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1. 发明授权

US06905349B1 Technique for connector to printed circuit board decoupling to eliminate flexure 失效
标题翻译：连接器到印刷电路板去耦的技术，以消除挠曲
公开(公告)号：US06905349B1
公开(公告)日：2005-06-14
申请号：US10784350
申请日：2004-02-23
申请人： Scott D. Brandenburg , David A. Laudick , Thomas A. Degenkolb , Larry M Mandel , Richard D. Parker
发明人： Scott D. Brandenburg , David A. Laudick , Thomas A. Degenkolb , Larry M Mandel , Richard D. Parker
IPC分类号： H01R12/00 , H05K1/02 , H05K3/28
CPC分类号： H05K3/284 , H05K1/0271 , H05K2201/10189 , H05K2203/1316
摘要： An electronic assembly and/or a mold is constructed to reduce deflection and resultant damage to components and/or an associated printed circuit board of the electronic assembly when the electronic assembly is overmolded.
摘要翻译：电子组件和/或模具被构造成当电子组件被包覆成型时减少对电子组件的部件和/或相关联的印刷电路板的偏转和所造成的损坏。

2. 发明授权

US07603770B2 Method of overmolding an electronic assembly having an insert-molded vertical mount connector header 有权
标题翻译：一种具有嵌入成型的垂直安装连接器插头的电子组件的二次模制方法
公开(公告)号：US07603770B2
公开(公告)日：2009-10-20
申请号：US11906024
申请日：2007-09-28
申请人： Scott D. Brandenburg , David A. Laudick
发明人： Scott D. Brandenburg , David A. Laudick
IPC分类号： H01K3/22 , H01R43/00 , B29C45/14
CPC分类号： H05K5/0034 , H05K3/284 , H05K2201/10303 , H05K2201/10424 , H05K2203/1316 , Y10T29/49158 , Y10T29/49176 , Y10T29/4922
摘要： An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant.
摘要翻译：包括垂直安装连接器插头的电子组件被包覆成型以形成封装的模块。保持在连接器集管中的导体销被连接到电路板以相对于电路板支撑连接器集管，在连接器集管和电路板之间留下开放空间。然后将电子组件放置在用于塑料封装的模具中。模具的底板具有适合于容纳连接器插头的导体销和护罩的良好尺寸，并且连接器插头具有位于模具的地板上的外围法兰，以将密封剂保持在井外。密封剂填充连接器插头内部的开放空间，并且设置在连接器插头和阱的底板之间的连接器插件防止了由于密封剂的包装压力引起的连接器插头和电路板的膨胀。

3. 发明授权

US07473585B2 Technique for manufacturing an overmolded electronic assembly 有权
标题翻译：制造包覆成型电子组件的技术
公开(公告)号：US07473585B2
公开(公告)日：2009-01-06
申请号：US11150997
申请日：2005-06-13
申请人： Scott D. Brandenburg , David A. Laudick
发明人： Scott D. Brandenburg , David A. Laudick
IPC分类号： H01L21/00
CPC分类号： H01L23/3121 , H01L23/4334 , H01L25/0652 , H01L25/162 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/19041 , H05K1/0203 , H05K3/0061 , H05K3/284 , H05K5/0034 , H05K7/20854 , H05K2201/09063 , H05K2201/09745 , H05K2201/10189 , H05K2201/1056 , H05K2201/10674 , H05K2203/1316 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a first side of an integrated circuit (IC) die mounted to a first side of the substrate is provided. The IC die is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate. The substrate includes a hole approximate an outer edge of the IC die. The first side of the substrate is then positioned in contact with at least a portion of the first side of the backplate. The IC die is positioned within the cavity with a second side of the IC die in thermal contact with the backplate. The substrate and at least a portion of the backplate are overmolded with an overmold material, which enters the cavity through the hold to substantially underfill the IC die and substantially fill an unoccupied portion of the cavity.
摘要翻译：一种用于制造电子组件的技术包括多个步骤。首先，提供具有形成在背板的第一侧中的空腔的背板。接下来，提供具有安装到基板的第一侧的集成电路（IC）裸片的第一侧的基板。 IC芯片电连接到形成在基板的第一侧上的多个导电迹线中的一个或多个。基板包括近似于IC芯片的外边缘的孔。然后将衬底的第一侧定位成与背板的第一侧的至少一部分接触。 IC芯片位于腔内，IC芯片的第二侧与背板热接触。衬底和背板的至少一部分用包覆成型材料包覆成型，该包覆成型材料通过保持件进入空腔，以基本上填充IC管芯并基本上填充空腔的未占用部分。

4. 发明授权

US06875636B2 Wafer applied thermally conductive interposer 失效
公开(公告)号：US06875636B2
公开(公告)日：2005-04-05
申请号：US10618953
申请日：2003-07-14
申请人： Scott D. Brandenburg , David A. Laudick
发明人： Scott D. Brandenburg , David A. Laudick
IPC分类号： C09K5/14 , H01L23/373 , H01L21/50
CPC分类号： H01L23/3736 , C09K5/14 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , H01L2924/00
摘要： A thermally conductive film is attached to an integrated circuit (IC) wafer through a number of steps. Initially, a thermally conductive film is positioned on a first side of a block. Next, an IC wafer that includes a plurality of chips is positioned with its non-active side in contact with the film. Then, a first surface of an elastomer pad is positioned in contact with an active side of the wafer. Next, a predetermined pressure is applied between a second side of the block that is opposite the first side and a second surface of the elastomer pad that is opposite the first surface. Finally, the film, the block, the wafer and the elastomer pad are heated to a predetermined temperature for a predetermined time while a predetermined pressure is applied to bond the film to the wafer without bonding the film to the block.

5. 发明申请

US20120078208A1 Contained ostomy appliance 审中-公开
标题翻译：包含造口术器具
公开(公告)号：US20120078208A1
公开(公告)日：2012-03-29
申请号：US13199967
申请日：2011-09-14
申请人： David A. Laudick
发明人： David A. Laudick
IPC分类号： A61F5/445
CPC分类号： A61F5/4405 , A61F5/445 , A61F5/448
摘要： The present invention is an individual pressure barrier pouch that is used in conjunction with the assembly of either a one piece or a two piece ostomy appliance or as a pressure barrier pouch that can be preassembled and integrated into the assembly of a two piece ostomy appliance. In all three embodiments, body waste material/excretions from the patient's stoma/fistula pass through the pressure barrier pouch to enter the ostomy pouch. When pressure is applied to the ostomy pouch, the excretions no longer have access to escape through the path of least resistance between the stoma and the wafer stoma clearance hole as they do with a conventional ostomy pouch. The only access to the path of least resistance with the present invention would have body excretions backing up through the pressure barrier pouch.
摘要翻译：本发明是与单件或二件造口术装置的组合或者可以预先组装并整合到两件式造口术装置的组件中的压力阻隔袋结合使用的单独的压力阻隔袋。在所有三个实施例中，来自患者造口/瘘的身体废物/排泄物通过压力阻挡袋进入造口术袋。当对造口袋施加压力时，与常规造口袋一样，排泄物不再通过造口和晶片造口清除孔之间的最小阻力的路径逃逸。通过本发明对最小阻力的路径的唯一访问将具有通过压力阻隔袋备份的身体排泄物。

6. 发明申请

US20090085248A1 Method of overmolding an electronic assembly having an insert-molded vertical mount connector header 有权
公开(公告)号：US20090085248A1
公开(公告)日：2009-04-02
申请号：US11906024
申请日：2007-09-28
申请人： Scott D. Brandenburg , David A. Laudick
发明人： Scott D. Brandenburg , David A. Laudick
IPC分类号： B29C45/14
CPC分类号： H05K5/0034 , H05K3/284 , H05K2201/10303 , H05K2201/10424 , H05K2203/1316 , Y10T29/49158 , Y10T29/49176 , Y10T29/4922
摘要： An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant.

7. 发明授权

US07268429B2 Technique for manufacturing an overmolded electronic assembly 有权
标题翻译：制造包覆成型电子组件的技术
公开(公告)号：US07268429B2
公开(公告)日：2007-09-11
申请号：US11167473
申请日：2005-06-27
申请人： Scott D. Brandenburg , David A. Laudick , Thomas A. Degenkolb , Matthew R. Walsh , Jeenhuei S. Tsai
发明人： Scott D. Brandenburg , David A. Laudick , Thomas A. Degenkolb , Matthew R. Walsh , Jeenhuei S. Tsai
IPC分类号： H01L23/34 , H01L21/44
CPC分类号： H01L23/4334 , B29C45/14065 , B29C45/14467 , B29C45/14655 , H01L23/3121 , H01L2924/0002 , H05K1/0203 , H05K3/0061 , H05K3/284 , H05K2201/10189 , H05K2201/1056 , H05K2201/10674 , H05K2203/1316 , H01L2924/00
摘要： A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity, when joined. A backplate is also provided that includes a plurality of support pedestals and an integrated heatsink extending from a first side of the backplate. A substrate includes a first side of an integrated circuit (IC) die mounted to a first side of the substrate. The backplate and the substrate are placed within the cavity of the second mold portion and the support pedestals are in contact with the first side of the substrate. The first and second mold portions are joined and the mold pins contact a second surface of the substrate during an overmolding process.
摘要翻译：一种用于制造电子组件的技术使用具有第一模具部分和第二模具部分的模具。第一模具部分包括从内表面延伸的多个间隔开的模具销。当连接时，第一和第二模具部分的空腔提供模腔。还提供了一种背板，其包括多个支撑基座和从背板的第一侧延伸的集成散热器。衬底包括安装到衬底的第一侧的集成电路（IC）裸片的第一侧。背板和基板被放置在第二模具部分的空腔内，并且支撑基座与基板的第一侧接触。第一和第二模具部分被接合，并且模具销在包覆模制过程期间与衬底的第二表面接触。

8. 发明授权

US07230829B2 Overmolded electronic assembly with insert molded heat sinks 有权
标题翻译：包覆成型的电子组件，带有嵌入式散热片
公开(公告)号：US07230829B2
公开(公告)日：2007-06-12
申请号：US11045211
申请日：2005-01-28
申请人： Larry M Mandel , David A. Laudick
发明人： Larry M Mandel , David A. Laudick
IPC分类号： H05K7/20 , A05K3/30
CPC分类号： H05K5/065 , H05K3/284 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146
摘要： An overmolded electronic assembly includes a substrate, a plurality of surface mount technology (SMT) integrated circuit (IC) chips, a plurality of heat sinks, a backplate and an overmold material. The substrate includes a plurality of conductive traces formed on a first surface of the substrate. The IC chips each include an active front side and a backside and the IC chips are electrically coupled to one or more of the traces. The heat sinks are each in thermal contact with the backside of a different one of the IC chips and are independent of each other. The backplate is attached to a second surface of the substrate, which is opposite the first surface of the substrate. The overmold material covers the first surface of the substrate and maintains the heat sinks in thermal contact with an associated one of the IC chips.
摘要翻译：包覆成型的电子组件包括衬底，多个表面贴装技术（SMT）集成电路（IC）芯片，多个散热器，背板和包覆模制材料。衬底包括形成在衬底的第一表面上的多个导电迹线。 IC芯片各自包括有源正面和背面，并且IC芯片电耦合到一个或多个迹线。散热片各自与IC芯片中的不同IC芯片的背面热接触，并且彼此独立。背板附接到基板的与基板的第一表面相对的第二表面。包覆成型材料覆盖基板的第一表面并且保持散热器与相关的一个IC芯片热接触。

9. 发明授权

US07739791B2 Method of producing an overmolded electronic module with a flexible circuit pigtail 有权
标题翻译：用柔性电路引线制造包覆成型电子模块的方法
公开(公告)号：US07739791B2
公开(公告)日：2010-06-22
申请号：US11978063
申请日：2007-10-26
申请人： Scott D. Brandenburg , David A Laudick , Gary E. Oberlin
发明人： Scott D. Brandenburg , David A Laudick , Gary E. Oberlin
IPC分类号： H05K13/00
CPC分类号： H05K3/284 , B29C45/14377 , B29C45/14418 , B29C45/14639 , B29C45/14836 , B29C45/72 , H05K1/118 , H05K1/147 , H05K3/361 , H05K5/065 , H05K2201/0239 , H05K2203/1121 , H05K2203/1316 , Y10T29/49121 , Y10T29/49144 , Y10T29/49146 , Y10T29/49172 , Y10T29/5193
摘要： A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastomeric interface between the mold and the flexible circuit to seal off the mold cavity and protect the flexible circuit from damage due to the clamping force of the mold. The portion of the flexible circuit within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound, and a heat exchanger thermally coupled to the portion of the flexible circuit that protrudes from the mold protects the flexible circuit from damage due to thermal conduction from the mold and mold compound.
摘要翻译：一种制造包括模制的电子组件的方法，包括电路板和柔性电路互连，通过将组件固定在模腔中，使得柔性电路的一部分从模具突出，并且在模具和柔性模具之间提供可压缩的弹性体界面电路密封模腔，并保护柔性电路免受模具夹紧力的损坏。模具腔内柔性电路的一部分预先涂覆有确保与模塑料具有良好粘附性的材料，并且热耦合到柔性电路部分的热交换器从模具突出以保护柔性电路免受损坏由于模具和模具化合物的热传导。

10. 发明申请

US20100032183A1 Compliant pin strip with integrated dam bar 审中-公开
标题翻译：具有集成水坝杆的合规销钉条
公开(公告)号：US20100032183A1
公开(公告)日：2010-02-11
申请号：US11712750
申请日：2007-03-01
申请人： Scott D. Brandenburg , David A. Laudick
发明人： Scott D. Brandenburg , David A. Laudick
IPC分类号： H02G3/04 , B29C45/14
CPC分类号： B29C45/14639 , B29C45/14418 , H01L21/56 , H01L2924/0002 , H01L2924/00
摘要： An improved compliant pin strip and process for making an electrical package having a printed circuit board encased in a housing and pin connectors mechanically and electrically connected to the printed circuit board and extending outwardly away from an outer surface of the housing is provided. This involves the use of a compliant pin strip having a dam bar that defines surfaces for a molding tool to close on and seal a mold cavity. The pin strip with dam bar enables a simplified, cost effective, and more robust manufacturing process.
摘要翻译：提供了一种改进的柔性引脚条和用于制造电气封装的工艺，该电气封装具有封装在壳体中的印刷电路板，并且提供机械和电连接到印刷电路板并从外壳的外表面向外延伸的销连接器。这涉及使用具有阻挡杆的柔性销带，其限定用于模制工具闭合并密封模腔的表面。带挡板的销带可实现简化，成本效益和更强大的制造工艺。

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