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    • 4. 发明授权
    • Postive photoresist composition
    • 光刻胶组合物
    • US5529881A
    • 1996-06-25
    • US404985
    • 1995-03-16
    • Yasumasa KawabeKenichiro SatoToshiaki AoaiKazuya Uenishi
    • Yasumasa KawabeKenichiro SatoToshiaki AoaiKazuya Uenishi
    • G03F7/022G03F7/039H01L21/027G03F7/023G03F7/30
    • G03F7/022
    • A positive photoresist composition for super fine working is disclosed, which comprises (a) an alkali-soluble resin and (b) as a photosensitive compound the 1,2-naphthoquinonediazido-5-(and/or -4-)sulfonic acid ester of a polyhydroxy compound represented by formula (I) or (II), wherein in a high-speed liquid chromatography measured using a ultraviolet ray of 254 nm, the pattern of the diester component and the pattern of the complete ester component of said 1,2-naphthoquinonediazido-5-(and/or -4-)sulfonic acid of the polyhydroxy compound shown by formula (I) or (II) are at least 50% and less than 40%, respectively, of the whole pattern areas; ##STR1## wherein R.sub.1 to R.sub.11, which may be the same or different, each represents a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, or a cycloalkyl group, with the proviso that at least one of R.sub.1 to R.sub.11 is a cycloalkyl group, and R.sub.12 to R.sub.22, which may be the same or different, each represents a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, or a cycloalkyl group, with the proviso that at least one of R.sub.12 to R.sub.22 is a cycloalkyl group. The photoresist composition has a high resolving power and a less layer thickness reliance of the resolving power, and a wide development latitude, is reluctant to form a development residue, and further has a very excellent storage stability, and does not deposit the photosensitive material and does not form microgels with the passage of time.
    • 公开了一种用于超细加工的正性光致抗蚀剂组合物,其包含(a)碱溶性树脂和(b)作为光敏化合物的1,2-萘醌二叠氮基-5-(和/或-4-)磺酸酯 由式(I)或(II)表示的多羟基化合物,其中在使用254nm的紫外线测量的高速液相色谱中,所述二酯组分的图案和所述1,2的完全酯组分的图案 式(I)或(II)所示的多羟基化合物的萘醌二叠氮基-5-(和/或-4-)磺酸分别为整个图案区域的至少50%且小于40%; 1, 其可以相同或不同,各自表示氢原子,卤素原子,烷基,烷氧基或环烷基,条件是R 1至R 11中的至少一个为环烷基,R 12至 R 22可以相同或不同,各自表示氢原子,卤素原子,烷基,烷氧基,o 环烷基,条件是R12至R22中的至少一个为环烷基。 光致抗蚀剂组合物具有高的分辨能力和较小的层厚度的分辨能力依赖性,并且广泛的开发范围不愿形成显影残留物,并且还具有非常优异的储存稳定性,并且不沉积感光材料和 随着时间的推移不会形成微凝胶。
    • 6. 发明授权
    • Positive-working resist composition
    • 正面抗蚀剂组成
    • US06602646B1
    • 2003-08-05
    • US09684888
    • 2000-10-06
    • Kenichiro SatoKunihiko KodamaToshiaki Aoai
    • Kenichiro SatoKunihiko KodamaToshiaki Aoai
    • G03F7004
    • G03F7/039G03F7/0045Y10S430/106
    • The present invention provides a high sensitivity chemically amplified positive-working resist composition which eliminates edge roughness on pattern and provides an excellent resist pattern profile. A novel positive-working resist composition is provided comprising (A) a resin containing an alkali-soluble group protected by at least one of moieties containing alicyclic hydrocarbon represented by general formulae (pI) to (pVI) and having a monomer component content of 5% or less of the total pattern area as determined by gel permeation chromatography (GPC), which increases in its solution velocity with respect to an alkaline developer by the action of an acid and (B) a compound which is capable of generating an acid by irradiation with an active ray or radiation.
    • 本发明提供一种消除图案上的边缘粗糙度并提供优异的抗蚀剂图案轮廓的高灵敏度化学放大正性抗蚀剂组合物。 提供了一种新型的正性抗蚀剂组合物,其包含(A)含有由至少一个含有由通式(pI)至(pVI)表示的脂环族烃部分并且单体组分含量为5的部分保护的碱溶性基团的树脂 通过凝胶渗透色谱法(GPC)确定的总图案面积的百分比或更少,其通过酸的作用相对于碱性显影剂的溶液速度增加,和(B)能够产生酸的化合物 用活性射线或辐射照射。
    • 7. 发明授权
    • Positive photoresist composition
    • 正光致抗蚀剂组合物
    • US06576392B1
    • 2003-06-10
    • US09456827
    • 1999-12-06
    • Kenichiro SatoKunihiko KodamaToshiaki AoaiHidekazu Ohashi
    • Kenichiro SatoKunihiko KodamaToshiaki AoaiHidekazu Ohashi
    • G03C173
    • G03F7/0045G03F7/0397Y10S430/106Y10S430/111Y10S430/115
    • A positive photoresist composition comprising a photo-acid gererator and a specific resin. The resin contains repeating units each having a group represented by formula (I): —SO2—O—R wherein R represents an optionally substituted alkyl, cycloalkyl, or alkenyl group and comes to have an increased rate of dissolution in an alkaline developing solution by the action of an acid, or contains alkali-soluble groups protected by partial structures containing an alicyclic hydrocarbon and represented by at least one of formulae (pI) to (pVI) defined in the specification and which decomposes by the action of an acid to have enhanced solubility in an alkali. The latter is used in combination with a compound which decomposes by the action of an acid to generate a sulfonic acid.
    • 一种正型光致抗蚀剂组合物,其包含光酸注射器和特定树脂。 树脂含有各自具有由式(I)表示的基团的重复单元:其中R表示任选取代的烷基,环烷基或烯基,并且通过酸的作用使碱显影溶液的溶解速率增加, 或含有由说明书中定义的至少一种式(pI)至(pVI)表示的含有脂环族烃的部分结构保护的碱溶性基团,其通过酸的作用而分解,从而具有增强的在碱中的溶解度。 后者与通过酸的作用分解以产生磺酸的化合物组合使用。
    • 8. 发明授权
    • Positive photosensitive composition
    • US06517991B1
    • 2003-02-11
    • US09606681
    • 2000-06-30
    • Kunihiko KodamaKenichiro SatoToshiaki Aoai
    • Kunihiko KodamaKenichiro SatoToshiaki Aoai
    • G03F7004
    • G03F7/0397G03F7/0045Y10S430/106Y10S430/111
    • A positive photosensitive composition comprising (A) a compound which generates an acid upon irradiation with an actinic ray or radiation, and (B-1) a resin having a group which is decomposed by the action of an acid to increase solubility in an alkaline developing solution and containing at least one structure represented by formulae (I), (II) and (III) as described in the specification or (B-2) a resin having at least one monovalent polyalicyclic group represented by formula (Ib) as described in the specification and a group which is decomposed by the action of an acid to increase solubility in an alkaline developing solution. The positive photosensitive composition containing the resin according to the present invention has high transmittance to far ultraviolet light particularly having a wavelength of 220 nm or less and exhibits good dry etching resistance. Further, the positive photosensitive composition exhibits high sensitivity, good resolution and good pattern profile when far ultraviolet light having a wavelength of 250 nm or less, particularly 220 nm or less (especially an ArF excimer laser beam) is employed as an exposure light source, and thus it can be effectively employed for the formation of fine pattern necessary for the production of semiconductor elements.