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1. 发明授权

US07441330B2 Process for producing circuit board 失效
标题翻译：电路板生产工艺
公开(公告)号：US07441330B2
公开(公告)日：2008-10-28
申请号：US11581589
申请日：2006-10-17
申请人： Kenji Takano , Munekazu Shibata , Kazuya Arai , Junichi Kanai , Kaoru Sugimoto
发明人： Kenji Takano , Munekazu Shibata , Kazuya Arai , Junichi Kanai , Kaoru Sugimoto
IPC分类号： H05K3/02
CPC分类号： H05K3/20 , H05K3/0097 , H05K3/06 , H05K3/423 , H05K3/4682 , H05K2201/0361 , H05K2201/096 , H05K2203/0156 , H05K2203/0384 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming a laminate on the interconnection pattern by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating a first metal layer from a supporting substrate to detach the laminate; removing the first metal layer of the three-layer metal laminate by etching using a second metal layer as a barrier layer; and removing the exposed second metal layer by etching.
摘要翻译：制造电路板的方法包括以下步骤：通过光刻将三层金属层压体的第三金属层蚀刻成预定的互连图案; 通过积层法在所述互连图案上形成层压体，所述层压体包括布置在其间的绝缘层的互连图案，所述互连图案彼此电连接; 从支撑基板分离第一金属层以分离层压体; 通过使用第二金属层作为阻挡层进行蚀刻来去除三层金属层叠体的第一金属层; 并通过蚀刻去除暴露的第二金属层。

2. 发明申请

US20070289128A1 Process for producing circuit board 失效
标题翻译：电路板生产工艺
公开(公告)号：US20070289128A1
公开(公告)日：2007-12-20
申请号：US11581589
申请日：2006-10-17
申请人： Kenji Takano , Munekazu Shibata , Kazuya Arai , Junichi Kanai , Kaoru Sugimoto
发明人： Kenji Takano , Munekazu Shibata , Kazuya Arai , Junichi Kanai , Kaoru Sugimoto
IPC分类号： H05K3/36
CPC分类号： H05K3/20 , H05K3/0097 , H05K3/06 , H05K3/423 , H05K3/4682 , H05K2201/0361 , H05K2201/096 , H05K2203/0156 , H05K2203/0384 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming a laminate on the interconnection pattern by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating a first metal layer from a supporting substrate to detach the laminate; removing the first metal layer of the three-layer metal laminate by etching using a second metal layer as a barrier layer; and removing the exposed second metal layer by etching.
摘要翻译：制造电路板的方法包括以下步骤：通过光刻将三层金属层压体的第三金属层蚀刻成预定的互连图案; 通过积层法在所述互连图案上形成层压体，所述层压体包括布置在其间的绝缘层的互连图案，所述互连图案彼此电连接; 从支撑基板分离第一金属层以分离层压体; 通过使用第二金属层作为阻挡层进行蚀刻来去除三层金属层叠体的第一金属层; 并通过蚀刻去除暴露的第二金属层。

3. 发明申请

US20070289704A1 Process for producing circuit board 审中-公开
标题翻译：电路板生产工艺
公开(公告)号：US20070289704A1
公开(公告)日：2007-12-20
申请号：US11589103
申请日：2006-10-30
申请人： Kenji Takano , Munekazu Shibata , Kazuya Arai , Junichi Kanai , Kaoru Sugimoto
发明人： Kenji Takano , Munekazu Shibata , Kazuya Arai , Junichi Kanai , Kaoru Sugimoto
IPC分类号： B32B37/12 , B32B38/04 , B32B37/00 , H01B13/00
CPC分类号： H05K3/4644 , H05K3/0052 , H05K3/0097 , H05K3/025 , H05K2201/09781 , H05K2203/1536 , Y10T156/1052 , Y10T156/108
摘要： A process for producing a circuit board includes the steps of detachably laminating a metal foil layer on a surface of a supporting substrate; forming a laminate on the metal foil layer by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating the metal foil layer from the supporting substrate to detach the laminate; and etching the metal foil layer by photolithography so as to form a predetermined interconnection pattern.
摘要翻译：制造电路板的方法包括以下步骤：在支撑基板的表面上可拆卸地层压金属箔层; 通过积层法在金属箔层上形成层压体，所述层压体包括布置在其间的绝缘层的互连图案，所述互连图案彼此电连接; 将金属箔层与支撑基板分离以分离层压体; 并通过光刻法蚀刻金属箔层以形成预定的互连图案。

4. 发明授权

US4822965A Lid locking mechanism in automobile switch panel device 失效
标题翻译：汽车开关柜装置中的盖锁定机构
公开(公告)号：US4822965A
公开(公告)日：1989-04-18
申请号：US75507
申请日：1987-07-20
申请人： Yukihiro Hyogo , Kikuo Kimura , Satoshi Iida , Kazuya Arai
发明人： Yukihiro Hyogo , Kikuo Kimura , Satoshi Iida , Kazuya Arai
IPC分类号： B60H1/00 , E05D11/10 , H01H9/28 , H01H13/04
CPC分类号： E05D11/1078 , B60H1/0065 , B60K2350/405 , E05Y2900/20 , E05Y2900/50 , H01H9/287 , Y10T16/540255 , Y10T16/54095
摘要： A lid lock mechanism in an automobile switch panel device. The mechanism includes an open-top case, a switch panel accommodated in said case, a lid to cover the open-top case, pivotal shafts provided in the open-top case, and clutch members provided in a pair of holes in the lid. At a predetermined opening angle, the lid is maintained in a locked condition while the lid is easily closed manually with a force stronger than a predetermined level.
摘要翻译：一种汽车开关面板装置中的盖锁定机构。该机构包括敞开式外壳，容纳在所述壳体中的开关面板，盖顶盖壳体的盖子，设置在敞开式壳体中的枢转轴以及设置在盖子中的一对孔中的离合器构件。在预定的开启角度下，盖子被保持在锁定状态，同时以比预定水平更强的力手动关闭盖子。

5. 发明申请

US20140065655A1 SCREENING METHOD FOR SUBSTANCE ACTING ON MAINTENANCE OF EPITHELIAL PROPERTIES OF CELL 审中-公开
标题翻译：用于维持细胞上皮性质的物质的筛选方法
公开(公告)号：US20140065655A1
公开(公告)日：2014-03-06
申请号：US13641790
申请日：2012-09-05
申请人： Manabu Itoh , Kazuya Arai , Hiroshi Kajita , Satoru Tanaka
发明人： Manabu Itoh , Kazuya Arai , Hiroshi Kajita , Satoru Tanaka
IPC分类号： G01N33/50
CPC分类号： G01N33/5044 , G01N33/5011
摘要： A screening method for a substance acting on a maintenance of the epithelial properties of cells which enables obtainment of highly-reliable data quickly at low costs is provided. The screening method includes (a) a step for culturing cells on a cell culture substrate that can form a spheroid, (b) a step for causing the cells to contact a test substance, and (c) a step for evaluating an effect of the test substance acting on a maintenance of the epithelial properties of the cells with a change in a morphology of the spheroid being as an indicator. In this case, the step (c) can carry out an evaluation through a measurement of the number of spheroids in a predetermined size or a measurement of the hypoxic areas in the spheroid.
摘要翻译：提供了一种能够维持细胞上皮性质的物质的筛选方法，其能够以低成本快速获得高可靠性数据。筛选方法包括：（a）在能够形成球状体的细胞培养基底上培养细胞的步骤，（b）使细胞接触被检物质的步骤，（c）作为维持细胞的上皮性质的测试物质，以球状体形态的变化为指标。在这种情况下，步骤（c）可以通过测定球体中预定尺寸的球体数量或球体中的缺氧区域的测量来进行评价。

6. 发明授权

US5115108A Two-stage rubber switch 失效
标题翻译：两级橡胶开关
公开(公告)号：US5115108A
公开(公告)日：1992-05-19
申请号：US654547
申请日：1991-02-13
申请人： Kikuo Ogawa , Kazuya Arai
发明人： Kikuo Ogawa , Kazuya Arai
IPC分类号： H01H13/705 , H01H23/00
CPC分类号： H01H13/705 , H01H23/003 , E05F15/00 , E05Y2400/854 , E05Y2400/86 , E05Y2900/55 , H01H2221/016 , H01H2225/018 , H01H2231/026 , H01H2237/006 , H01H2300/01
摘要： The two-stage rubber switch comprises a housing; an operating knob; two push bodies slidably supported by the housing; a contact wiring board having four mutually-opposing contact end portions arranged two by two under each push body; a rubber switch member interposed between the housing and the contact wiring board and having four conductive contact pieces arranged so as to be opposed to the four mutually-opposing contact end portions, respectively on the contact wiring board; and two-stage switching members in particular, such as semispherical rubber buckling portions formed together with the rubber switch member or elastically slidable push members. Further, it is preferable to use some semispherical rubber buckling portions of the rubber switch member as click feeling providing members.
摘要翻译：两级橡胶开关包括壳体; 操作旋钮由壳体可滑动地支撑的两个推动体; 接触布线板，其在每个推压体下具有两个两个彼此相对的接触端部; 插入在壳体和接触布线板之间并具有四个导电接触片的橡胶开关构件，其布置成分别与接触布线板上的四个相互相对的接触端部相对; 特别是两级切换构件，例如与橡胶开关构件或可弹性滑动的推动构件一起形成的半球形橡胶弯曲部。此外，优选使用橡胶开关构件的一些半球形橡胶弯曲部作为点击感提供构件。

7. 发明授权

US5735480A Relay apparatus for relative rotating members 失效
标题翻译：用于相对旋转构件的继电器
公开(公告)号：US5735480A
公开(公告)日：1998-04-07
申请号：US693947
申请日：1996-08-07
申请人： Kazuya Arai , Masakazu Umemura , Hiroyuki Okamoto , Takeshi Sakakibara , Satoshi Ishikawa , Hiraku Tanaka , Kazuhito Sakai
发明人： Kazuya Arai , Masakazu Umemura , Hiroyuki Okamoto , Takeshi Sakakibara , Satoshi Ishikawa , Hiraku Tanaka , Kazuhito Sakai
IPC分类号： B60R16/027 , B60R16/02 , H01R35/02 , H01R35/04 , B65H75/02 , H01R3/00
CPC分类号： B60R16/027 , H01R35/025
摘要： A relay apparatus for relatively rotating members includes a first member (rotating member) having an internal cylindrical portion, a second member (fixed member) having an external cylindrical portion which surrounds the internal cylindrical portion with a predetermined gap and is relatively rotated with respect to the internal cylindrical portion, a flexible flat cable which is stored along an annular space between the internal cylindrical portion and the external cylindrical portion to be spirally wound and which has an inner peripheral portion held by the internal cylindrical portion and an outer peripheral portion held by the external cylindrical portion, and a C-shaped moving member, movably arranged along the space, for inverting the flexible flat cable 13 in an opening portion 21c. One member of the first member 11 and the second member as rotatably driven and, has a flange formed on the cylindrical portion, and the moving member is arranged on the flange.
摘要翻译：用于相对旋转的构件的中继装置包括具有内圆柱形部分的第一构件（旋转构件），具有外圆柱形部分的第二构件（固定构件），该外圆柱形部分以预定间隙围绕内圆柱形部分并相对于内圆柱形部分，柔性扁平电缆，其沿着内圆柱形部分和外圆柱形部分之间的环形空间存储以被螺旋卷绕，并且具有由内部圆柱形部分保持的内周部分和由外部圆筒部分保持的外周部分外圆柱形部分和C形移动构件，其沿着该空间可移动地布置，用于在开口部分21c中翻转柔性扁平电缆13。第一构件11的一个构件和可旋转地驱动的第二构件，并且具有形成在圆筒部上的凸缘，并且移动构件布置在凸缘上。

8. 发明授权

US08800142B2 Package substrate unit and method for manufacturing package substrate unit 有权
标题翻译：封装衬底单元和用于制造封装衬底单元的方法
公开(公告)号：US08800142B2
公开(公告)日：2014-08-12
申请号：US12929680
申请日：2011-02-08
申请人： Hnin Nway San Nang , Kazuya Arai , Kei Fukui , Shinpei Ikegami , Yasuhito Takahashi , Hideaki Yoshimura , Hitoshi Suzuki
发明人： Hnin Nway San Nang , Kazuya Arai , Kei Fukui , Shinpei Ikegami , Yasuhito Takahashi , Hideaki Yoshimura , Hitoshi Suzuki
IPC分类号： H01K3/10 , H05K3/10
CPC分类号： H05K3/107 , B23K1/0016 , B23K3/0623 , B23K2101/42 , H01L23/49811 , H01L23/49822 , H01L2224/16225 , Y10T29/49165
摘要： A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.
摘要翻译：封装基板单元的半导体芯片安装层包括绝缘层，形成在绝缘层的顶表面上的导电种子金属层，形成在导电种子金属层的顶表面上的导电焊盘，基本上形成在金属柱导电焊盘的顶表面上的中心部分，以及形成为围绕导电焊盘和金属柱的阻焊层。

9. 发明授权

US08959758B2 Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device 有权
标题翻译：电路板的制造方法，电子装置的制造方法以及电子装置
公开(公告)号：US08959758B2
公开(公告)日：2015-02-24
申请号：US13426874
申请日：2012-03-22
申请人： Kazuya Arai , Shinpei Ikegami , Hitoshi Suzuki , Kei Fukui
发明人： Kazuya Arai , Shinpei Ikegami , Hitoshi Suzuki , Kei Fukui
IPC分类号： H05K3/00 , H01L21/48 , H05K3/46 , H01L23/498 , H01L23/00 , H05K1/11
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2924/01019 , H01L2924/01087 , H01L2924/12042 , H01L2924/15311 , H05K1/0298 , H05K1/0326 , H05K1/113 , H05K1/115 , H05K3/0097 , H05K3/4682 , H05K2201/10234 , H05K2203/0156 , H05K2203/1536 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.
摘要翻译：一种制造电路板的方法包括在支撑基板上形成第一电极，用第一绝缘层覆盖支撑基板和第一电极，抛光第一绝缘层以露出第一电极的第一表面，形成第一布线在暴露第一电极的第一表面之后的第一绝缘层上，第一布线连接到第一电极，并且在形成第一布线之后移除支撑基板以暴露第一电极的第二表面。

10. 发明申请

US20120067635A1 Package substrate unit and method for manufacturing package substrate unit 有权
标题翻译：封装衬底单元和用于制造封装衬底单元的方法
公开(公告)号：US20120067635A1
公开(公告)日：2012-03-22
申请号：US12929680
申请日：2011-02-08
申请人： Hnin Nway San Nang , Kazuya Arai , Kei Fukui , Shinpei Ikegami , Yasuhito Takahashi , Hideaki Yoshimura , Hitoshi Suzuki
发明人： Hnin Nway San Nang , Kazuya Arai , Kei Fukui , Shinpei Ikegami , Yasuhito Takahashi , Hideaki Yoshimura , Hitoshi Suzuki
IPC分类号： H05K1/18 , B23K1/20
CPC分类号： H05K3/107 , B23K1/0016 , B23K3/0623 , B23K2101/42 , H01L23/49811 , H01L23/49822 , H01L2224/16225 , Y10T29/49165
摘要： A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.
摘要翻译：封装基板单元的半导体芯片安装层包括绝缘层，形成在绝缘层的顶表面上的导电种子金属层，形成在导电种子金属层的顶表面上的导电焊盘，基本上形成在金属柱导电焊盘的顶表面上的中心部分，以及形成为围绕导电焊盘和金属柱的阻焊层。

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