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1. 发明授权

US5839348A Moving cylinder apparatus 失效
标题翻译：移动缸装置
公开(公告)号：US5839348A
公开(公告)日：1998-11-24
申请号：US786563
申请日：1997-01-21
申请人： Kenji Iida , Shuji Ono , Ken Kobayashi
发明人： Kenji Iida , Shuji Ono , Ken Kobayashi
IPC分类号： F15B15/04 , F15B15/14 , F15B15/22 , F15B15/28 , F16J10/00 , F01B15/02
CPC分类号： F15B15/1471 , F15B15/04 , F15B15/1466
摘要： A cylinder apparatus includes a base plate, a piston fixed to the base plate and having a piston head and a piston rod connected thereto, a cylinder body having a cylinder chamber defined on one side of the piston head and a cylinder chamber defined on another side of the piston head around the piston rod, the cylinder body being supported for reciprocating movement with respect to the base plate in axial directions of the piston, an upper plate fixed to the cylinder body, and a bushing held in slidable contact with an outer circumferential wall surface of the cylinder body for guiding the reciprocating movement of the cylinder body.
摘要翻译：气缸装置包括基板，固定到基板并具有连接到其上的活塞头和活塞杆的活塞，具有限定在活塞头的一侧上的气缸室的缸体和在另一侧限定的气缸室所述活塞头围绕所述活塞杆，所述缸体被支撑成相对于所述基板在所述活塞的轴向方向上往复运动，固定到所述缸体的上板，以及保持与所述活塞杆的外周面滑动接触的衬套缸体的壁面用于引导缸体的往复运动。

2. 发明授权

US5669283A Cylinder apparatus 失效
标题翻译：气缸装置
公开(公告)号：US5669283A
公开(公告)日：1997-09-23
申请号：US582911
申请日：1996-01-04
申请人： Kenji Iida , Shuji Ono , Ken Kobayashi
发明人： Kenji Iida , Shuji Ono , Ken Kobayashi
IPC分类号： F15B15/04 , F15B15/14 , F15B15/22 , F15B15/28 , F16J10/00 , F01B15/02
CPC分类号： F15B15/1471 , F15B15/04 , F15B15/1466
摘要： A cylinder apparatus includes a base plate, a piston fixed to the base plate and having a piston head and a piston rod connected thereto, a cylinder body having a cylinder chamber defined on one side of the piston head and a cylinder chamber defined on another side of the piston head around the piston rod, the cylinder body being supported for reciprocating movement with respect to the base plate in axial directions of the piston, an upper plate fixed to the cylinder body, and a bushing held in slidable contact with an outer circumferential wall surface of the cylinder body for guiding the reciprocating movement of the cylinder body.
摘要翻译：气缸装置包括基板，固定到基板并具有连接到其上的活塞头和活塞杆的活塞，具有限定在活塞头的一侧上的气缸室的缸体和在另一侧限定的气缸室所述活塞头围绕所述活塞杆，所述缸体被支撑成相对于所述基板在所述活塞的轴向方向上往复运动，固定到所述缸体的上板，以及保持与所述活塞杆的外周面滑动接触的衬套缸体的壁面用于引导缸体的往复运动。

3. 发明授权

US09077019B2 Electricity storage device and vehicle 有权
标题翻译：蓄电装置及车辆
公开(公告)号：US09077019B2
公开(公告)日：2015-07-07
申请号：US13819003
申请日：2011-08-30
申请人： Akihiro Kosaki , Shigeru Fukuda , Shigeto Ozaki , Kaoru Tsuge , Kenji Iida , Takenori Kobayashi , Motonari Tejima
发明人： Akihiro Kosaki , Shigeru Fukuda , Shigeto Ozaki , Kaoru Tsuge , Kenji Iida , Takenori Kobayashi , Motonari Tejima
IPC分类号： H01M2/10 , H01G9/00 , H01G11/18 , H01M10/625 , H01M10/6563 , H01M10/647 , H01M10/6554 , H01M10/613 , B60K1/04 , H01M10/0525 , H01M10/34
CPC分类号： H01M2/1077 , B60K1/04 , B60K2001/0438 , H01G9/155 , H01G11/18 , H01M2/1083 , H01M10/0525 , H01M10/345 , H01M10/613 , H01M10/625 , H01M10/647 , H01M10/6554 , H01M10/6563 , Y02E60/122 , Y02E60/124 , Y02E60/13 , Y02T10/7011 , Y02T10/7022
摘要： An electricity storage device includes a first battery stack (15), a second battery stack (11 to 14), and a case (22) that accommodates the first battery stack and the second battery stack. Each of the first battery stack and the second battery stack includes a plurality of cells (151) that are aligned and the second battery stack is placed under the first battery stack. The supporting member (80) that supports the first battery stack is placed between the first battery stack and the second battery stack and is fixed to the case.
摘要翻译：电力存储装置包括第一电池组（15），第二电池组（11〜14）和容纳第一电池组和第二电池组的壳体（22）。第一电池堆和第二电池堆中的每一个包括多个单元（151），其被对准并且第二电池堆放置在第一电池堆下方。支撑第一电池堆的支撑构件（80）被放置在第一电池堆和第二电池堆之间并且被固定到壳体。

4. 发明申请

US20140186662A1 BUS BAR CASE, ELECTRIC STORAGE APPARATUS, AND VEHICLE 审中-公开
标题翻译： BUS BAR CASE，电动储存装置和车辆
公开(公告)号：US20140186662A1
公开(公告)日：2014-07-03
申请号：US14118030
申请日：2011-07-13
申请人： Akihiro Kosaki , Kenji Iida
发明人： Akihiro Kosaki , Kenji Iida
IPC分类号： H01M2/12
CPC分类号： H01M2/1252 , H01M2/1077 , H01M2/1217 , H01M2/1223 , H01M2/206 , H01M2220/20
摘要： A bus bar case includes a bus bar holding portion unifying and holding a plurality of bus bars for electrically connecting adjacent cells of a plurality of cells arranged in a predetermined direction, each of the cells having a gas discharge valve, and a hose holding portion provided integrally with the bus bar holding portion and holding an exhaust gas hose for directing gas discharged through the gas discharge valve in the predetermined direction, the gas discharge valve being provided for each of the plurality of cells, wherein the hose holding portion has a recess portion forming a space for passing the exhaust gas hose between the hose holding portion and an upper face of the cell when the plurality of bus bars held by the bus bar holding portion are fixed to the plurality of cells.
摘要翻译：汇流条外壳包括汇流条保持部分，统一并保持用于电连接沿预定方向布置的多个单元的相邻单元的多个汇流条，每个单元具有气体排出阀，以及提供的软管保持部与母线保持部一体地保持有排气软管，用于引导通过排气阀沿预定方向排出的气体，为多个电池单元设置排气阀，其中软管保持部分具有凹部当由所述汇流条保持部保持的所述多个汇流条被固定到所述多个单元时，形成用于使所述软管保持部和所述单元的上表面之间通过所述排气软管的空间。

5. 发明申请

US20120092846A1 JUNCTION BLOCK, AND VEHICLE 有权
标题翻译：连接块和车辆
公开(公告)号：US20120092846A1
公开(公告)日：2012-04-19
申请号：US13380533
申请日：2010-06-29
申请人： Akihiro Kosaki , Masaaki Iwabe , Kenji Iida , Yoshinobu Furuya , Yoshiaki Ichikawa
发明人： Akihiro Kosaki , Masaaki Iwabe , Kenji Iida , Yoshinobu Furuya , Yoshiaki Ichikawa
IPC分类号： H01R9/24
CPC分类号： B60R16/0238
摘要： A junction block (40) includes a generally rectangular flat plate portion (42) attached to a side surface of an assembled battery. A control device (50) is disposed over a portion of the flat plate portion (42) which includes a middle of the flat plate portion (42) and which is positionally biased toward a lower side end of the flat plate portion (42). A connector-connecting portion (47) is provided in one of the four corners of the flat plate portion (42) that is a rear end corner of an upper side end opposite the lower side end of the flat plate portion (42). A rib (48) and a connector-connecting portion (49) are provided at a location on the flat plate portion (42) at which the rib (4) and the connector-connecting portion (49) clamp the electric power cable (28) that is connected to the connector-connecting portion (47) and that is laid along the upper side of the flat plate portion (42).
摘要翻译：连接块（40）包括附接到组电池的侧表面的大致矩形的平板部分（42）。控制装置（50）设置在平板部分（42）的包括平板部分（42）的中间部分并且朝向平板部分（42）的下侧端部位置偏压的部分上。连接器连接部分（47）设置在与平板部分（42）的下侧端相对的上侧端的后端角的平板部分（42）的四个拐角中的一个角上。在平板部分（42）上的肋（4）和连接器连接部分（49）夹住电力电缆（28）的位置处设置肋（48）和连接器连接部分（49））连接到连接器连接部分（47）并且沿着平板部分（42）的上侧布置。

6. 发明授权

US08119925B2 Core substrate and printed wiring board 有权
标题翻译：核心基板和印刷线路板
公开(公告)号：US08119925B2
公开(公告)日：2012-02-21
申请号：US12390010
申请日：2009-02-20
申请人： Hideaki Yoshimura , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Takashi Nakagawa , Shin Hirano
发明人： Hideaki Yoshimura , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Takashi Nakagawa , Shin Hirano
IPC分类号： H05K1/00
CPC分类号： H05K3/4641 , H05K3/445 , H05K3/4608 , H05K2201/0281 , H05K2201/0323 , H05K2201/09536 , H05K2201/09809 , Y10T428/24331
摘要： The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate.
摘要翻译：核心基材的芯层由浸渍有树脂的碳纤维制成。当芯层的温度升高时，由于树脂的热膨胀，芯层的厚度增加。芯层夹在包含玻璃纤维的绝缘层之间。绝缘层用于抑制由芯层的热膨胀产生的芯层的厚度的增加。核心基板中的热应力被抑制。

7. 发明授权

US08110749B2 Printed wiring board 失效
标题翻译：印刷电路板
公开(公告)号：US08110749B2
公开(公告)日：2012-02-07
申请号：US12390168
申请日：2009-02-20
申请人： Hideaki Yoshimura , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano
发明人： Hideaki Yoshimura , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano
IPC分类号： H05K1/16
CPC分类号： H05K3/445 , H05K3/4608 , H05K2201/0323 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09609 , H05K2201/09809
摘要： Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer.
摘要翻译：在印刷电路板的芯层中形成大尺寸的通孔。大尺寸通孔沿着位于特定区域内的大尺寸通孔的内壁表面形成为圆柱体的形状。填充材料填充大尺寸通孔的内部空间。小尺寸的通孔穿过相应的填充材料沿着小尺寸通孔的纵向轴线。小尺寸的通孔沿着小尺寸通孔的内壁表面形成为圆柱体的形状。填充材料和芯层均匀地分布在芯基板的面内方向的特定区域内。这导致抑制芯层在芯层的面内方向上的热应力的不均匀分布。

8. 发明授权

US07943001B2 Process for producing multilayer board 有权
标题翻译：多层板生产工艺
公开(公告)号：US07943001B2
公开(公告)日：2011-05-17
申请号：US11649203
申请日：2007-01-04
申请人： Takashi Nakagawa , Seiichi Sugano , Kenji Iida , Yasutomo Maehara , Hitoshi Suzuki , Kaoru Sugimoto , Kenji Fukuzono , Takashi Kanda , Hiroaki Date , Tomohisa Yagi
发明人： Takashi Nakagawa , Seiichi Sugano , Kenji Iida , Yasutomo Maehara , Hitoshi Suzuki , Kaoru Sugimoto , Kenji Fukuzono , Takashi Kanda , Hiroaki Date , Tomohisa Yagi
IPC分类号： H04K3/34
CPC分类号： H05K3/4614 , H05K3/321 , H05K3/361 , H05K3/4069 , H05K2201/0218 , H05K2203/0425 , H05K2203/0568 , H05K2203/063 , Y10T29/49117
摘要： A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.
摘要翻译：一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成，金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

9. 发明申请

US20080142256A1 Wiring board manufacturing method 有权
公开(公告)号：US20080142256A1
公开(公告)日：2008-06-19
申请号：US12068992
申请日：2008-02-14
申请人： Takashi Shuto , Kenji Takano , Kenji Iida , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
发明人： Takashi Shuto , Kenji Takano , Kenji Iida , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
IPC分类号： H05K3/02 , H05K1/11
CPC分类号： H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

10. 发明申请

US20060108147A1 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US20060108147A1
公开(公告)日：2006-05-25
申请号：US11320965
申请日：2005-12-30
申请人： Tomoyuki Abe , Nobuyuki Hayashi , Motoaki Tani , Kenichiro Abe , Kenji Iida
发明人： Tomoyuki Abe , Nobuyuki Hayashi , Motoaki Tani , Kenichiro Abe , Kenji Iida
IPC分类号： H05K1/11 , H01R12/04
CPC分类号： G01R1/07314 , G01R1/44 , H05K1/0366 , H05K1/056 , H05K1/117 , H05K3/429 , H05K3/4608 , H05K3/4623 , H05K3/4641 , H05K3/4688 , H05K2201/0323 , H05K2201/0919 , H05K2201/09536 , H05K2201/09845 , H05K2203/061
摘要： A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers. The second substrate has the outline different from that of the first substrate. A stepped surface is defined on the front surface at least of the first substrate. Electrodes can be formed on the stepped surface as well as on the back surface of the first substrate and the front surface of the second substrate. This structure enables detection of an electric signal from the stepped surface. A further flexibility can thus be achieved in locating electrodes as compared with a conventional printed wiring board having uniform substrates simply superimposed on each other. This results in an expanded use or purpose for a printed wiring board.
摘要翻译：印刷电路板由彼此重叠的第一和第二基板制成。第一和第二基板分别包括由含有碳纤维的树脂制成的芯层。第二基板具有与第一基板的轮廓不同的轮廓。至少在第一基板的表面上限定有台阶面。电极可以形成在台阶表面以及第一基板的背面和第二基板的前表面上。该结构能够检测来自台阶表面的电信号。因此与具有简单地叠加的均匀基板的传统印刷线路板相比，可以在定位电极方面实现更大的灵活性。这导致印刷电路板的使用或目的的扩大。

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