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1. 发明申请

US20180198057A1 Method of Manufacturing Piezoelectric Microactuators Having Wrap-Around Electrodes 审中-公开
公开(公告)号：US20180198057A1
公开(公告)日：2018-07-12
申请号：US15912042
申请日：2018-03-05
申请人： Magnecomp Corporation
发明人： Peter Hahn , Kuen Chee Ee , Long Zhang
IPC分类号： H01L41/297 , H01L41/33 , B32B37/12 , G11B5/48 , B32B38/18
CPC分类号： G11B5/483 , B29C2793/0027 , B29C2793/0036 , B32B37/04 , B32B37/1207 , B32B37/1292 , B32B38/0036 , B32B38/10 , B32B38/185 , B32B2038/0076 , G11B5/48 , G11B5/4806 , G11B5/4846 , G11B5/4853 , G11B5/4873 , G11B5/5552 , G11B5/56 , G11B21/10 , G11B21/106 , H01L41/297 , H01L41/33 , Y10T156/10 , Y10T156/1052
摘要： A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.

2. 发明授权

US09972347B1 Method for head stack assembly rework 有权
公开(公告)号：US09972347B1
公开(公告)日：2018-05-15
申请号：US14628111
申请日：2015-02-20
申请人： Western Digital Technologies, Inc.
发明人： Tzong-Shii Pan , Cliff Zhang , Maribel Castro
IPC分类号： G11B5/48 , G11B5/29 , G11B5/84
CPC分类号： G11B5/4813 , G11B5/295 , G11B5/48 , G11B5/4833 , G11B5/4846 , G11B5/4853 , G11B5/486 , G11B5/84 , Y10T29/49023 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903
摘要： A method for head stack assembly (HSA) rework is disclosed. A first head gimbal assembly (HGA) includes a first suspension attached to an arm of the HSA, and a first flexure tail that terminates in a first bonding region that is bonded to a flexible printed circuit (FPC) of the HSA. The first HGA is removed by cutting the first bonding region from a remainder of the first flexure tail and detaching the first suspension from the arm. The first bonding region of the first flexure tail is left bonded to the FPC. A replacement HGA includes a replacement suspension and a replacement flexure tail that terminates in a second bonding region. The replacement HGA is installed on the HSA by attaching the replacement suspension to the arm, overlaying the second bonding region on the first bonding region, and bonding the second bonding region to the first bonding region.

3. 发明授权

US09633680B2 Head suspension having a flexure tail with a covered conductive layer and structural layer bond pads 有权
公开(公告)号：US09633680B2
公开(公告)日：2017-04-25
申请号：US14492266
申请日：2014-09-22
申请人： Western Digital Technologies, Inc.
发明人： Tzong-Shii Pan
IPC分类号： B23P19/00 , H05K13/04 , G11B5/48
CPC分类号： G11B5/4846 , G11B5/4826 , G11B5/4833 , G11B5/4853 , G11B5/486 , Y10T29/49057 , Y10T29/53261
摘要： A head gimbal assembly has a laminate flexure that includes a metallic conductive layer that includes a plurality of electrically conductive traces that are elongated and narrow and electrically connected to the read head, and a metallic structural layer that is stiffer than the conductive layer. A first dielectric layer is disposed between the structural layer and the conductive layer. A second dielectric layer substantially covers the conductive layer in a flexure tail bonding region that overlaps a flexible printed circuit (FPC). The structural layer includes a plurality of flexure bond pads that are aligned with, facing, and bonded to corresponding FPC bond pads. The flexure bond pads in the structural layer are electrically connected to the electrically conductive traces in the conductive layer by vias through the first dielectric layer. In certain embodiments, the flexure tail is folded upon itself in the flexure tail bonding region.

4. 发明授权

US09454982B2 Wiring structure of head suspension having a stacked interleaved part and method of manufacturing the same 有权
标题翻译：具有层叠交错部分的头部悬挂的接线结构及其制造方法
公开(公告)号：US09454982B2
公开(公告)日：2016-09-27
申请号：US13660477
申请日：2012-10-25
申请人： NHK SPRING CO., LTD.
发明人： Hajime Arai
IPC分类号： H05K1/02 , H05K1/05 , H05K1/18 , G11B5/48
CPC分类号： G11B5/4846 , G11B5/1272 , G11B5/4826 , G11B5/484 , G11B5/486 , H05K1/0245 , H05K1/0277 , H05K1/0298 , H05K1/056 , H05K1/18 , H05K1/189 , H05K3/0011 , H05K3/18 , H05K2201/05 , H05K2201/09245 , H05K2201/097 , H05K2201/2009 , Y10T29/49194
摘要： A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, comprises write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities. The wiring structure further comprises a stacked interleaved part includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities.
摘要翻译：包括支撑头部并附接到负载束施加负载到头上的弯曲部的头部悬架的布线结构包括形成在挠曲件上并连接到头部上的写入布线和读取布线，每个布线具有相反极性的导线。所述布线结构还包括层叠的交错部分，其包括电连接到所述写入布线的相应导线的部分，所述片段通过电绝缘层堆叠在并面对所述线，使得所述相对的线和片段具有相反的极性。

5. 发明申请

US20160217814A1 DISK DRIVE HEAD SUSPENSION TAIL WITH GROUND PAD OUTSIDE OF BONDING REGION 审中-公开
标题翻译：磁带驱动头悬挂尾部与接合区域外的接地垫
公开(公告)号：US20160217814A1
公开(公告)日：2016-07-28
申请号：US15090880
申请日：2016-04-05
申请人： Western Digital Technologies, Inc.
发明人： YIH-JEN DENNIS CHEN , YANNING LIU , KIA MOH TEO
IPC分类号： G11B5/48
CPC分类号： G11B5/4813 , G11B5/4826 , G11B5/4833 , G11B5/484 , G11B5/4846 , G11B5/4853 , G11B5/486 , Y10T29/49027
摘要： A head gimbal assembly for a disk drive includes a flexure tail terminal region having flexure bond pads in electrical communication with the head. Each of the flexure bond pads is aligned with one of a plurality of flexible printed circuit (FPC) bond pads. An anisotropic conductive film is disposed between the FPC and the flexure tail terminal region. The flexure tail terminal region overlaps the anisotropic conductive film in a bonding area. Each of the flexure bond pads is bonded to one of the plurality of FPC bond pads by the anisotropic conductive film in a bonding area. A conductive layer of the flexure tail terminal region includes an exposed conductive ground pad that is disposed outside of the bonding area, and/or disposed outside of an application area of a thermode tool that is pressed against the flexure tail terminal region during the bonding process.
摘要翻译：用于盘驱动器的头万向架组件包括具有与头部电连通的挠曲接合垫的弯曲尾端区域。每个挠曲接合垫与多个柔性印刷电路（FPC）接合焊盘中的一个对准。各向异性导电膜设置在FPC和挠曲尾端子区域之间。弯曲尾端区域在粘合区域中与各向异性导电膜重叠。每个挠性接合焊盘通过粘合区域中的各向异性导电膜结合到多个FPC接合焊盘中的一个。弯曲尾端区域的导电层包括暴露的导电接地焊盘，其设置在接合区域的外部，和/或设置在接合工艺期间被压靠在弯曲尾端子区域上的热电偶工具的施加区域的外部。

6. 发明授权

US09390739B1 Piezoelectric microactuator with restraining layer for control of bending 有权
标题翻译：用于控制弯曲的抑制层的压电微致动器
公开(公告)号：US09390739B1
公开(公告)日：2016-07-12
申请号：US14800645
申请日：2015-07-15
申请人： Magnecomp Corporation
发明人： Long Zhang , Peter Hahn , Kuen Chee Ee
IPC分类号： G11B5/48
CPC分类号： G11B5/4873 , G11B5/48 , G11B5/4806 , G11B5/483 , G11B5/4846 , G11B5/5552 , H01L41/0986 , H02N2/02
摘要： A PZT microactuator such as for use in a hard disk drive has a restraining layer bonded on its side that is opposite the side on which the PZT will be mounted. The restraining layer comprises a stiff and resilient material such as stainless steel. The restraining layer can cover all of the top of the PZT, or most of the top of the PZT with an electrical connection being made to the PZT where it is not covered by the restraining layer. The restraining layer reduces bending of the PZT as mounted and hence increases effective stroke length, or reverses the sign of the bending which increases the effective stroke length of the PZT even further.
摘要翻译：用于硬盘驱动器的PZT微型致动器具有与其安装PZT的一侧相对的侧面上的限制层。约束层包括刚性和弹性材料，例如不锈钢。限制层可以覆盖PZT的所有顶部，或者PZT的顶部的大部分，其中PZT的电连接被制成不被约束层覆盖的PZT。限制层减少了PZT的安装弯曲，从而增加了有效的行程长度，或者反转了弯曲的符号，这进一步提高了PZT的有效行程长度。

7. 发明授权

US09330693B1 Suspension circuit trace employing stacked traces and windowed stainless steel layer 有权
标题翻译：悬挂电路迹线采用堆叠轨迹和窗口不锈钢层
公开(公告)号：US09330693B1
公开(公告)日：2016-05-03
申请号：US14491323
申请日：2014-09-19
申请人： Magnecomp Corporation
发明人： Peter Hahn , Benjapa Tanampee , Jatuporn Nakarpha , Christopher G. Dunn
IPC分类号： G11B5/48
CPC分类号： G11B5/48 , G11B5/484 , G11B5/4846 , G11B5/4853 , G11B5/486
摘要： An electrical circuit for a disk drive suspension has a first signal trace above a grounded support layer which is typically stainless steel, and a second signal trace below the support layer, the two signal traces typically being opposite polarities of a differential signal pair. The support layer between the two signal traces is windowed, and the two traces are physically separated by a distance that equals the nominal thickness of the support layer plus the thicknesses of the top and bottom dielectric layers that separate the signal traces from the support layer. The physical separation combined with the windowing reduces the impedance and increases the bandwidth of the differential pair. The impedance can be controlled by the percentage of windowing in the support layer.
摘要翻译：用于盘驱动器悬架的电路具有通常不锈钢的接地支撑层上方的第一信号迹线，以及在支撑层下方的第二信号迹线，两个信号迹线通常与差分信号对的极性相反。两个信号迹线之间的支撑层被窗口化，并且两条迹线在物理上分开距离，该距离等于支撑层的标称厚度加上将信号迹线与支撑层分开的顶部和底部介电层的厚度。与窗口结合的物理分离降低了阻抗并增加了差分对的带宽。阻抗可以通过支撑层中窗口的百分比来控制。

8. 发明申请

US20160086625A1 CIRCUIT CONNECTION PAD DESIGN FOR IMPROVED ELECTRICAL ROBUSTNESS USING CONDUCTIVE EPOXY 有权
标题翻译：使用导电环氧树脂改善电气稳定性的电路连接垫设计
公开(公告)号：US20160086625A1
公开(公告)日：2016-03-24
申请号：US14860921
申请日：2015-09-22
申请人： Seagate Technology LLC
发明人： Gary Berscheit , Jackson Brandts
IPC分类号： G11B5/48
CPC分类号： G11B5/4846 , G11B5/483 , G11B5/4833 , G11B5/486
摘要： Disk drives including head suspensions within dual stage actuation systems have improved electrical connectivity between electrical connection pads from flexible circuits as are applied to head suspension assemblies with piezoelectric microactuators as also provided to head suspension assemblies. A more robust electrical connection provides for better control of microactuator actuation for fine movements and positioning of magnetic read/write heads relative to disk data tracks as part of dual stage actuated suspension systems. Electrical connections utilize conductive epoxy for physically and electrically connecting electrically conductive trace connection pads with one or more surfaces of piezoelectric microactuators. Electrical connections include better conductivity by utilizing plural surface portions of electrical connection pads. The result is a more robust and predictable performance for high data resolution within disk drives.
摘要翻译：包括双级驱动系统中的磁头悬架的磁盘驱动器具有改善的电连接性，其中柔性电路的电连接焊盘与应用于具有压电微致动器的磁头悬架组件一样，也提供给磁头悬架组件。更坚固的电气连接提供了更好的控制微致动器致动，用于精细移动和磁读/写头相对于作为双级致动悬架系统的一部分的磁盘数据轨道的定位。电气连接使用导电环氧树脂来将导电迹线连接焊盘与压电微致动器的一个或多个表面物理和电连接。电连接通过利用电连接焊盘的多个表面部分包括更好的导电性。结果是在磁盘驱动器中高数据分辨率的更强大和可预测的性能。

9. 发明授权

US09286922B1 Adaptive tacking of head gimbal assembly long tail and HSA arm slot 有权
标题翻译：头部万向节组件长尾和HSA臂槽的自适应固定
公开(公告)号：US09286922B1
公开(公告)日：2016-03-15
申请号：US14752646
申请日：2015-06-26
申请人： Western Digital Technologies, Inc.
发明人： Fernando A. Magsombol , Arnon Amornmannun , Saravut Ashametra , Nitipat Songwiroj
IPC分类号： G11B5/48 , B32B37/18 , B32B37/12 , B32B41/00 , G01B5/14
CPC分类号： G11B5/4826 , F16B11/006 , G01B5/14 , G11B5/4846 , G11B5/486
摘要： A device may comprise a machine vision system in a first zone of the device. The machine vision system may be configured to provide measurements of gaps between selected portions of a head gimbal assembly (HGA) and selected portions of arms of a head stack assembly (HSA) of a data storage device. A first adhesive tacking system may be provided in a second zone of the device, and configured to sequentially apply adhesive to the gaps based upon the measurements of the gaps provided by the machine vision system. A transport mechanism may be configured to sequentially carry the HSA of the data storage device to the first zone to enable the machine vision system to measure the gaps and from the first zone to the second zone of the device to enable the first adhesive tacking system to apply the adhesive to the gaps.
摘要翻译：设备可以包括设备的第一区域中的机器视觉系统。机器视觉系统可以被配置为提供头部万向节组件（HGA）的选定部分与数据存储设备的磁头堆叠组件（HSA）的臂的选定部分之间的间隙的测量。第一粘合剂粘合系统可以设置在装置的第二区域中，并且被配置为基于由机器视觉系统提供的间隙的测量顺序地将粘合剂施加到间隙。传送机构可以被配置为将数据存储设备的HSA顺序地携带到第一区域，以使机器视觉系统能够测量间隙，并且从设备的第一区域到第二区域，以使第一粘合剂粘合系统将粘合剂涂抹到间隙上。

10. 发明申请

US20150356986A1 HEAD SUSPENSION HAVING A FLEXURE TAIL WITH A COVERED CONDUCTIVE LAYER AND STRUCTURAL LAYER BOND PADS 有权
标题翻译：具有覆盖导电层和结构层粘结垫的弯曲尾部的头枕
公开(公告)号：US20150356986A1
公开(公告)日：2015-12-10
申请号：US14492266
申请日：2014-09-22
申请人： Western Digital Technologies, Inc.
发明人： TZONG-SHII PAN
IPC分类号： G11B5/48
CPC分类号： G11B5/4846 , G11B5/4826 , G11B5/4833 , G11B5/4853 , G11B5/486 , Y10T29/49057 , Y10T29/53261
摘要： A head gimbal assembly has a laminate flexure that includes a metallic conductive layer that includes a plurality of electrically conductive traces that are elongated and narrow and electrically connected to the read head, and a metallic structural layer that is stiffer than the conductive layer. A first dielectric layer is disposed between the structural layer and the conductive layer. A second dielectric layer substantially covers the conductive layer in a flexure tail bonding region that overlaps a flexible printed circuit (FPC). The structural layer includes a plurality of flexure bond pads that are aligned with, facing, and bonded to corresponding FPC bond pads. The flexure bond pads in the structural layer are electrically connected to the electrically conductive traces in the conductive layer by vias through the first dielectric layer. In certain embodiments, the flexure tail is folded upon itself in the flexure tail bonding region.
摘要翻译：头万向架组件具有层压板挠曲，其包括金属导电层，该金属导电层包括细长且窄且电连接到读头的多个导电迹线，以及比导电层更硬的金属结构层。第一介电层设置在结构层和导电层之间。第二电介质层基本上覆盖与柔性印刷电路（FPC）重叠的挠曲尾部结合区域中的导电层。结构层包括与相应的FPC接合焊盘对准，面对并结合的多个挠曲接合焊盘。结构层中的挠曲接合焊盘通过通过第一介电层的通孔与导电层中的导电迹线电连接。在某些实施例中，弯曲尾部在弯曲尾部接合区域中自身折叠。

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