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1. 发明授权

US09966608B2 Electrolytic copper foil, method of producing electrolytic copper foil, lithium ion secondary cell using electrolytic copper foil as collector 有权
公开(公告)号：US09966608B2
公开(公告)日：2018-05-08
申请号：US14129138
申请日：2012-06-27
申请人： Kensaku Shinozaki , Akitoshi Suzuki
发明人： Kensaku Shinozaki , Akitoshi Suzuki
IPC分类号： H01M4/66 , C25D1/04 , C25D3/38 , H01M4/134 , H01M4/38 , H01M4/04 , H01M10/052 , C25D5/50
CPC分类号： H01M4/667 , C25D1/04 , C25D3/38 , C25D5/50 , H01M4/0452 , H01M4/134 , H01M4/386 , H01M4/387 , H01M4/661 , H01M10/052
摘要： The present invention provides an electrodeposited copper foil having a tensile strength of at least 300 MPa and elongation rate of at least 3.0% after heat treatment at 350° C. for 1 hour and provides a copper foil which prevents the breakage of a current collector (copper foil) while maintaining adhesiveness between the current collector (copper foil) and the active material in response to substantial expansion and contraction of a Si or Sn alloy-based active material. The foil is an electrodeposited copper foil having a roughened surface, the tensile strength of the copper foil being at least 300 MPa after heating at 350° C. for 1 hour, the elongation rate being at least 3.0% after heating at 350° C. for 1 hour, and respective surface area ratios (actual surface area/geometric surface area) of both sides of the copper foil (the side that is roughened and the side that is not roughened) being from 1.6 to 2.2. The electrodeposited copper foil is produced with an electrolyte in which from 3 to 20 ppm of organic additives of one or more compounds selected from compounds having a structure with an SH group binding to a heterocycle containing N or thiourea-based compounds is added to a copper sulfate-based electrolyte, and then from 0 to 12 ppm of hydroxyethyl cellulose or a low-molecular weight glue, and from 10 to 80 ppm of chlorine ions are added thereto.

2. 发明授权

US09603245B2 Lithium-ion secondary battery, electrode for the secondary battery, and electrolytic copper foil for electrode for the secondary battery 有权
公开(公告)号：US09603245B2
公开(公告)日：2017-03-21
申请号：US13976503
申请日：2011-12-27
申请人： Akitoshi Suzuki , Kensaku Shinozaki , Toshio Tani , Hirokazu Sasaki , Isamu Futaba , Kouji Hataya , Shinya Ohtomo , Hirokazu Yoshikawa
发明人： Akitoshi Suzuki , Kensaku Shinozaki , Toshio Tani , Hirokazu Sasaki , Isamu Futaba , Kouji Hataya , Shinya Ohtomo , Hirokazu Yoshikawa
IPC分类号： H01M4/66 , H05K1/09 , C22F1/08 , C25D3/38 , C25D5/48 , C25D7/06 , H01M4/133 , H01M4/134 , H01M4/1395 , H01M10/0525 , C23C22/24 , C25D1/04 , C25D5/10 , C25D5/16 , H01M4/04 , H01M4/02
CPC分类号： H05K1/09 , C22F1/08 , C23C22/24 , C25D1/04 , C25D3/38 , C25D5/10 , C25D5/16 , C25D5/48 , C25D7/0614 , H01M4/0404 , H01M4/043 , H01M4/0471 , H01M4/133 , H01M4/134 , H01M4/1395 , H01M4/661 , H01M4/667 , H01M10/0525 , H01M2004/021 , H05K2201/0355 , H05K2203/0307 , H05K2203/1105 , Y02E60/122 , Y10T428/12431
摘要： To provide an electrolytic copper foil for a negative electrode for a lithium-ion secondary battery with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even when the charge-discharge cycling is repeated, that has long life, and no deformation of a negative electrode current collector occurs. The electrolytic copper foil constituting the negative electrode current collector for the lithium-ion secondary battery has, after heat treatment at from 200 to 400° C., a 0.2% proof stress of 250 N/mm2 or more, and elongation of 2.5% or more; and the surface on which an active material layer of the electrolytic copper foil is provided has been rust-proofed, or roughened and rust-proofed. As a result of analysis of the depth profile (depth direction) obtained by performing secondary ion mass spectrometry (SIMS) in the thickness direction of the copper foil, the copper foil including: chlorine (Cl), carbon (C), and oxygen (O) each in a concentration of 1017 to 5×1020 atoms/cm3, and sulfur (S) and nitrogen (N) each in a concentration of 1015 to 1019 atoms/cm3.

3. 发明申请

US20130108922A1 ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL FOR LITHIUM ION SECONDARY BATTERY, ELECTRODE FOR LITHIUM ION SECONDARY BATTERY USING THE ELECTROLYTIC COPPER FOIL, AND LITHIUM ION SECONDARY BATTERY USING THE ELECTRODE 审中-公开
标题翻译：用于锂离子二次电池的电解铜箔，电解铜箔，使用电解铜箔的锂离子二次电池电极和使用电极的锂离子二次电池
公开(公告)号：US20130108922A1
公开(公告)日：2013-05-02
申请号：US13807137
申请日：2011-06-28
申请人： Kensaku Shinozaki , Akitoshi Suzuki
发明人： Kensaku Shinozaki , Akitoshi Suzuki
IPC分类号： H01M4/66 , H01M4/70 , H01M4/134
CPC分类号： H01M4/661 , C25D3/38 , C25D7/0614 , H01M4/13 , H01M4/134 , H01M4/662 , H01M4/70 , H01M10/0525
摘要： A lithium ion secondary battery, which uses a negative electrode wherein an active material is deposited on a collector, and which is characterized in that no wrinkles are formed on the collector, the collector does not fracture, the adhesion between the active material and the collector is high, and stable performance can be maintained for a long period of time; an electrode for the secondary battery; and an electrolytic copper foil that constitutes the electrode. Specifically disclosed is an electrolytic copper foil for a lithium ion secondary battery, in which a surface-roughened layer of copper or copper alloy particles having a particle diameter of 0.1-3 μm is formed on both surfaces of an untreated copper foil by roughening treatment by means of electrolysis, and the surface-roughened layers on both surfaces have a surface roughness Rz of 1.0-5 μm and a surface roughness Ra of 0.25-0.7 μm, with the Rz difference between the front and back surfaces being within 3 μm and the Ra differences between the front and back surfaces being within 0.3 μm.
摘要翻译：一种锂离子二次电池，其使用负极，其中活性材料沉积在集电体上，其特征在于，在集电体上不形成褶皱，集电体不会断裂，活性材料与集电体之间的粘附高性能，长时间保持稳定性能; 用于二次电池的电极; 以及构成电极的电解铜箔。具体公开了一种用于锂离子二次电池的电解铜箔，其中通过粗糙化处理在未处理的铜箔的两个表面上形成具有0.1-3μm的粒径的铜或铜合金颗粒的表面粗糙化层电解方式，两面的表面粗糙化层的表面粗糙度Rz为1.0-5μm，表面粗糙度Ra为0.25〜0.7μm，前后表面之间的Rz差在3μm以内，前后表面之间的差异在0.3μm以内。

4. 发明申请

US20140199588A1 ELECTROLYTIC COPPER FOIL, METHOD OF PRODUCING ELECTROLYTIC COPPER FOIL, LITHIUM ION SECONDARY CELL USING ELECTROLYTIC COPPER FOIL AS COLLECTOR 有权
标题翻译：电解铜箔，生产电解铜箔的方法，使用电解铜箔作为收集器的锂离子二次电池
公开(公告)号：US20140199588A1
公开(公告)日：2014-07-17
申请号：US14129138
申请日：2012-06-27
申请人： Kensaku Shinozaki , Akitoshi Suzuki
发明人： Kensaku Shinozaki , Akitoshi Suzuki
IPC分类号： H01M4/66 , H01M4/04
CPC分类号： H01M4/667 , C25D1/04 , C25D3/38 , C25D5/50 , H01M4/0452 , H01M4/134 , H01M4/386 , H01M4/387 , H01M4/661 , H01M10/052
摘要： The present invention provides an electrodeposited copper foil having a tensile strength of at least 300 MPa and elongation rate of at least 3.0% after heat treatment at 350° C. for 1 hour and provides a copper foil which prevents the breakage of a current collector (copper foil) while maintaining adhesiveness between the current collector (copper foil) and the active material in response to substantial expansion and contraction of a Si or Sn alloy-based active material. The foil is an electrodeposited copper foil having a roughened surface, the tensile strength of the copper foil being at least 300 MPa after heating at 350° C. for 1 hour, the elongation rate being at least 3.0% after heating at 350° C. for 1 hour, and respective surface area ratios (actual surface area/geometric surface area) of both sides of the copper foil (the side that is roughened and the side that is not roughened) being from 1.6 to 2.2. The electrodeposited copper foil is produced with an electrolyte in which from 3 to 20 ppm of organic additives of one or more compounds selected from compounds having a structure with an SH group binding to a heterocycle containing N or thiourea-based compounds is added to a copper sulfate-based electrolyte, and then from 0 to 12 ppm of hydroxyethyl cellulose or a low-molecular weight glue, and from 10 to 80 ppm of chlorine ions are added thereto.
摘要翻译：本发明提供一种在350℃热处理1小时后的拉伸强度为300MPa以上的伸长率为3.0％以上的电解铜箔，提供了防止集电体断裂的铜箔（铜箔），同时响应于基于Si或Sn合金的活性材料的显着的膨胀和收缩而保持集电体（铜箔）和活性材料之间的粘合性。箔是具有粗糙表面的电沉积铜箔，在350℃下加热1小时后，铜箔的拉伸强度至少为300MPa，在350℃加热后的伸长率至少为3.0％。 1小时，铜箔两侧（粗糙面和未粗糙化面）的表面积比（实际面积/几何面积）为1.6〜2.2。电沉积铜箔是用电解液制成的，其中3至20ppm的一种或多种选自具有SH基团结构的化合物的有机添加剂与含有N或硫脲类化合物的杂环结合的化合物加入到铜硫酸盐类电解质，然后0〜12ppm的羟乙基纤维素或低分子量的胶，向其中加入10〜80ppm的氯离子。

5. 发明申请

US20140017564A1 LITHIUM-ION SECONDARY BATTERY, ELECTRODE FOR THE SECONDARY BATTERY, AND ELECTROLYTIC COPPER FOIL FOR ELECTRODE FOR THE SECONDARY BATTERY 有权
标题翻译：锂离子二次电池，二次电池用电极，二次电池用电极用电解铜箔
公开(公告)号：US20140017564A1
公开(公告)日：2014-01-16
申请号：US13976503
申请日：2011-12-27
申请人： Akitoshi Suzuki , Kensaku Shinozaki , Toshio Tani , Hirokazu Sasaki , Isamu Futaba , Kouji Hataya , Shinya Ohtomo , Hirokazu Yoshikawa
发明人： Akitoshi Suzuki , Kensaku Shinozaki , Toshio Tani , Hirokazu Sasaki , Isamu Futaba , Kouji Hataya , Shinya Ohtomo , Hirokazu Yoshikawa
IPC分类号： H01M4/66 , H05K1/09
CPC分类号： H05K1/09 , C22F1/08 , C23C22/24 , C25D1/04 , C25D3/38 , C25D5/10 , C25D5/16 , C25D5/48 , C25D7/0614 , H01M4/0404 , H01M4/043 , H01M4/0471 , H01M4/133 , H01M4/134 , H01M4/1395 , H01M4/661 , H01M4/667 , H01M10/0525 , H01M2004/021 , H05K2201/0355 , H05K2203/0307 , H05K2203/1105 , Y02E60/122 , Y10T428/12431
摘要： To provide an electrolytic copper foil for a negative electrode for a lithium-ion secondary battery with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even when the charge-discharge cycling is repeated, that has long life, and no deformation of a negative electrode current collector occurs. The electrolytic copper foil constituting the negative electrode current collector for the lithium-ion secondary battery has, after heat treatment at from 200 to 400° C., a 0.2% proof stress of 250N/mm2 or more, and elongation of 2.5% or more; and the surface on which an active material layer of the electrolytic copper foil is provided has been rust-proofed, or roughened and rust-proofed. As a result of analysis of the depth profile (depth direction) obtained by performing secondary ion mass spectrometry (SIMS) in the thickness direction of the copper foil, the copper foil including: chlorine (Cl), carbon (C), and oxygen (O) each in a concentration of 1017 to 5×1020 atoms/cm3, and sulfur (S) and nitrogen (N) each in a concentration of 1015 to 1019 atoms/cm3.
摘要翻译：为了提供一种用于锂离子二次电池的负极的电解铜箔，其可以制造长寿命的锂离子二次电池，即使在充放电时也不会下降容量保持率重复循环，寿命长，不会发生负极集电体的变形。构成用于锂离子二次电池的负极集电体的电解铜箔在200〜400℃的热处理后，具有250N / mm 2以上的0.2％屈服应力，2.5％以上的伸长率 ; 并且其上设置有电解铜箔的活性物质层的表面已经被防锈或粗糙化和防锈。通过分析在铜箔的厚度方向上进行二次离子质谱（SIMS）获得的深度分布（深度方向）的结果，铜箔包括：氯（Cl），碳（C）和氧（ O），浓度为1017〜5×1020原子/ cm3，硫（S）和氮（N）的浓度分别为1015〜1019原子/ cm3。

6. 发明申请

US20120258281A1 COPPER FOIL AND METHOD FOR PRODUCING COPPER FOIL 审中-公开
标题翻译：铜箔和生产铜箔的方法
公开(公告)号：US20120258281A1
公开(公告)日：2012-10-11
申请号：US13518648
申请日：2010-12-24
申请人： Kensaku Shinozaki , Akitoshi Suzuki , Takahiro Tsuruta
发明人： Kensaku Shinozaki , Akitoshi Suzuki , Takahiro Tsuruta
IPC分类号： B32B15/04 , B32B15/20 , B05D5/00 , B32B5/00
CPC分类号： C23F11/10 , B23K20/10 , B23K2101/38 , B23K2103/12 , C23C22/24 , C23C22/78 , H01M4/661 , H01M4/667 , H01M10/052 , Y10T428/24355 , Y10T428/31678
摘要： Disclosed is a surface-treated copper foil, which exhibits excellent weldability when copper foils or a copper foil and an other metal are welded with each other by ultrasonic welding. Specifically disclosed is a surface-treated copper foil which is characterized in that an organic antirust coating film is formed on at least one surface of the copper foil and the reciprocal of the electric double layer capacity representing the thickness of one surface (1/C) is 0.3-0.8 cm2/μF. The organic antirust coating film is formed from a triazole compound, a dicarboxylic acid and an amine, or alternatively formed from a tetrazole compound, a dicarboxylic acid and an amine.
摘要翻译：公开了一种表面处理铜箔，当铜箔或铜箔和其它金属通过超声波焊接彼此焊接时，其表现出优异的焊接性。具体公开的是表面处理铜箔，其特征在于，在铜箔的至少一个表面上形成有机防锈涂膜，并且表示双面层电容量的一面的倒数（1 / C）为0.3-0.8cm 2 /μF。有机防锈涂膜由三唑化合物，二羧酸和胺形成，或者由四唑化合物，二羧酸和胺形成。

7. 发明授权

US07985485B2 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil 失效
标题翻译：铜箔用于高频电路，生产方法及其生产设备，以及使用铜箔的高频电路
公开(公告)号：US07985485B2
公开(公告)日：2011-07-26
申请号：US12556410
申请日：2009-09-09
申请人： Takami Moteki , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
发明人： Takami Moteki , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
IPC分类号： B32B15/20 , C25D1/04 , C25D7/06
CPC分类号： C25D1/04 , C25D7/0614 , H05K1/0237 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.
摘要翻译：铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。

8. 发明申请

US20090324988A1 COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND APPARATUS FOR PRODUCTION OF SAME, AND HIGH FREQUENCY CIRCUIT USING COPPER FOIL 失效
标题翻译：用于高频电路的铜箔，用于生产它们的生产方法和装置以及使用铜箔的高频电路
公开(公告)号：US20090324988A1
公开(公告)日：2009-12-31
申请号：US12556410
申请日：2009-09-09
申请人： Takami Moteki , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
发明人： Takami Moteki , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
IPC分类号： B32B15/04 , B21C37/02 , C25D17/00 , C25D5/00
CPC分类号： C25D1/04 , C25D7/0614 , H05K1/0237 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.
摘要翻译：铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。

9. 发明申请

US20110171486A1 COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND APPARATUS FOR PRODUCTION OF SAME, AND HIGH FREQUENCY CIRCUIT USING COPPER FOIL 审中-公开
标题翻译：用于高频电路的铜箔，用于生产它们的生产方法和装置以及使用铜箔的高频电路
公开(公告)号：US20110171486A1
公开(公告)日：2011-07-14
申请号：US13072220
申请日：2011-03-25
申请人： Takami MOTEKI , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
发明人： Takami MOTEKI , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
IPC分类号： B32B15/04 , B32B15/00 , H05K1/02
CPC分类号： C25D1/04 , C25D7/0614 , H05K1/0237 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.
摘要翻译：铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。

10. 发明授权

US07052779B2 Copper foil for fine pattern printed circuits and method of production of same 有权
标题翻译：铜箔用于精细图案印刷电路及其制造方法
公开(公告)号：US07052779B2
公开(公告)日：2006-05-30
申请号：US10774375
申请日：2004-02-10
申请人： Kensaku Shinozaki
发明人： Kensaku Shinozaki
IPC分类号： B32B15/01 , B32B15/04 , B32B15/20
CPC分类号： H05K3/384 , C25D3/58 , C25D7/0614 , H05K3/389 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12431 , Y10T428/12438 , Y10T428/12472 , Y10T428/12903 , Y10T428/1291 , Y10T428/12993 , Y10T428/31663
摘要： Copper foil for fine pattern printed circuits having a sufficient bond strength with a resin substrate, eliminating the problems of residual copper, erosion at the bottom portions of the circuit lines, etc. at the time of formation of fine patterns, and superior in heat resistance and electrical characteristics, comprising untreated copper foil roughening treated on its surface, wherein the untreated copper foil before roughening treatment is an electrodeposited copper foil having a surface roughness in terms of 10-point average roughness Rz not more than 2.5 μm and a minimum distance between peaks of rough pyramid of at least 5 μm or having further crystal grains of an average particle size of not more than 2 μm exposed at the surface thereof, and a method of production of the same.
摘要翻译：铜箔用于与树脂基板具有足够的粘合强度的精细图案印刷电路，消除了在形成精细图案时残留铜，电路线底部的腐蚀等问题，并且耐热性优异电特性，包括在其表面处理的未处理铜箔粗糙化，其中在粗糙化处理之前未处理的铜箔是电沉积铜箔，其表面粗糙度为10点平均粗糙度Rz不大于2.5μm，并且最小距离为至少5μm的粗金字塔或其表面露出的平均粒径不大于2μm的其他晶粒的峰及其制造方法。

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