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1. 发明申请

US20100133530A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100133530A1
公开(公告)日：2010-06-03
申请号：US12624888
申请日：2009-11-24
申请人： Kengo AKIMOTO , Toshinari SASAKI , Hideaki KUWABARA
发明人： Kengo AKIMOTO , Toshinari SASAKI , Hideaki KUWABARA
IPC分类号： H01L29/786 , H01L21/34
CPC分类号： H01L29/66969 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L27/1225 , H01L29/45 , H01L29/66742 , H01L29/786 , H01L29/78606 , H01L29/7869 , H01L29/78696
摘要： An object is, in a thin film transistor in which an oxide semiconductor is used as an active layer, to prevent change in composition, film quality, an interface, or the like of an oxide semiconductor region serving as an active layer, and to stabilize electrical characteristics of the thin film transistor. In a thin film transistor in which a first oxide semiconductor region is used as an active layer, a second oxide semiconductor region having lower electrical conductivity than the first oxide semiconductor region is formed between the first oxide semiconductor region and a protective insulating layer for the thin film transistor, whereby the second oxide semiconductor region serves as a protective layer for the first oxide semiconductor region; thus, change in composition or deterioration in film quality of the first oxide semiconductor region can be prevented, and electrical characteristics of the thin film transistor can be stabilized.
摘要翻译：在使用氧化物半导体作为有源层的薄膜晶体管中，为了防止用作有源层的氧化物半导体区域的组成，膜质量，界面等的变化，并且为了稳定化薄膜晶体管的电气特性。在其中使用第一氧化物半导体区域作为有源层的薄膜晶体管中，在第一氧化物半导体区域和用于薄的第一氧化物半导体区域的保护绝缘层之间形成具有比第一氧化物半导体区域低导电性的第二氧化物半导体区域由此第二氧化物半导体区域用作第一氧化物半导体区域的保护层; 因此，可以防止第一氧化物半导体区域的组成变化或膜质量的劣化，并且能够稳定薄膜晶体管的电特性。

2. 发明申请

US20130001545A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
公开(公告)号：US20130001545A1
公开(公告)日：2013-01-03
申请号：US13613456
申请日：2012-09-13
申请人： Hideaki KUWABARA , Kengo AKIMOTO , Toshinari SASAKI
发明人： Hideaki KUWABARA , Kengo AKIMOTO , Toshinari SASAKI
IPC分类号： H01L29/786
CPC分类号： H01L29/7869 , H01L27/1225 , H01L29/04 , H01L29/24 , H01L29/458 , H01L29/4908 , H01L29/78696
摘要： An object is to increase field effect mobility of a thin film transistor including an oxide semiconductor. Another object is to stabilize electrical characteristics of the thin film transistor. In a thin film transistor including an oxide semiconductor layer, a semiconductor layer or a conductive layer having higher electrical conductivity than the oxide semiconductor is formed over the oxide semiconductor layer, whereby field effect mobility of the thin film transistor can be increased. Further, by forming a semiconductor layer or a conductive layer having higher electrical conductivity than the oxide semiconductor between the oxide semiconductor layer and a protective insulating layer of the thin film transistor, change in composition or deterioration in film quality of the oxide semiconductor layer is prevented, so that electrical characteristics of the thin film transistor can be stabilized.

3. 发明申请

US20120058600A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120058600A1
公开(公告)日：2012-03-08
申请号：US13292207
申请日：2011-11-09
申请人： Hideaki KUWABARA , Kengo AKIMOTO , Toshinari SASAKI
发明人： Hideaki KUWABARA , Kengo AKIMOTO , Toshinari SASAKI
IPC分类号： H01L21/34
CPC分类号： H01L29/7869 , H01L27/1225 , H01L29/04 , H01L29/24 , H01L29/458 , H01L29/4908 , H01L29/78696
摘要： An object is to increase field effect mobility of a thin film transistor including an oxide semiconductor. Another object is to stabilize electrical characteristics of the thin film transistor. In a thin film transistor including an oxide semiconductor layer, a semiconductor layer or a conductive layer having higher electrical conductivity than the oxide semiconductor is formed over the oxide semiconductor layer, whereby field effect mobility of the thin film transistor can be increased. Further, by forming a semiconductor layer or a conductive layer having higher electrical conductivity than the oxide semiconductor between the oxide semiconductor layer and a protective insulating layer of the thin film transistor, change in composition or deterioration in film quality of the oxide semiconductor layer is prevented, so that electrical characteristics of the thin film transistor can be stabilized.
摘要翻译：目的是增加包括氧化物半导体的薄膜晶体管的场效应迁移率。另一个目的是稳定薄膜晶体管的电特性。在包括氧化物半导体层的薄膜晶体管中，在氧化物半导体层上形成具有比氧化物半导体更高的导电性的半导体层或导电层，由此可以提高薄膜晶体管的场效应迁移率。此外，通过在氧化物半导体层和薄膜晶体管的保护绝缘层之间形成具有比氧化物半导体更高的导电性的半导体层或导电层，防止氧化物半导体层的组成变化或膜质量的劣化，使得薄膜晶体管的电特性能够稳定。

4. 发明申请

US20110024751A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110024751A1
公开(公告)日：2011-02-03
申请号：US12846556
申请日：2010-07-29
申请人： Shunpei YAMAZAKI , Kengo AKIMOTO , Masashi TSUBUKU , Toshinari SASAKI , Hideaki KUWABARA
发明人： Shunpei YAMAZAKI , Kengo AKIMOTO , Masashi TSUBUKU , Toshinari SASAKI , Hideaki KUWABARA
IPC分类号： H01L27/12 , H01L29/786 , H01L21/84
CPC分类号： H01L33/0041 , H01L27/1214 , H01L27/1225 , H01L27/124 , H01L27/1248 , H01L29/78606 , H01L29/7869 , H01L29/78696 , H01L2924/0002 , H01L2924/00
摘要： In a bottom-gate thin film transistor using the stack of the first oxide semiconductor layer and the second oxide semiconductor layer, an oxide insulating layer serving as a channel protective layer is formed over and in contact with part of the oxide semiconductor layer overlapping with a gate electrode layer. In the same step as formation of the insulating layer, an oxide insulating layer covering a peripheral portion (including a side surface) of the stack of the oxide semiconductor layers is formed.
摘要翻译：在使用第一氧化物半导体层和第二氧化物半导体层的堆叠的底栅极薄膜晶体管中，形成作为沟道保护层的氧化物绝缘层，与氧化物半导体层的与栅电极层。在与绝缘层的形成相同的步骤中，形成覆盖氧化物半导体层的叠层的周边部分（包括侧面）的氧化物绝缘层。

5. 发明申请

US20100117078A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100117078A1
公开(公告)日：2010-05-13
申请号：US12614786
申请日：2009-11-09
申请人： Hideaki KUWABARA , Kengo AKIMOTO , Toshinari SASAKI
发明人： Hideaki KUWABARA , Kengo AKIMOTO , Toshinari SASAKI
IPC分类号： H01L29/786 , H01L29/12 , H01L21/336
CPC分类号： H01L29/7869 , H01L27/1225 , H01L29/04 , H01L29/24 , H01L29/458 , H01L29/4908 , H01L29/78696
摘要： An object is to increase field effect mobility of a thin film transistor including an oxide semiconductor. Another object is to stabilize electrical characteristics of the thin film transistor. In a thin film transistor including an oxide semiconductor layer, a semiconductor layer or a conductive layer having higher electrical conductivity than the oxide semiconductor is formed over the oxide semiconductor layer, whereby field effect mobility of the thin film transistor can be increased. Further, by forming a semiconductor layer or a conductive layer having higher electrical conductivity than the oxide semiconductor between the oxide semiconductor layer and a protective insulating layer of the thin film transistor, change in composition or deterioration in film quality of the oxide semiconductor layer is prevented, so that electrical characteristics of the thin film transistor can be stabilized.
摘要翻译：目的是增加包括氧化物半导体的薄膜晶体管的场效应迁移率。另一个目的是稳定薄膜晶体管的电特性。在包括氧化物半导体层的薄膜晶体管中，在氧化物半导体层上形成具有比氧化物半导体更高的导电性的半导体层或导电层，由此可以提高薄膜晶体管的场效应迁移率。此外，通过在氧化物半导体层和薄膜晶体管的保护绝缘层之间形成具有比氧化物半导体更高的导电性的半导体层或导电层，防止氧化物半导体层的组成变化或膜质量的劣化，使得薄膜晶体管的电特性能够稳定。

6. 发明申请

US20100133531A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100133531A1
公开(公告)日：2010-06-03
申请号：US12627204
申请日：2009-11-30
申请人： Kengo AKIMOTO , Toshinari SASAKI
发明人： Kengo AKIMOTO , Toshinari SASAKI
IPC分类号： H01L29/786 , H01L21/336
CPC分类号： H01L29/7869 , H01L27/1225 , H01L29/41733 , H01L29/66969
摘要： A gate electrode layer over a substrate; a gate insulating layer over the gate electrode layer; a first source electrode layer and a first drain electrode layer over the gate insulating layer; an oxide semiconductor layer over the gate insulating layer; and a second source electrode layer and a second drain electrode layer over the oxide semiconductor layer. A first part, a second part, and a third part of a bottom surface are in contact with the first source electrode layer, the first drain electrode layer, and the gate insulating layer respectively. A first part and a second part of the top surface are in contact with the second source electrode layer and the second drain electrode layer respectively. The first source electrode layer and the first drain electrode layer are electrically connected to the second source electrode layer and the second drain electrode layer respectively.
摘要翻译：衬底上的栅电极层; 栅电极层上的栅极绝缘层; 栅极绝缘层上的第一源极电极层和第一漏极电极层; 栅极绝缘层上的氧化物半导体层; 以及在所述氧化物半导体层上的第二源极电极层和第二漏极电极层。第一部分，第二部分和底部表面的第三部分分别与第一源极电极层，第一漏极电极层和栅极绝缘层接触。上表面的第一部分和第二部分分别与第二源极电极层和第二漏极电极层接触。第一源极电极层和第一漏极电极层分别与第二源极电极层和第二漏极电极层电连接。

7. 发明申请

US20110024750A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110024750A1
公开(公告)日：2011-02-03
申请号：US12846534
申请日：2010-07-29
申请人： Shunpei YAMAZAKI , Hiroki OHARA , Toshinari SASAKI , Kosei NODA , Hideaki KUWABARA
发明人： Shunpei YAMAZAKI , Hiroki OHARA , Toshinari SASAKI , Kosei NODA , Hideaki KUWABARA
IPC分类号： H01L29/786 , H01L21/34 , H01L29/772 , H01L21/84
CPC分类号： H01L27/1225 , G02F1/133345 , G02F1/1337 , G02F1/134309 , G02F1/136227 , G02F1/136277 , G02F1/1368 , H01L27/1214 , H01L27/124 , H01L27/1248 , H01L29/24 , H01L29/517 , H01L29/78609 , H01L29/7869
摘要： An object is to provide a semiconductor device having a structure with which parasitic capacitance between wirings can be sufficiently reduced. An oxide insulating layer serving as a channel protective layer is formed over part of an oxide semiconductor layer overlapping with a gate electrode layer. In the same step as formation of the oxide insulating layer, an oxide insulating layer covering a peripheral portion of the oxide semiconductor layer is formed. The oxide insulating layer which covers the peripheral portion of the oxide semiconductor layer is provided to increase the distance between the gate electrode layer and a wiring layer formed above or in the periphery of the gate electrode layer, whereby parasitic capacitance is reduced.
摘要翻译：目的在于提供一种半导体器件，其具有可以充分降低布线之间的寄生电容的结构。用作沟道保护层的氧化物绝缘层形成在与栅电极层重叠的氧化物半导体层的一部分上。在与氧化物绝缘层的形成相同的步骤中，形成覆盖氧化物半导体层的周边部分的氧化物绝缘层。设置覆盖氧化物半导体层的周边部分的氧化物绝缘层以增加栅极电极层与形成在栅电极层的上方或周围的布线层之间的距离，从而降低寄生电容。

8. 发明申请

US20130069053A1 SEMICONDUCTOR DEVICE 有权
公开(公告)号：US20130069053A1
公开(公告)日：2013-03-21
申请号：US13608039
申请日：2012-09-10
申请人： Shunpei YAMAZAKI , Atsuo ISOBE , Toshinari SASAKI
发明人： Shunpei YAMAZAKI , Atsuo ISOBE , Toshinari SASAKI
IPC分类号： H01L29/786
CPC分类号： H01L29/7869 , H01L27/1218 , H01L27/1225
摘要： To provide a transistor which includes an oxide semiconductor and is capable of operating at high speed or a highly reliable semiconductor device including the transistor, a transistor in which an oxide semiconductor layer including a pair of low-resistance regions and a channel formation region is provided over an electrode layer, which is embedded in a base insulating layer and whose upper surface is at least partly exposed from the base insulating layer, and a wiring layer provided above the oxide semiconductor layer is electrically connected to the electrode layer or a part of a low-resistance region of the oxide semiconductor layer, which overlaps with the electrode layer.

9. 发明申请

US20120286270A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120286270A1
公开(公告)日：2012-11-15
申请号：US13463092
申请日：2012-05-03
申请人： Atsuo ISOBE , Toshinari SASAKI , Junichi KOEZUKA , Shunpei YAMAZAKI
发明人： Atsuo ISOBE , Toshinari SASAKI , Junichi KOEZUKA , Shunpei YAMAZAKI
IPC分类号： H01L29/786 , H01L21/336
CPC分类号： H01L29/4238 , H01L21/02565 , H01L21/265 , H01L21/425 , H01L21/84 , H01L27/1085 , H01L27/10876 , H01L27/1156 , H01L27/1203 , H01L27/1225 , H01L28/40 , H01L29/045 , H01L29/0847 , H01L29/66477 , H01L29/66742 , H01L29/66969 , H01L29/78603 , H01L29/7869 , H01L29/78693
摘要： It is an object to provide a semiconductor device in which a short-channel effect is suppressed and miniaturization is achieved, and a manufacturing method thereof. A trench is formed in an insulating layer and impurities are added to an oxide semiconductor film in contact with an upper end corner portion of the trench, whereby a source region and a drain region are formed. With the above structure, miniaturization can be achieved. Further, with the trench, a short-channel effect can be suppressed setting the depth of the trench as appropriate even when a distance between a source electrode layer and a drain electrode layer is shortened.
摘要翻译：本发明的目的是提供一种抑制短路效应并实现小型化的半导体器件及其制造方法。在绝缘层中形成沟槽，并且将杂质添加到与沟槽的上端角部接触的氧化物半导体膜，由此形成源极区域和漏极区域。利用上述结构，可以实现小型化。此外，利用沟槽，即使当源电极层和漏电极层之间的距离缩短时，也可以适当地抑制沟槽的深度适当地设定短沟道效应。

10. 发明申请

US20120258575A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20120258575A1
公开(公告)日：2012-10-11
申请号：US13437271
申请日：2012-04-02
申请人： Yuhei SATO , Keiji SATO , Toshinari SASAKI , Tetsunori MARUYAMA , Atsuo ISOBE , Tsutomu MURAKAWA , Sachiaki TEZUKA
发明人： Yuhei SATO , Keiji SATO , Toshinari SASAKI , Tetsunori MARUYAMA , Atsuo ISOBE , Tsutomu MURAKAWA , Sachiaki TEZUKA
IPC分类号： H01L21/336
CPC分类号： H01L29/7869 , H01L21/477
摘要： To provide a highly reliable semiconductor device manufactured by giving stable electric characteristics to a semiconductor device including an oxide semiconductor. In a manufacturing process of a transistor, an oxide semiconductor layer, a source electrode layer, a drain electrode layer, a gate insulating film, a gate electrode layer, and an aluminum oxide film are formed in this order, and then heat treatment is performed on the oxide semiconductor layer and the aluminum oxide film, whereby an oxide semiconductor layer from which an impurity containing a hydrogen atom is removed and which includes a region containing oxygen more than the stoichiometric proportion is formed. In addition, when the aluminum oxide film is formed, entry and diffusion of water or hydrogen into the oxide semiconductor layer from the air due to heat treatment in a manufacturing process of a semiconductor device or an electronic appliance including the transistor can be prevented.
摘要翻译：提供通过给包括氧化物半导体的半导体器件赋予稳定的电特性而制造的高可靠性的半导体器件。在晶体管的制造工序中，依次形成氧化物半导体层，源极电极层，漏极电极层，栅极绝缘膜，栅电极层和氧化铝膜，然后进行热处理在氧化物半导体层和氧化铝膜上形成除去含有氢原子的杂质的氧化物半导体层，其中含有超过化学计量比的氧的区域。此外，当形成氧化铝膜时，可以防止在半导体器件或包括晶体管的电子设备的制造过程中由于热处理而从空气中进入和扩散水或氢进入氧化物半导体层。

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