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1. 发明申请

US20110203295A1 COOLING RACK STRUCTURE OF THERMOELECTRIC COOLING TYPE 失效
标题翻译：热电冷却型冷却架结构
公开(公告)号：US20110203295A1
公开(公告)日：2011-08-25
申请号：US12711341
申请日：2010-02-24
申请人： Ken HSU , Chih-Hung Cheng , Chen-Hiang Lin , Kuo-Len Lin
发明人： Ken HSU , Chih-Hung Cheng , Chen-Hiang Lin , Kuo-Len Lin
IPC分类号： F25B21/02 , F28F1/10 , F28F13/12
CPC分类号： F25B21/02 , F25B25/00 , F25B2321/0251 , G06F1/1632 , G06F1/203
摘要： A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13). By quickly conducting the low temperature generated from the thermoelectric cooling component (5) onto the cooling plate (1) through the temperature-super-conducting component (13), a low temperature surface can be uniformly provided to obtain a cooling effect.
摘要翻译：冷却架结构包括冷却板（1），温度导体（2），离心风扇（3），冷却体（4）和热电冷却组件（5）。温度超导部件（13）设置在冷却板（1）的内表面（11）上。温度导体（2）布置在温度超导部件（13）上。另外，在冷却板（1）的上侧配置有排热孔（120）。离心风扇（3）设置在温度导体（2）和排热孔（120）之间，同时冷却体（4）设置在风扇（3）和排热孔（120）之间。热电冷却部件（5）的热侧面（501）与冷却体（4）紧密接触，而冷侧面（500）配置在温度超导部件（13）上。通过将热电冷却部件（5）产生的低温通过温度超导部件（13）快速地导通到冷却板（1）上，可以均匀地设置低温面以获得冷却效果。

2. 发明申请

US20090154097A1 HEAT-DISSIPATING DEVICE HAVING AIR-GUIDING COVER 失效
标题翻译：具有空气导向罩的散热装置
公开(公告)号：US20090154097A1
公开(公告)日：2009-06-18
申请号：US11954734
申请日：2007-12-12
申请人： Ken HSU , Chih-Hung Cheng , Kuo-Len Lin
发明人： Ken HSU , Chih-Hung Cheng , Kuo-Len Lin
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating device having an air-guiding cover includes a heat-dissipating body, an air-guiding cover, a plurality of heat pipes, a fixing base and a fan. The heat-dissipating body is constituted of a plurality of heat-dissipating pieces that are stacked up at intervals. On the heat-dissipating body, venting channels and a plurality of through holes are provided. The air-guiding cover includes a hollow cylinder and an air-guiding blade. The hollow cylinder covers the heat-dissipating body. The air-guiding blade is accommodated in the venting channel. Each of the plurality of heat pipes includes a section to be heated and a heat-releasing section extending from the section to be heated. The heat-releasing section penetrates into the through hole. The bottom of the fixing base is provided with a plurality of grooves for accommodating the sections to be heated of the heat pipes. The fan is provided above the air-guiding cover. Via the above arrangement, the air-guiding cover guides the airflow blown by the fan, thereby enhancing the heat-dissipating effect.
摘要翻译：具有空气引导盖的散热装置包括散热体，空气引导盖，多个热管，固定基座和风扇。散热体由间隔堆叠的多个散热片构成。在散热体上设有排气通道和多个通孔。空气引导盖包括中空圆筒和导气叶片。中空圆筒覆盖散热体。导气叶片容纳在排气通道中。多个热管中的每一个都包括待加热部分和从被加热部分延伸的散热部分。散热部穿透通孔。固定底座的底部设置有用于容纳热管的待加热部分的多个槽。风扇设置在导气罩的上方。通过上述结构，空气引导盖引导风扇吹送的气流，从而提高散热效果。

3. 发明申请

US20120137518A1 METHOD FOR ASSEMBLING FINS-TYPE HEAT SINK 有权
标题翻译：装配FINS型散热器的方法
公开(公告)号：US20120137518A1
公开(公告)日：2012-06-07
申请号：US13278162
申请日：2011-10-20
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Chiao-Li HUANG , Ken HSU , Chih-Hung CHENG
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Chiao-Li HUANG , Ken HSU , Chih-Hung CHENG
IPC分类号： B21D53/02
CPC分类号： F28D15/0266 , F28F1/32 , F28F2220/00 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/49345 , Y10T29/4935 , Y10T29/49353 , Y10T29/49826 , H01L2924/00
摘要： A method for assembling a fins-type heat sink includes providing a heat sink, a presser and a plurality of caps, the heat sink having a heat pipe and a plurality of fins disposed on the heat pipe, the presser being provided with through-holes allowing the distal ends of the heat pipe to be inserted therein, a periphery of each through-hole being provided with an annular neck, the presser being provided with notches that are arranged circumferentially outside the annular neck; (b) covering the caps on the annular necks of the presser respectively, each caps extending downwards to form protruding flaps penetrating the notches; (c) disposing a plate-like die on the topmost fin of the heat sink; (d) inserting a distal end of the heat pipe through the through-hole of the presser to abut inside the cap, while folding the flaps outwards via the plate-like die.
摘要翻译：翅片式散热器的组装方法包括设置散热器，压脚和多个盖，所述散热器具有热管和设置在所述热管上的多个散热片，所述按压器设置有通孔允许热管的远端插入其中，每个通孔的周边设置有环形颈部，压脚设置有周向设置在环形颈部周围的凹口; （b）分别覆盖按压器的环形颈部上的盖，每个盖向下延伸以形成穿过凹口的突出的翼片; （c）将板状模具设置在散热器的最上面的翅片上; （d）将热管的远端穿过压脚的通孔插入盖中，同时通过板状模具向外折叠翼片。

4. 发明申请

US20100314078A1 COOLER WITH GROUND HEATED PLANE AND GRINDING METHOD AND APPARATUS THEREOF 有权
标题翻译：具有加热板的冷却器及其研磨方法及装置
公开(公告)号：US20100314078A1
公开(公告)日：2010-12-16
申请号：US12482000
申请日：2009-06-10
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Jui-Ho LIU , Chih-Hung CHENG , Ken HSU
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Jui-Ho LIU , Chih-Hung CHENG , Ken HSU
IPC分类号： F28D15/02 , B24B1/00 , B24B7/00 , F28F1/24
CPC分类号： F28D15/0275 , B24B37/04 , B24B37/12 , B24B37/30 , B24B57/02 , F28D15/0233 , F28F13/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
摘要翻译：制造冷却器的加热平面的方法获得更好的平整度和粗糙度的方法包括具有研磨板和夹具的研磨机。然后，将冷却器布置在固定装置上。接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了冷却器和加热元件之间的导热效率。

5. 发明申请

US20110048677A1 HEAT-CONDUCTING ASSEMBLY FOR HEAT PIPES OF DIFFERENT DIAMETERS AND HEAT SINK HAVING THE SAME 审中-公开
标题翻译：不同直径的热管和带有相同热管的热传导组件
公开(公告)号：US20110048677A1
公开(公告)日：2011-03-03
申请号：US12550647
申请日：2009-08-31
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Ken HSU , Chih-Hung CHENG
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Ken HSU , Chih-Hung CHENG
IPC分类号： F28D15/04 , F28F7/00
CPC分类号： F28D15/0275 , F28F1/32 , F28F2210/08 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： In a heat-conducting assembly for heat pipes of different diameters and a heat sink having such assembly, the heat-conducting assembly includes a heat-conducting base, a set of first heat pipes and a set of second heat pipes. A heat-conducting surface of the heat-conducting base is provided with a plurality of accommodating troughs. The diameter of the set of second heat pipes is smaller than that of the set of first heat pipes. The first heat pipe and the second heat pipe of different diameters are disposed in the accommodating troughs respectively. The heat pipes penetrate a plurality of fins to form the heat sink. With this arrangement, the ratio of heat pipes arranged on the heat-conducting surface can be increased and the heat-conducting efficiency thereof can be improved.
摘要翻译：在用于不同直径的热管和具有这种组件的散热器的导热组件中，导热组件包括导热基座，一组第一热管和一组第二热管。导热底座的导热面设置有多个容纳槽。该组第二热管的直径小于该组第一热管的直径。不同直径的第一热管和第二热管分别设置在容纳槽中。热管穿透多个翅片以形成散热器。通过这种布置，可以提高布置在导热表面上的热管的比例，并且可以提高其导热效率。

6. 发明申请

US20110024088A1 HEAT-DISSIPATING FIN CAPABLE OF INCREASING HEAT-DISSIPATING AREA, HEAT SINK HAVING SUCH HEAT-DISSIPATING FINS, AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：用于增加散热区域的散热片，具有这种散热片的散热器及其制造方法
公开(公告)号：US20110024088A1
公开(公告)日：2011-02-03
申请号：US12511195
申请日：2009-07-29
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Ken HSU , Chih-Hung CHENG
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Ken HSU , Chih-Hung CHENG
IPC分类号： F28D15/04 , F28F7/00 , B21D53/02
CPC分类号： F28D15/02 , B21D53/085 , F28D15/0266 , F28D15/0275 , F28F1/126 , F28F1/32 , F28F3/02 , F28F7/00 , F28F2215/04 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/49359 , Y10T29/49364 , Y10T29/49373 , Y10T29/49377 , Y10T29/49378 , H01L2924/00
摘要： A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The present invention further provides a heat sink having such heat-dissipating fins, which includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.
摘要翻译：能够增加散热区域的散热片包括下板和上板。下板设有通孔。上板从下板延伸并弯曲成与下板重叠，从而在它们之间形成散热路径（b）。本发明还提供了一种具有这种散热翅片的散热器，其包括热管和散热翅片。热管具有吸热部和散热部。散热片具有下板和上板。上板弯曲成与下板重叠，从而在它们之间形成散热路径（b）。下板和上板分别设置有通孔，使得这两个通孔彼此对应。热管的散热部分依次穿透散热片的通孔。以这种方式，可以提高相同高度的散热区域，从而提高散热器的散热效率。

7. 发明申请

US20100226138A1 LED ROAD LAMP HOLDER STRUCTURE 失效
标题翻译： LED路灯架结构
公开(公告)号：US20100226138A1
公开(公告)日：2010-09-09
申请号：US12400282
申请日：2009-03-09
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Hwai-Ming WANG , Chiao-Li HUANG , Ken HSU , Chih-Hung CHENG
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Hwai-Ming WANG , Chiao-Li HUANG , Ken HSU , Chih-Hung CHENG
IPC分类号： F21V29/00
CPC分类号： F21V15/01 , F21S8/08 , F21S8/086 , F21V29/51 , F21V29/717 , F21V29/767 , F21V29/83 , F21W2131/103 , F21Y2115/10
摘要： A road lamp holder structure includes a lamp guard (1), an LED unit (2) installed at the bottom of the lamp guard (1), and a heat dissipating device (30) installed in lamp guard (1) and having a base (30), a vapor chamber (31) and two heat dissipating elements (32) attached to the LED unit (2). The vapor chamber (31) includes a heated section (310) attached onto the base (30), two heat transmitting sections (311) bent and extended upward from both sides of the heated section (310) respectively, a condensing section (312) bent and extended laterally from each of the two heat transmitting sections (311), two heat dissipating elements (32) having a heated base (30), and heat dissipating fins (321) disposed on the heated base (30). The two heated bases (30) are attached onto external sides of the two heat transmitting sections (311) of the vapor chamber (31) respectively, and the two condensing sections (312) of the vapor chamber (31) are attached to the internal periphery of the top of the lamp guard (1).
摘要翻译：路灯支架结构包括：灯罩（1），安装在灯罩（1）底部的LED单元（2）;以及安装在灯罩（1）中的散热装置（30）（30），蒸气室（31）和附接到LED单元（2）的两个散热元件（32）。蒸汽室（31）包括附着在基座（30）上的加热部分（310），分别从加热部分（310）的两侧向上弯曲和延伸的两个热传递部分（311），冷凝部分（312）从每个两个传热部分311弯曲并横向延伸，具有加热基座30的两个散热元件32和设置在被加热基座30上的散热翅片321。两个加热基座（30）分别安装在蒸气室（31）的两个传热部分（311）的外侧，并且蒸气室（31）的两个冷凝部分（312）附接到内部灯罩（1）的顶部周边。

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