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    • 4. 发明授权
    • Multiple logic family compatible output driver
    • 多逻辑系列兼容输出驱动器
    • US5952847A
    • 1999-09-14
    • US673701
    • 1996-06-25
    • William C. PlantsGregory W. Bakker
    • William C. PlantsGregory W. Bakker
    • H01L29/78H01L21/8234H01L27/088H03K19/0175H03K19/0185
    • H03K19/018521
    • The output buffer circuit according to the present invention is connected to an I/O pad of the integrated circuit. The output buffer circuit includes an output totem pole, a level shifter and enable logic. The output totem pole has a first input connected to the level shifter and a second input connected to the enable logic. The output of the totem pole is connected to an I/O pad. The totem pole includes a pullup transistor connected to 3.3 volt Vcc and a pulldown transistor connected to ground. In a first embodiment of the invention, the pullup transistor in the totem pole is an N-channel MOS transistor, and in a second embodiment of the invention, the pullup transistor in the totem pole is a P-channel MOS transistor formed in an N-well tied to the 5 volt Vcc. In the first embodiment of the present invention, the N-Channel MOS pullup transistor is turned on by a 5 volt signal from the level shifter. In the second embodiment of the present invention, the P-Channel MOS pullup transistor is turned on by a ground level signal from the level shifter. The enable logic drives the output of the totem pole in response to input signals to the enable logic. The inputs to the enable logic are a Data input, a Global enable input and an Output enable input.
    • 根据本发明的输出缓冲器电路连接到集成电路的I / O焊盘。 输出缓冲电路包括输出图腾柱,电平移位器和使能逻辑。 输出图腾柱具有连接到电平移位器的第一输入端和连接到使能逻辑的第二输入端。 图腾柱的输出连接到I / O焊盘。 图腾柱包括连接到3.3伏Vcc的上拉晶体管和连接到地的下拉晶体管。 在本发明的第一实施例中,图腾柱中的上拉晶体管是N沟道MOS晶体管,在本发明的第二实施例中,图腾柱中的上拉晶体管是形成在N沟道MOS晶体管中的P沟道MOS晶体管 - 连接到5伏Vcc。 在本发明的第一实施例中,N沟道MOS上拉晶体管由来自电平移位器的5伏特信号导通。 在本发明的第二实施例中,P沟道MOS上拉晶体管由来自电平移位器的接地电平信号导通。 响应于使能逻辑的输入信号,使能逻辑驱动图腾柱的输出。 使能逻辑的输入是数据输入,全局使能输入和输出使能输入。
    • 8. 发明授权
    • Method of forming antifuses having minimum areas
    • 形成具有最小面积的反熔丝的方法
    • US5508220A
    • 1996-04-16
    • US243001
    • 1993-06-01
    • Abdelshafy A. EltoukhyGregory W. Bakker
    • Abdelshafy A. EltoukhyGregory W. Bakker
    • G11C17/06H01L21/82H01L23/525H01L21/70H01L27/00
    • H01L23/5252H01L2924/0002H01L2924/3011Y10S148/055
    • Antifuses having minimum areas are formed by a process including the steps of forming doped regions in a semiconductor substrate, forming a dielectric layer over the surface of the substrate, performing masking and etching steps to form apertures in the dielectric layer over portions of the doped regions where antifuses are to be formed, depositing a second dielectric layer over the first dielectric layer and the apertures, the second dielectric layer having a faster etch rate than the first dielectric layer, etching the second dielectric layer to leave spacers at the edges of the apertures, forming the antifuse dielectric in the apertures, and forming upper antifuse electrodes over the antifuse dielectric. In another process, a process for forming antifuses includes the steps of forming a dielectric layer over the surface of a semiconductor substrate, forming a first layer of polysilicon over the insulating layer, forming apertures in between portions of the first polysilicon layer where antifuses are to be formed, doping the exposed regions in the substrate using the polysilicon as a masking member, depositing an oxide over the polysilicon regions, etching the oxide to expose the substrate between the regions of first layer polysilicon, forming the antifuse dielectric in the apertures, and forming upper antifuse electrodes over the antifuse dielectric. The process of the present invention may also be used to form antifuses in layers above the substrate.
    • 具有最小面积的防潮剂通过包括以下步骤的方法形成,该方法包括在半导体衬底中形成掺杂区域,在衬底的表面上形成介电层,进行掩模和蚀刻步骤以在掺杂区域的部分上形成介电层中的孔 在要形成反熔丝的情况下,在所述第一介电层和所述孔之上沉积第二电介质层,所述第二电介质层具有比所述第一电介质层更快的蚀刻速率,蚀刻所述第二电介质层以在所述孔的边缘留下间隔物 在孔中形成反熔丝电介质,并在反熔丝电介质上形成上部反熔丝电极。 在另一种方法中,形成反熔丝的方法包括以下步骤:在半导体衬底的表面上形成电介质层,在绝缘层上形成第一多晶硅层,在反熔丝的第一多晶硅层的部分之间形成孔 用多晶硅作为掩模构件掺杂衬底中的暴露区域,在多晶硅区域上沉积氧化物,蚀刻氧化物以在第一层多晶硅的区域之间露出衬底,在孔中形成反熔丝电介质,以及 在反熔丝电介质上形成上部反熔丝电极。 本发明的方法也可用于在基底上方形成层间的反熔丝。