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1. 发明授权

US07526859B2 Apparatus for manufacturing a wiring board 失效
标题翻译：电路板制造装置
公开(公告)号：US07526859B2
公开(公告)日：2009-05-05
申请号：US11580162
申请日：2006-10-13
申请人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
发明人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
IPC分类号： B23P19/00
CPC分类号： B32B38/162 , B32B38/1858 , B32B2038/1891 , B32B2309/65 , B32B2457/08 , H05K3/1216 , H05K3/26 , H05K3/4069 , H05K3/4647 , H05K2201/0355 , H05K2203/066 , H05K2203/082 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/4922 , Y10T29/49991 , Y10T29/5136 , Y10T29/5137 , Y10T29/53061 , Y10T29/5313 , Y10T29/5317 , Y10T29/53174 , Y10T29/53187 , Y10T29/532 , Y10T29/53243 , Y10T29/53261 , Y10T29/53539
摘要： The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
摘要翻译：用于制造布线替代品的装置包括具有片材循环的电路的运送器; 用于在片材上印刷导电膏的丝网印刷机; 用于计数在片材上印刷导电糊的次数的计数器; 以及当计数的数量达到预设数量时从电路中弹出纸张的分配器。因此，可以以高生产率自动地在导电箔上形成具有均匀性质的导电柱。

2. 发明授权

US07134193B2 Method for manufacturing a wiring board 有权
标题翻译：线路板制造方法
公开(公告)号：US07134193B2
公开(公告)日：2006-11-14
申请号：US11023478
申请日：2004-12-29
申请人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
发明人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
IPC分类号： H01R43/00
CPC分类号： B32B38/162 , B32B38/1858 , B32B2038/1891 , B32B2309/65 , B32B2457/08 , H05K3/1216 , H05K3/26 , H05K3/4069 , H05K3/4647 , H05K2201/0355 , H05K2203/066 , H05K2203/082 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/4922 , Y10T29/49991 , Y10T29/5136 , Y10T29/5137 , Y10T29/53061 , Y10T29/5313 , Y10T29/5317 , Y10T29/53174 , Y10T29/53187 , Y10T29/532 , Y10T29/53243 , Y10T29/53261 , Y10T29/53539
摘要： The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
摘要翻译：用于制造布线替代品的装置包括具有片材循环的电路的运送器; 用于在片材上印刷导电膏的丝网印刷机; 用于计数在片材上印刷导电糊的次数的计数器; 以及当计数的数量达到预设数量时从电路中弹出纸张的分配器。因此，可以以高生产率自动地在导电箔上形成具有均匀性质的导电柱。

3. 发明授权

US06507995B1 Apparatus for manufacturing a wiring substrate 失效
标题翻译：用于制造布线基板的装置
公开(公告)号：US06507995B1
公开(公告)日：2003-01-21
申请号：US09093605
申请日：1998-06-09
申请人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
发明人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
IPC分类号： B23P1900
CPC分类号： B32B38/162 , B32B38/1858 , B32B2038/1891 , B32B2309/65 , B32B2457/08 , H05K3/1216 , H05K3/26 , H05K3/4069 , H05K3/4647 , H05K2201/0355 , H05K2203/066 , H05K2203/082 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/4922 , Y10T29/49991 , Y10T29/5136 , Y10T29/5137 , Y10T29/53061 , Y10T29/5313 , Y10T29/5317 , Y10T29/53174 , Y10T29/53187 , Y10T29/532 , Y10T29/53243 , Y10T29/53261 , Y10T29/53539
摘要： The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
摘要翻译：用于制造布线替代品的装置包括具有片材循环的电路的运送器; 用于在片材上印刷导电膏的丝网印刷机; 用于计数在片材上印刷导电糊的次数的计数器; 以及当计数的数量达到预设数量时从电路中弹出纸张的分配器。因此，可以以高生产率自动地在导电箔上形成具有均匀性质的导电柱。

4. 发明申请

US20070044294A1 Apparatus for manufacturing a wiring board and method for manufacturin a wiring board 失效
标题翻译：一种布线板的制造装置及其制造方法
公开(公告)号：US20070044294A1
公开(公告)日：2007-03-01
申请号：US11580162
申请日：2006-10-13
申请人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
发明人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
IPC分类号： B23P23/00 , H05K3/36
CPC分类号： B32B38/162 , B32B38/1858 , B32B2038/1891 , B32B2309/65 , B32B2457/08 , H05K3/1216 , H05K3/26 , H05K3/4069 , H05K3/4647 , H05K2201/0355 , H05K2203/066 , H05K2203/082 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/4922 , Y10T29/49991 , Y10T29/5136 , Y10T29/5137 , Y10T29/53061 , Y10T29/5313 , Y10T29/5317 , Y10T29/53174 , Y10T29/53187 , Y10T29/532 , Y10T29/53243 , Y10T29/53261 , Y10T29/53539
摘要： The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
摘要翻译：用于制造布线替代品的装置包括具有片材循环的电路的运送器; 用于在片材上印刷导电膏的丝网印刷机; 用于计数在片材上印刷导电糊的次数的计数器; 以及当计数的数量达到预设数量时从电路中弹出纸张的分配器。因此，可以以高生产率自动地在导电箔上形成具有均匀性质的导电柱。

5. 发明申请

US20050115068A1 Apparatus for manufacturing a wiring board and method for manufacturing a wiring board 有权
标题翻译：线路板的制造装置及配线基板的制造方法
公开(公告)号：US20050115068A1
公开(公告)日：2005-06-02
申请号：US11023478
申请日：2004-12-29
申请人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
发明人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
IPC分类号： H05K3/46 , H05K3/12 , H05K3/40 , H05K3/20 , B23P19/00
CPC分类号： B32B38/162 , B32B38/1858 , B32B2038/1891 , B32B2309/65 , B32B2457/08 , H05K3/1216 , H05K3/26 , H05K3/4069 , H05K3/4647 , H05K2201/0355 , H05K2203/066 , H05K2203/082 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/4922 , Y10T29/49991 , Y10T29/5136 , Y10T29/5137 , Y10T29/53061 , Y10T29/5313 , Y10T29/5317 , Y10T29/53174 , Y10T29/53187 , Y10T29/532 , Y10T29/53243 , Y10T29/53261 , Y10T29/53539
摘要： The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
摘要翻译：用于制造布线替代品的装置包括具有片材循环的电路的运送器; 用于在片材上印刷导电膏的丝网印刷机; 用于计数在片材上印刷导电糊的次数的计数器; 以及当计数的数量达到预设数量时从电路中弹出纸张的分配器。因此，可以以高生产率自动地在导电箔上形成具有均匀性质的导电柱。

6. 发明授权

US06865801B2 Apparatus for manufacturing a wiring board 失效
标题翻译：电路板制造装置
公开(公告)号：US06865801B2
公开(公告)日：2005-03-15
申请号：US09897998
申请日：2001-07-05
申请人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
发明人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
IPC分类号： H05K3/46 , H05K3/12 , H05K3/40 , H05K3/10
CPC分类号： B32B38/162 , B32B38/1858 , B32B2038/1891 , B32B2309/65 , B32B2457/08 , H05K3/1216 , H05K3/26 , H05K3/4069 , H05K3/4647 , H05K2201/0355 , H05K2203/066 , H05K2203/082 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/4922 , Y10T29/49991 , Y10T29/5136 , Y10T29/5137 , Y10T29/53061 , Y10T29/5313 , Y10T29/5317 , Y10T29/53174 , Y10T29/53187 , Y10T29/532 , Y10T29/53243 , Y10T29/53261 , Y10T29/53539
摘要： The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
摘要翻译：用于制造布线替代品的装置包括具有片材循环的电路的运送器; 用于在片材上印刷导电膏的丝网印刷机; 用于计数在片材上印刷导电糊的次数的计数器; 以及当计数的数量达到预设数量时从电路中弹出纸张的分配器。因此，可以以高生产率自动地在导电箔上形成具有均匀性质的导电柱。

7. 发明授权

US5865934A Method of manufacturing printed wiring boards 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US5865934A
公开(公告)日：1999-02-02
申请号：US902100
申请日：1997-07-29
申请人： Yuichi Yamamoto , Yoshizumi Sato , Tomohisa Motomura , Hiroshi Hamano , Yasushi Arai
发明人： Yuichi Yamamoto , Yoshizumi Sato , Tomohisa Motomura , Hiroshi Hamano , Yasushi Arai
IPC分类号： H05K1/09 , H05K1/11 , H05K3/20 , H05K3/40 , H05K3/42 , H05K3/46 , H05K3/10
CPC分类号： H05K3/4658 , H05K1/115 , H05K3/4069 , H05K3/4617 , H05K3/4647 , H05K1/095 , H05K2201/0355 , H05K2201/096 , H05K2201/09627 , H05K2201/09645 , H05K2203/068 , H05K2203/1189 , H05K2203/1572 , H05K3/20 , H05K3/429 , H05K3/4652 , Y10T156/109 , Y10T29/49151 , Y10T29/49222
摘要： There is provided a method for arranging conductive bumps at predetermined positions penetrated through an insulating layer during a press integration stage to ensure electrical and thermal conductivities between a wiring pattern and a conductive metal as well as electrical connections between the wiring patterns. More specifically, the sharp tip of the conductive bump is subjected to plastic deformation to form the interconnections between the wiring patterns or between the wiring pattern and the conductive metal. Also provided is a method of manufacturing a printed wiring board. A synthetic resin sheet is sandwiched by the surface on which conductive bumps are formed into a laminate. The laminate is heated until the resin component of the synthetic resin sheet being is in a plastic state or up to a temperature not lower than the grass transition temperature of that resin. At that time, the conductive bumps are forced against the synthetic resin sheet and are penetrated therethrough. This permits positive connections with a high accuracy without forming a through-hole.
摘要翻译：提供了一种在压制一体化阶段期间在穿过绝缘层的预定位置布置导电凸块的方法，以确保布线图案和导电金属之间的电和热导率以及布线图案之间的电连接。更具体地，导电凸块的尖端经受塑性变形以形成布线图案之间或布线图案与导电金属之间的互连。还提供了制造印刷线路板的方法。合成树脂片被形成有导电凸块的表面夹在层叠体中。将层压体加热直到合成树脂片的树脂成分处于塑性状态或达到不低于该树脂的草转变温度的温度。此时，导电性凸块被压在合成树脂片上并穿过其中。这样可以在不形成通孔的情况下高精度地进行正向连接。

8. 发明授权

US5736681A Printed wiring board having an interconnection penetrating an insulating layer 失效
标题翻译：具有贯穿绝缘层的互连的印刷电路板
公开(公告)号：US5736681A
公开(公告)日：1998-04-07
申请号：US297954
申请日：1994-08-31
申请人： Yuichi Yamamoto , Yoshizumi Sato , Tomohisa Motomura , Hiroshi Hamano , Yasushi Arai
发明人： Yuichi Yamamoto , Yoshizumi Sato , Tomohisa Motomura , Hiroshi Hamano , Yasushi Arai
IPC分类号： H05K1/09 , H05K1/11 , H05K3/20 , H05K3/40 , H05K3/42 , H05K3/46 , H05K1/02
CPC分类号： H05K3/4658 , H05K1/115 , H05K3/4069 , H05K3/4617 , H05K3/4647 , H05K1/095 , H05K2201/0355 , H05K2201/096 , H05K2201/09627 , H05K2201/09645 , H05K2203/068 , H05K2203/1189 , H05K2203/1572 , H05K3/20 , H05K3/429 , H05K3/4652 , Y10T156/109 , Y10T29/49151 , Y10T29/49222
摘要： There are provided conductive bumps arranged at predetermined positions penetrated through an insulating layer during a press integration stage to ensure electrical and thermal conductivities between a wiring pattern and a conductive metal as well as electrical connections between the wiring patterns. More specifically, the sharp tip of the conductive bump is subjected to plastic deformation to form the interconnections between the wiring patterns or between the wiring pattern and the conductive metal. Also provided is a method of manufacturing a printed wiring board. A synthetic resin sheet is sandwiched by the surface on which conductive bumps are formed into a laminate. The laminate is heated until the resin component of the synthetic resin sheet in a plastic state or up to a temperature not lower than the glass transition temperature of that resin. At that time, the conductive bumps are forced against the synthetic resin sheet and are penetrated therethrough. This permits positive connections with a high accuracy without forming a through-hole.
摘要翻译：在压制一体化阶段期间，设置有穿过绝缘层的预定位置处的导电凸块，以确保布线图案和导电金属之间的电导率和热导率以及布线图案之间的电连接。更具体地，导电凸块的尖端经受塑性变形以形成布线图案之间或布线图案与导电金属之间的互连。还提供了制造印刷线路板的方法。合成树脂片被形成有导电凸块的表面夹在层叠体中。将层压体加热至塑料状态的合成树脂片的树脂成分为止或达到不低于该树脂的玻璃化转变温度的温度。此时，导电性凸块被压在合成树脂片上并穿过其中。这样可以在不形成通孔的情况下高精度地进行正向连接。

9. 发明授权

US08304742B2 Radiation detector using gas amplification and method for manufacturing the same 有权
标题翻译：使用气体放大的放射检测器及其制造方法
公开(公告)号：US08304742B2
公开(公告)日：2012-11-06
申请号：US13480504
申请日：2012-05-25
申请人： Tomohisa Motomura , Osamu Shimada
发明人： Tomohisa Motomura , Osamu Shimada
IPC分类号： H01L21/00 , G01T1/24
CPC分类号： G01T1/185 , Y10T29/49156
摘要： A radiation detector using gas amplification includes: a first electrode pattern which is formed on a first surface of an insulating member and has a plurality of circular openings; and a second electrode pattern which is formed on a second surface of the insulating member opposite to the first surface thereof and has convex portions of which respective forefronts are exposed to centers of the openings of the first electrode pattern; wherein a predetermined electric potential is set between the first electrode pattern and the second electrode pattern; wherein edges of the first electrode pattern exposing to the openings are shaped in respective continuous first curved surfaces by covering the edges thereof with a first solder material.
摘要翻译：使用气体放大的放射线检测器包括：第一电极图案，其形成在绝缘构件的第一表面上并且具有多个圆形开口; 以及第二电极图案，其形成在与所述绝缘构件的与所述第一表面相反的第二表面上，并且其前表面的凸部暴露于所述第一电极图案的所述开口的中心; 其中在所述第一电极图案和所述第二电极图案之间设置预定电位; 其中暴露于开口的第一电极图案的边缘通过用第一焊料材料覆盖其边缘而在相应的连续的第一弯曲表面中成形。

10. 发明授权

US08207505B2 Radiation detector using gas amplication and method for manufacturing the same 有权
标题翻译：使用气体放大的放射检测器及其制造方法
公开(公告)号：US08207505B2
公开(公告)日：2012-06-26
申请号：US12489235
申请日：2009-06-22
申请人： Tomohisa Motomura , Osamu Shimada
发明人： Tomohisa Motomura , Osamu Shimada
IPC分类号： G01T1/18
CPC分类号： G01T1/185 , Y10T29/49156
摘要： A radiation detector using gas amplification includes: a first electrode pattern which is formed on a first surface of an insulating member and has a plurality of circular openings; and a second electrode pattern which is formed on a second surface of the insulating member opposite to the first surface thereof and has convex portions of which respective forefronts are exposed to centers of the openings of the first electrode pattern; wherein a predetermined electric potential is set between the first electrode pattern and the second electrode pattern; wherein edges of the first electrode pattern exposing to the openings are shaped in respective continuous first curved surfaces by covering the edges thereof with a first solder material.
摘要翻译：使用气体放大的放射线检测器包括：第一电极图案，其形成在绝缘构件的第一表面上并且具有多个圆形开口; 以及第二电极图案，其形成在与所述绝缘构件的与所述第一表面相反的第二表面上，并且其前表面的凸部暴露于所述第一电极图案的所述开口的中心; 其中在所述第一电极图案和所述第二电极图案之间设置预定电位; 其中暴露于开口的第一电极图案的边缘通过用第一焊料材料覆盖其边缘而在相应的连续的第一弯曲表面中成形。

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