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1. 发明申请

US20100327435A1 ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF 审中-公开
标题翻译：电子元器件及其制造方法
公开(公告)号：US20100327435A1
公开(公告)日：2010-12-30
申请号：US12822656
申请日：2010-06-24
申请人： Kimio Nakamura , Takayoshi Matsumura , Yoshiyuki Satoh , Kuniko Ishikawa , Kenji Kobae
发明人： Kimio Nakamura , Takayoshi Matsumura , Yoshiyuki Satoh , Kuniko Ishikawa , Kenji Kobae
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L23/49811 , H01L23/49816 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/812 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/19041 , H01L2924/19043 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads.
摘要翻译：电子部件包括封装基板，多个导电焊盘，绝缘材料和半导体器件。多个导电焊盘设置在封装衬底上。绝缘材料设置在多个导电焊盘之间。绝缘材料包括位于与多个导电焊盘的上表面相同的平面上的顶表面。半导体器件包括对准在多个导电焊盘的相应导电焊盘上的导电凸块。

2. 发明申请

US20090243006A1 ELECTRONIC PART WITH AFFIXED MEMS 有权
标题翻译：带有AFF的电子部件
公开(公告)号：US20090243006A1
公开(公告)日：2009-10-01
申请号：US12402881
申请日：2009-03-12
申请人： Tetsuya TAKAHASHI , Kenji Kobae , Shuichi Takeuchi , Yoshiyuki Satoh , Hidehiko Kira , Takayoshi Matsumura
发明人： Tetsuya TAKAHASHI , Kenji Kobae , Shuichi Takeuchi , Yoshiyuki Satoh , Hidehiko Kira , Takayoshi Matsumura
IPC分类号： H01L29/84 , H01L23/12 , H01L21/50
CPC分类号： B81B3/0078 , B81B2201/042 , B81B2203/0109 , B81B2203/0307 , B81C1/00126 , H01L24/14 , H01L2224/1134 , H01L2224/1403 , H01L2224/73204 , H01L2924/07811 , H01L2924/1461 , H01L2924/00
摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.
摘要翻译：根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

3. 发明授权

US08169075B2 Electronic part with affixed MEMS 有权
标题翻译：电子部件附有MEMS
公开(公告)号：US08169075B2
公开(公告)日：2012-05-01
申请号：US12402881
申请日：2009-03-12
申请人： Tetsuya Takahashi , Kenji Kobae , Shuichi Takeuchi , Yoshiyuki Satoh , Hidehiko Kira , Takayoshi Matsumura
发明人： Tetsuya Takahashi , Kenji Kobae , Shuichi Takeuchi , Yoshiyuki Satoh , Hidehiko Kira , Takayoshi Matsumura
IPC分类号： H01L29/40
CPC分类号： B81B3/0078 , B81B2201/042 , B81B2203/0109 , B81B2203/0307 , B81C1/00126 , H01L24/14 , H01L2224/1134 , H01L2224/1403 , H01L2224/73204 , H01L2924/07811 , H01L2924/1461 , H01L2924/00
摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.
摘要翻译：根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

4. 发明申请

US20100327043A1 COMPRESSION-BONDING APPARATUS 失效
标题翻译：压接装置
公开(公告)号：US20100327043A1
公开(公告)日：2010-12-30
申请号：US12818554
申请日：2010-06-18
申请人： Kimio NAKAMURA , Yoshiyuki Satoh , Kenji Kobae
发明人： Kimio NAKAMURA , Yoshiyuki Satoh , Kenji Kobae
IPC分类号： B23K37/00
CPC分类号： H01L24/97 , H01L21/563 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75305 , H01L2224/75315 , H01L2224/7598 , H01L2224/81203 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/9211 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.
摘要翻译：压接装置包括支撑台和按压工具。按压工具包括加压台，弹性件和多个接合头。弹性部件由压制台保持。多个接合头包括附接到弹性构件的上表面和面向支撑台的上表面的下表面。

5. 发明授权

US08381963B2 Compression-bonding apparatus 失效
标题翻译：压接装置
公开(公告)号：US08381963B2
公开(公告)日：2013-02-26
申请号：US12818554
申请日：2010-06-18
申请人： Kimio Nakamura , Yoshiyuki Satoh , Kenji Kobae
发明人： Kimio Nakamura , Yoshiyuki Satoh , Kenji Kobae
IPC分类号： B23K37/04 , B29C65/02
CPC分类号： H01L24/97 , H01L21/563 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75305 , H01L2224/75315 , H01L2224/7598 , H01L2224/81203 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/9211 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.
摘要翻译：压接装置包括支撑台和按压工具。按压工具包括加压台，弹性件和多个接合头。弹性部件由压制台保持。多个接合头包括附接到弹性构件的上表面和面向支撑台的上表面的下表面。

6. 发明授权

US07687314B2 Electronic apparatus manufacturing method 有权
标题翻译：电子设备制造方法
公开(公告)号：US07687314B2
公开(公告)日：2010-03-30
申请号：US12330302
申请日：2008-12-08
申请人： Shuichi Takeuchi , Hidehiko Kira , Kenji Kobae , Yoshiyuki Satoh , Tetsuya Takahashi
发明人： Shuichi Takeuchi , Hidehiko Kira , Kenji Kobae , Yoshiyuki Satoh , Tetsuya Takahashi
IPC分类号： H01L21/50
CPC分类号： H05K3/305 , H01L21/563 , H01L24/33 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/13144 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/331 , H01L2224/33505 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81204 , H01L2224/814 , H01L2224/81815 , H01L2224/8309 , H01L2224/83092 , H01L2224/83102 , H01L2224/83192 , H01L2224/83194 , H01L2224/83204 , H01L2224/8349 , H01L2224/83862 , H01L2224/83986 , H01L2224/92 , H01L2224/92125 , H01L2224/92143 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H05K3/3436 , H05K3/3494 , H05K2201/10674 , H05K2201/10977 , H05K2203/0278 , H05K2203/1476 , Y02P70/613 , Y10T29/49144 , H01L2924/00014 , H01L2924/014 , H01L2224/83 , H01L2224/81 , H01L2924/00 , H01L2924/3512
摘要： An electronic apparatus manufacturing method comprises applying a first adhesive agent to a mounting portion, a first heating, in such a way that connection pads and bumps, come into contact, by pressing a heating head against a non-mounting surface of the electronic component, heating the electronic component, hardening the first adhesive agent, affixing the mounting substrate and electronic component, filling a space between the mounting substrate and the electronic component with a second adhesive agent under reduced pressure, and a second heating step of, from being under reduced pressure to being under atmospheric pressure, by pressing the heating head against the non-mounting surface of the electronic component, heating the electronic component, as well as hardening the second adhesive agent, melting the connection pads, and joining the connection pads and the bumps.
摘要翻译：一种电子设备制造方法，包括：通过将加热头压靠在电子部件的非安装表面上，将第一粘合剂施加到安装部分，以使得连接焊盘和凸块接触的方式进行第一加热，加热电子部件，硬化第一粘合剂，固定安装基板和电子部件，在减压下用第二粘合剂填充安装基板和电子部件之间的空间，以及从减小的第二加热步骤通过将加热头压靠在电子部件的非安装表面上，加热电子部件，以及使第二粘合剂硬化，熔化连接焊盘，并将连接焊盘和凸块。

7. 发明申请

US20090170245A1 ELECTRONIC APPARATUS MANUFACTURING METHOD 有权
标题翻译：电子装置制造方法
公开(公告)号：US20090170245A1
公开(公告)日：2009-07-02
申请号：US12330302
申请日：2008-12-08
申请人： Shuichi TAKEUCHI , Hidehiko Kira , Kenji Kobae , Yoshiyuki Satoh , Tetsuya Takahashi
发明人： Shuichi TAKEUCHI , Hidehiko Kira , Kenji Kobae , Yoshiyuki Satoh , Tetsuya Takahashi
IPC分类号： H01L21/50 , H05K3/32
CPC分类号： H05K3/305 , H01L21/563 , H01L24/33 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/13144 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/331 , H01L2224/33505 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81204 , H01L2224/814 , H01L2224/81815 , H01L2224/8309 , H01L2224/83092 , H01L2224/83102 , H01L2224/83192 , H01L2224/83194 , H01L2224/83204 , H01L2224/8349 , H01L2224/83862 , H01L2224/83986 , H01L2224/92 , H01L2224/92125 , H01L2224/92143 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H05K3/3436 , H05K3/3494 , H05K2201/10674 , H05K2201/10977 , H05K2203/0278 , H05K2203/1476 , Y02P70/613 , Y10T29/49144 , H01L2924/00014 , H01L2924/014 , H01L2224/83 , H01L2224/81 , H01L2924/00 , H01L2924/3512
摘要： An electronic apparatus manufacturing method comprises applying a first adhesive agent to a mounting portion, a first heating, in such a way that connection pads and bumps, come into contact, by pressing a heating head against a non-mounting surface of the electronic component, heating the electronic component, hardening the first adhesive agent, affixing the mounting substrate and electronic component, filling a space between the mounting substrate and the electronic component with a second adhesive agent under reduced pressure, and a second heating step of,, from being under reduced pressure to being under atmospheric pressure, by pressing the heating head against the non-mounting surface of the electronic component, heating the electronic component, as well as hardening the second adhesive agent, melting the connection pads, and joining the connection pads and the bumps.
摘要翻译：一种电子设备制造方法，包括：通过将加热头压靠在电子部件的非安装表面上，将第一粘合剂施加到安装部分，以使得连接焊盘和凸块接触的方式进行第一加热，加热电子部件，硬化第一粘合剂，固定安装基板和电子部件，在减压下用第二粘合剂填充安装基板和电子部件之间的空间，以及第二加热步骤，通过将加热头压靠在电子部件的非安装表面上，加热电子部件，以及使第二粘合剂硬化，熔化连接焊盘并将连接焊盘和颠簸

8. 发明授权

US5623580A Planning method and system 失效
标题翻译：规划方法和制度
公开(公告)号：US5623580A
公开(公告)日：1997-04-22
申请号：US274016
申请日：1994-07-12
申请人： Haruki Inoue , Hiroyuki Ichikawa , Hideo Yoshida , Yasuhiro Terada , Noboru Abe , Yoshiyuki Satoh , Masakazu Yahiro , Akemi Ohtsuki
发明人： Haruki Inoue , Hiroyuki Ichikawa , Hideo Yoshida , Yasuhiro Terada , Noboru Abe , Yoshiyuki Satoh , Masakazu Yahiro , Akemi Ohtsuki
IPC分类号： G06F9/44 , B65G61/00 , G06F19/00 , G06N5/04 , G06Q10/00 , G06Q10/04 , G06Q10/06 , G06Q50/00 , G06Q90/00 , G06F15/18
CPC分类号： G06Q10/06
摘要： A planning system for quickly forming the optimum plan for a given planning problem, includes a setting unit for accepting the given planning problem; an optimization unit for creating an objective function which expresses an item intended to be minimized or maximized in the planning problem, and for executing a process which minimizes or maximizes a value of the created objective function; a storage unit for storing therein, at least, constant values which are required for the optimizing process; and a display unit for displaying a processed result of the optimization unit. The optimization unit performs a first function of calculating a difference value between the values of the objective function assumed in a last formed plan and a newly formed plan, and performs a second function of comparing the difference value of the objective function with the constant value set in the storage unit, and then substituting the last formed plan by the newly formed plan and setting the latter as a candidate for an optimum plan, on condition that the difference value of the objective function is smaller than the constant value.
摘要翻译：一个规划系统能够快速形成一个给定的规划问题的最优方案，其中包括一个用于接受给定规划问题的设置单元; 用于创建表达在计划问题中被最小化或最大化的项目的目标函数的优化单元，以及用于执行最小化或最大化所创建的目标函数的值的过程; 存储单元，用于至少存储优化处理所需的常数值; 以及显示单元，用于显示优化单元的处理结果。优化单元执行计算最终形成的计划中假设的目标函数的值与新形成的计划之间的差值的第一函数，并且执行将目标函数的差值与常数值集合进行比较的第二函数在存储单元中，然后通过新形成的计划代替最后形成的计划，并将后者设置为最佳计划的候选，条件是目标函数的差值小于常数值。

9. 发明授权

US5377308A Method and system for process control with complex inference mechanism using qualitative and quantitative reasoning 失效
标题翻译：使用定性和定量推理的复杂推理机制的过程控制方法和系统
公开(公告)号：US5377308A
公开(公告)日：1994-12-27
申请号：US013953
申请日：1993-02-05
申请人： Haruki Inoue , Motohisa Funabashi , Masakazu Yahiro , Yoshiyuki Satoh
发明人： Haruki Inoue , Motohisa Funabashi , Masakazu Yahiro , Yoshiyuki Satoh
IPC分类号： G05B13/02 , G06N5/04 , G06N7/04 , G06F15/00 , G06F9/44
CPC分类号： G06N7/04 , G05B13/0295 , G06N5/048 , Y10S706/90 , Y10S706/906 , Y10S706/908 , Y10S706/91
摘要： A process control system for controlling a process exhibiting both linear behavior and non-linear behavior with a plurality of control quantities has a knowledge base storing therein universal facts, production rules including expert's empirical rules, meta rules describing flows of inferences, algorithm methods by mathematical expressions and membership functions referenced in fuzzy inference and a complex inference mechanism. The complex inference mechanism is composed of a complex fuzzy mechanism for inferring directly predicted values on a multi-dimensional space generated by a plurality of elements for evaluation and predicted control objectives evaluated previously with fuzzy quantities, a predicting fuzzy mechanism having the input supplied with the predicted values for determining arithmetically correlation to the membership functions determined previously with the fuzzy quantities and a satisfaction grade obtained by imparting weight to the correlation for each of the control objectives to thereby determine such a combination of the control quantities for control effectors to vary the operation states thereof from the current operation states that the satisfaction grade becomes maximum, and a main inference mechanism having the input supplied with process data to thereby compare selectively the process data with the knowledge stored in the knowledge base for thereby making decision of the process behavior through a forward fuzzy inference with the aid of the production rules based on the empirical knowledge and manage the whole process control system including the complex fuzzy inference mechanism, the predicting fuzzy inference mechanism and the knowledge base. The system can be advantageously employed for intra-tunnel ventilation control and other processes exhibiting both linear and non-linear behaviors.
摘要翻译：用于控制具有多个控制量的线性行为和非线性行为的过程的过程控制系统具有在其中存储通用事实的知识库，包括专家经验规则的生产规则，描述推理流的元规则，通过数学的算法方法模糊推理中引用的表达式和隶属函数以及复杂的推理机制。复杂推理机制由复杂的模糊机制组成，用于推断由多个元素产生的多维空间上的直接预测值，用于评估以前用模糊量估计的预测控制目标，预测模糊机制具有提供的输入用于确定与先前用模糊量确定的隶属函数的算术相关性的预测值，以及通过对每个控制目标赋予相关性而获得的满足度等级，从而确定控制效果器的控制量的组合以改变操作来自当前操作的状态表明满意等级变为最大，并且具有输入的主推理机制提供过程数据，从而选择性地比较过程数据与知识库中存储的知识，从而进行处理行为的决定借鉴基于实证知识的生产规则，通过前向模糊推理，对包括复杂模糊推理机制，预测模糊推理机制和知识库的整个过程控制系统进行管理。该系统可以有利地用于隧道内通气控制和呈现线性和非线性行为的其它过程。

10. 发明授权

US5251285A Method and system for process control with complex inference mechanism using qualitative and quantitative reasoning 失效
标题翻译：使用定性和定量推理的复杂推理机制的过程控制方法和系统
公开(公告)号：US5251285A
公开(公告)日：1993-10-05
申请号：US712104
申请日：1991-06-07
申请人： Haruki Inoue , Motohisa Funabashi , Masakazu Yahiro , Yoshiyuki Satoh
发明人： Haruki Inoue , Motohisa Funabashi , Masakazu Yahiro , Yoshiyuki Satoh
IPC分类号： G05B13/02 , G06N5/04 , G06N7/04 , G06F15/00
CPC分类号： G06N7/04 , G05B13/0295 , G06N5/048 , Y10S706/90 , Y10S706/906 , Y10S706/908 , Y10S706/91
摘要： A prediction control of a process containing a non-linear behavior is effected by predicting a transition of process quantities (control quantities) of an object to be controlled a predetermined time period after the current time to provide predicted values and by determining manipulation quantities of at least a control effector in accordance with a difference between the predicted values and predetermined target values of the controlled object. A quantitative operation is carried out arithmetically identifying a process as a linear behavior, and a fuzzy inference or qualitative operation, including a fuzzy rule based on empirical knowledge, is carried out for simulating a process, wherein for input process information and current manipulation quantities to be maintained, both operations parallelly determine predicted values of control quantities. A process behavior determination is arithmetically carried out to determine whether the process linearly behaves (i.e. the normal state or the state dominant to statistic distribution) or not (i.e. the extreme transition state such as a transient response, or an indeterminate state) from the specified process information on the basis of a process behavior determination rule. As a result, a predicted value acquired by the quantitative operation is selected in response to a determination of a linear behavior, and a predicted value acquired by the fuzzy inference operation is selected in response to a determination of a non-linear behavior.
摘要翻译：包含非线性行为的处理的预测控制通过预测在当前时间之后的预定时间段内要控制的对象的处理量（控制量）的转变来提供预测值，并且通过确定在根据控制对象的预测值和预定目标值之间的差异，至少控制效应器。进行定量操作，将过程作为线性行为进行算术识别，进行模糊推理或定性操作，包括基于经验知识的模糊规则，用于模拟过程，其中对于输入过程信息和当前操作量维持两个操作并行确定控制量的预测值。算术过程执行过程行为确定，以确定过程是否从指定的过程线性表现（即，统计分布的正常状态或统计分布的统计状态）（即极端过渡状态，如瞬态响应或不确定状态）基于过程行为确定规则处理信息。结果，响应于线性行为的确定来选择通过定量操作获取的预测值，并且响应于非线性行为的确定来选择通过模糊推理操作获取的预测值。

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