会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Intermediate transfer material, and an image forming method using it
    • 中间转印材料,以及使用它的成像方法
    • US5521037A
    • 1996-05-28
    • US307787
    • 1994-11-30
    • Kimikazu NagaseTakashi TairaSachio SuzukiHisayoshi Yamada
    • Kimikazu NagaseTakashi TairaSachio SuzukiHisayoshi Yamada
    • G03G7/00G03G15/16G03G13/16
    • G03G7/0046G03G15/162G03G7/0053G03G7/008
    • The present invention relates to an intermediate transfer material, used for an image forming method of developing an electrostatic latent image on an electrostatic latent image carrier utilizing a liquid toner, electrostatically transferring the image visualized by development onto an intermediate transfer material, and re-transferring visible image from the intermediate transfer material onto final transfer objects, utilizing as the intermediate transfer material at least a silicone rubber layer, an adhesive layer and a conductive fluorine rubber layer in this order from the outer surface side thereof.The intermediate transfer material of the present invention is excellent in durability and transferability, and so the image forming method using said intermediate transfer material can provide a high quality image at high reproducibility.
    • PCT No.PCT / JP94 / 00125 Sec。 371日期1994年11月30日 102(e)1994年11月30日日期PCT 1994年1月28日PCT PCT。 公开号WO94 / 18608 日期:1994年8月18日。本发明涉及一种中间转印材料,其用于使用液体调色剂在静电潜像载体上显影静电潜像的图像形成方法,将通过显影可视化的图像静电转印到中间体 转印材料,并将可见图像从中间转印材料再转印到最终转印体上,从其外表面侧依次使用至少一种硅橡胶层,粘合剂层和导电氟橡胶层作为中间转印材料 。 本发明的中间转印材料的耐久性和转印性优异,因此使用所述中间转印材料的图像形成方法可以以高再现性提供高质量的图像。
    • 3. 发明授权
    • Semiconductor device
    • 半导体器件
    • US6081468A
    • 2000-06-27
    • US353856
    • 1999-07-15
    • Takashi TairaKimimasa Imai
    • Takashi TairaKimimasa Imai
    • G11C11/409G11C7/12G11C11/401G11C11/407G11C11/4074G11C11/4094G11C7/00G11C8/00
    • G11C11/4074G11C11/4094G11C7/12
    • To suppress the power-on current flowing when power is tuned on in the circuit which feeds precharging current to the bit lines of the banks in a synchronous DRAM comprising a multi-bank structure. The device comprises a plurality of bank circuits BKi which are all of the same structure, wherein the bit line precharging power supply lines which the respective bank circuits have are connected in common, a first precharging power supply circuit which has its output node connected to the precharging power supply line and starts its precharging current feed operation when the power supply in the DRAM chip is turned on, and a second precharging power supply circuit which has its output node connected to the precharging power supply line and starts its precharging current feed operation after the bit line has been raised to a predetermined potential by the precharging current of the first precharging power supply circuit.
    • 为了抑制在包括多存储体结构的同步DRAM中将预充电电流馈送到存储体的位线的电路中调谐电源时的通电电流。 该装置包括具有相同结构的多个组电路BKi,其中各个组电路具有共同连接的位线预充电电源线,其输出节点连接到第一预充电电源电路 当DRAM芯片的电源接通时,预充电电源线开始其预充电电流馈送操作;以及第二预充电电源电路,其输出节点连接到预充电电源线,并在其之后开始其预充电电流馈电操作 通过第一预充电电源电路的预充电电流将位线提高到预定电位。
    • 5. 发明授权
    • Semiconductor storage device
    • 半导体存储设备
    • US07027335B2
    • 2006-04-11
    • US10720980
    • 2003-11-24
    • Mikihiko ItoMasaru KoyanagiTakashi Taira
    • Mikihiko ItoMasaru KoyanagiTakashi Taira
    • G11C7/00
    • G11C7/065G11C11/4091G11C2207/005G11C2207/065G11C2207/2281
    • A semiconductor storage device comprises a memory cell array including memory cells, and bit lines for transfer of data in the memory cells; an amplifier circuit connected to the bit lines to amplify data in the memory cells; a first switching element connected between the bit lines and the amplifier circuit; a first reference voltage source which applies to the gate of the first switching element a voltage for turning the first switching element ON; a second switching element and a third switching element connected in series between the gate of the first switching element and the first reference voltage source, said second switching element and said third switching element being connected in parallel to each other; a second reference voltage source which applies to the gates of the second and third switching elements a voltage for turning the second and third switching elements ON; and a first timing shift circuit connected between the gate of the third switching element and the second reference voltage source to delay the operation of the third switching element from the operation of the second switching element.
    • 半导体存储装置包括存储单元阵列,其包括存储单元,以及用于在存储单元中传送数据的位线; 连接到位线的放大器电路,以放大存储器单元中的数据; 连接在位线与放大电路之间的第一开关元件; 第一参考电压源,其向第一开关元件的栅极施加用于使第一开关元件导通的电压; 第二开关元件和第三开关元件串联连接在第一开关元件的栅极和第一参考电压源之间,所述第二开关元件和所述第三开关元件彼此并联连接; 第二参考电压源,其向第二和第三开关元件的栅极施加用于使第二和第三开关元件接通的电压; 以及连接在第三开关元件的栅极和第二参考电压源之间的第一定时偏移电路,用于延迟第三开关元件的操作与第二开关元件的操作。
    • 10. 发明授权
    • Semiconductor device with supply voltage-lowering circuit
    • 具有电源降压电路的半导体器件
    • US5831421A
    • 1998-11-03
    • US837461
    • 1997-04-18
    • Takashi TairaKazuyoshi Muraoka
    • Takashi TairaKazuyoshi Muraoka
    • H01L27/04G05F1/46G11C5/14G11C11/401G11C11/407H01L21/822G05F3/16
    • G05F1/465
    • A semiconductor device includes an internal circuit and first and second supply voltage-lowering circuits in its semiconductor chip. The first supply voltage-lowering circuit steps down an external power supply potential of the semiconductor chip in response to a control signal, generates a first internal power supply potential, and supplies it to the internal circuit. The second supply voltage-lowering circuit steps down the external power supply potential of the semiconductor chip in response to the control signal, generates a second internal power supply potential of substantially the same level as that of the first internal power supply potential, and supplies it to the internal circuit. The first and second internal power supply potentials output from the first and second supply voltage-lowering circuits vary out of phase with each other to cancel out variations in first and second internal power supply potentials.
    • 半导体器件包括其半导体芯片中的内部电路和第一和第二电源降压电路。 第一电源降压电路响应于控制信号降低半导体芯片的外部电源电位,产生第一内部电源电位,并将其提供给内部电路。 第二电源降压电路响应于控制信号降低半导体芯片的外部电源电位,产生与第一内部电源电位基本相同的第二内部电源电位,并将其提供 到内部电路。 从第一和第二电源电压降低电路输出的第一和第二内部电源电位彼此不同相异,以抵消第一和第二内部电源电位的变化。