装芯片安装方法
公开(公告)号：US20070184582A1
公开(公告)日：2007-08-09
申请号：US11435851
申请日：2006-05-18
申请人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
发明人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
IPC分类号： H01L21/00
CPC分类号： H01L24/75 , H01L24/83 , H01L24/90 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75304 , H01L2224/75744 , H01L2224/83139 , H01L2224/8314 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/3511 , H01L2924/00
摘要： A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.
摘要翻译：一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合，基板向凹部弯曲。

2. 发明授权

US07582553B2 Method of bonding flying leads 失效
标题翻译：拼接飞线的方法
公开(公告)号：US07582553B2
公开(公告)日：2009-09-01
申请号：US11359426
申请日：2006-02-23
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： H01L21/44
CPC分类号： H01L21/4853
摘要： The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which act as margins for deformation, in boding faces of the pads, on each of which the flying lead will be bonded, positioning the flying leads to correspond to the pads; and applying supersonic vibrations to a bonding tool so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads.
摘要翻译：接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。该方法包括以下步骤：机械地处理板，以便形成凸起，其作为变形的边缘，在焊盘的焊接面中，每个引导面将被接合，将飞行引线定位成对应于垫子以及对接合工具施加超音速振动以使突起变形和压碎，由此将飞行引线分别接合到焊盘。

3. 发明申请

US20070137026A1 Method of bonding flying leads 失效
标题翻译：拼接飞线的方法
公开(公告)号：US20070137026A1
公开(公告)日：2007-06-21
申请号：US11391362
申请日：2006-03-29
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： B23K20/10
CPC分类号： B23K20/10 , B23K2101/32 , H05K3/26 , H05K3/328 , Y10T29/49027 , Y10T29/4903
摘要： A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which at least one contact member that contacts the flying leads and applies the ultrasonic vibration thereto is rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the at least one contact member rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the at least one contact member to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.
摘要翻译：结合飞行引线的方法在飞行引线和衬底焊盘之间产生可靠的结合，并且可以使用焊接工具有效地结合多个飞行引线和多个衬底焊盘。飞行引线分别与平行设置的多个基板焊盘对准，并且焊接工具对飞行引线施加超声波振动以将相应的基板焊盘和飞行引线接合。使用接合工具进行接合，其中至少一个接触飞行引线并且对其施加超声波振动的接触构件被可旋转地支撑。接合工具沿与所述至少一个接触构件平行布置的与所述飞行导线接触的方向交叉的方向移动，并且所述超声波振动从所述至少一个接触构件施加到所述飞行导致将相应的飞行引线超声波地结合到衬底焊盘。

4. 发明申请

US20070137025A1 Method of bonding flying leads 审中-公开
标题翻译：拼接飞线的方法
公开(公告)号：US20070137025A1
公开(公告)日：2007-06-21
申请号：US11359427
申请日：2006-02-23
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： B23K1/06
CPC分类号： H05K3/361 , G11B5/4846 , H05K3/328 , H05K2201/0397 , H05K2201/10765 , H05K2203/0285 , Y10T29/49027 , Y10T29/4903
摘要： The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: positioning the flying leads to correspond to the pads arranged parallel; and applying supersonic vibrations to a bonding tool so as to respectively bond the flying leads to the pads. And widths of the flying leads are wider than those of the pads, and supersonic vibrations are applied to the bonding tool, which is pressing the flying leads onto the pads, so that the flying leads are respectively supersonic-bonded to the pads.
摘要翻译：接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。该方法包括以下步骤：将飞行引线对准于平行布置的焊盘; 以及将超音速振动施加到接合工具，以将所述飞行引线分别连接到所述焊盘。并且飞行引线的宽度比焊盘的宽度宽，并且超音速振动被施加到将飞行引线压在焊盘上的焊接工具，使得飞行引线分别超音速粘合到焊盘。

5. 发明授权

US07367108B2 Method of bonding flying leads 失效
标题翻译：拼接飞线的方法
公开(公告)号：US07367108B2
公开(公告)日：2008-05-06
申请号：US11391362
申请日：2006-03-29
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： B23K20/10
CPC分类号： B23K20/10 , B23K2101/32 , H05K3/26 , H05K3/328 , Y10T29/49027 , Y10T29/4903
摘要： A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which (at least one contact member) a plurality of contact members that contact(s) the flying leads and apply (applies) the ultrasonic vibration thereto are (is) rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the plurality of contact members (at least one contact member) rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the plurality of contact members (at least one contact member) to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.
摘要翻译：结合飞行引线的方法在飞行引线和衬底焊盘之间产生可靠的结合，并且可以使用焊接工具有效地结合多个飞行引线和多个衬底焊盘。飞行引线分别与平行设置的多个基板焊盘对准，并且焊接工具对飞行引线施加超声波振动以将相应的基板焊盘和飞行引线接合。使用接合工具进行接合，其中（至少一个接触构件）多个接触飞行引线并且施加（施加）超声波振动的接触构件被可旋转地支撑。接合工具沿与多个接触构件（至少一个接触构件）平行布置的飞行导线与飞行导线接触的方向移动，并且从多个接触构件对飞行的接触构件（至少一个接触构件）导致将相应的飞行引线超声波地结合到衬底焊盘。

6. 发明授权

US07670873B2 Method of flip-chip mounting 有权
标题翻译：倒装芯片安装方法
公开(公告)号：US07670873B2
公开(公告)日：2010-03-02
申请号：US11435851
申请日：2006-05-18
申请人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
发明人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
IPC分类号： H01L21/00 , H01L21/44
CPC分类号： H01L24/75 , H01L24/83 , H01L24/90 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75304 , H01L2224/75744 , H01L2224/83139 , H01L2224/8314 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/3511 , H01L2924/00
摘要： A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.
摘要翻译：一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合，基板向凹部弯曲。

7. 发明申请

US20070141825A1 Method of bonding flying leads 失效
标题翻译：拼接飞线的方法
公开(公告)号：US20070141825A1
公开(公告)日：2007-06-21
申请号：US11359426
申请日：2006-02-23
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： H01L21/44
CPC分类号： H01L21/4853
摘要： The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which act as margins for deformation, in boding faces of the pads, on each of which the flying lead will be bonded, positioning the flying leads to correspond to the pads; and applying supersonic vibrations to a bonding tool so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads.
摘要翻译：接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。该方法包括以下步骤：机械地处理板，以便形成凸起，其作为变形的边缘，在焊盘的焊接面中，每个引导面将被接合，将飞行引线定位成对应于垫子以及对接合工具施加超音速振动以使突起变形和压碎，由此将飞行引线分别接合到焊盘。

8. 发明授权

US08381963B2 Compression-bonding apparatus 失效
标题翻译：压接装置
公开(公告)号：US08381963B2
公开(公告)日：2013-02-26
申请号：US12818554
申请日：2010-06-18
申请人： Kimio Nakamura , Yoshiyuki Satoh , Kenji Kobae
发明人： Kimio Nakamura , Yoshiyuki Satoh , Kenji Kobae
IPC分类号： B23K37/04 , B29C65/02
CPC分类号： H01L24/97 , H01L21/563 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75305 , H01L2224/75315 , H01L2224/7598 , H01L2224/81203 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/9211 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.
摘要翻译：压接装置包括支撑台和按压工具。按压工具包括加压台，弹性件和多个接合头。弹性部件由压制台保持。多个接合头包括附接到弹性构件的上表面和面向支撑台的上表面的下表面。

9. 发明申请

US20100327435A1 ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF 审中-公开
标题翻译：电子元器件及其制造方法
公开(公告)号：US20100327435A1
公开(公告)日：2010-12-30
申请号：US12822656
申请日：2010-06-24
申请人： Kimio Nakamura , Takayoshi Matsumura , Yoshiyuki Satoh , Kuniko Ishikawa , Kenji Kobae
发明人： Kimio Nakamura , Takayoshi Matsumura , Yoshiyuki Satoh , Kuniko Ishikawa , Kenji Kobae
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L23/49811 , H01L23/49816 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/812 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/19041 , H01L2924/19043 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads.
摘要翻译：电子部件包括封装基板，多个导电焊盘，绝缘材料和半导体器件。多个导电焊盘设置在封装衬底上。绝缘材料设置在多个导电焊盘之间。绝缘材料包括位于与多个导电焊盘的上表面相同的平面上的顶表面。半导体器件包括对准在多个导电焊盘的相应导电焊盘上的导电凸块。

10. 发明授权

US07416921B2 Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin 有权
标题翻译：使用具有两部分硬化树脂的延迟固化型粘合剂进行倒装芯片安装的方法
公开(公告)号：US07416921B2
公开(公告)日：2008-08-26
申请号：US11066483
申请日：2005-02-28
申请人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Takayoshi Matsumura , Kimio Nakamura
发明人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Takayoshi Matsumura , Kimio Nakamura
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L24/29 , H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75753 , H01L2224/81205 , H01L2224/81232 , H01L2224/81801 , H01L2224/83099 , H01L2224/83102 , H01L2224/83192 , H01L2224/83874 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01327 , H01L2924/07802 , H01L2924/19043 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip 52 includes a step of providing a hardening trigger that is not heat to insulating adhesive 51 either before the semiconductor chip 52 is mounted on the substrate 50 or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate 50 by pressure welding or metal combining while hardening of the insulating adhesive 51 is progressing due to provision of the hardening trigger.
摘要翻译：半导体芯片的倒装芯片的安装方法可以在常温下进行接合，提高接合的位置精度。半导体芯片52的倒装芯片接合的方法包括在将半导体芯片52安装在基板50上之前或在接合期间提供不加热以绝缘粘合剂51的硬化触发的步骤; 以及通过压力焊接或金属组合将半导体芯片的凸点接合到基板50的焊盘的步骤，同时绝缘粘合剂51的硬化由于设置硬化触发而正在进行。

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