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1. 发明申请

US20100226138A1 LED ROAD LAMP HOLDER STRUCTURE 失效
标题翻译： LED路灯架结构
公开(公告)号：US20100226138A1
公开(公告)日：2010-09-09
申请号：US12400282
申请日：2009-03-09
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Hwai-Ming WANG , Chiao-Li HUANG , Ken HSU , Chih-Hung CHENG
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Hwai-Ming WANG , Chiao-Li HUANG , Ken HSU , Chih-Hung CHENG
IPC分类号： F21V29/00
CPC分类号： F21V15/01 , F21S8/08 , F21S8/086 , F21V29/51 , F21V29/717 , F21V29/767 , F21V29/83 , F21W2131/103 , F21Y2115/10
摘要： A road lamp holder structure includes a lamp guard (1), an LED unit (2) installed at the bottom of the lamp guard (1), and a heat dissipating device (30) installed in lamp guard (1) and having a base (30), a vapor chamber (31) and two heat dissipating elements (32) attached to the LED unit (2). The vapor chamber (31) includes a heated section (310) attached onto the base (30), two heat transmitting sections (311) bent and extended upward from both sides of the heated section (310) respectively, a condensing section (312) bent and extended laterally from each of the two heat transmitting sections (311), two heat dissipating elements (32) having a heated base (30), and heat dissipating fins (321) disposed on the heated base (30). The two heated bases (30) are attached onto external sides of the two heat transmitting sections (311) of the vapor chamber (31) respectively, and the two condensing sections (312) of the vapor chamber (31) are attached to the internal periphery of the top of the lamp guard (1).
摘要翻译：路灯支架结构包括：灯罩（1），安装在灯罩（1）底部的LED单元（2）;以及安装在灯罩（1）中的散热装置（30）（30），蒸气室（31）和附接到LED单元（2）的两个散热元件（32）。蒸汽室（31）包括附着在基座（30）上的加热部分（310），分别从加热部分（310）的两侧向上弯曲和延伸的两个热传递部分（311），冷凝部分（312）从每个两个传热部分311弯曲并横向延伸，具有加热基座30的两个散热元件32和设置在被加热基座30上的散热翅片321。两个加热基座（30）分别安装在蒸气室（31）的两个传热部分（311）的外侧，并且蒸气室（31）的两个冷凝部分（312）附接到内部灯罩（1）的顶部周边。

2. 发明申请

US20120137518A1 METHOD FOR ASSEMBLING FINS-TYPE HEAT SINK 有权
标题翻译：装配FINS型散热器的方法
公开(公告)号：US20120137518A1
公开(公告)日：2012-06-07
申请号：US13278162
申请日：2011-10-20
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Chiao-Li HUANG , Ken HSU , Chih-Hung CHENG
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Chiao-Li HUANG , Ken HSU , Chih-Hung CHENG
IPC分类号： B21D53/02
CPC分类号： F28D15/0266 , F28F1/32 , F28F2220/00 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/49345 , Y10T29/4935 , Y10T29/49353 , Y10T29/49826 , H01L2924/00
摘要： A method for assembling a fins-type heat sink includes providing a heat sink, a presser and a plurality of caps, the heat sink having a heat pipe and a plurality of fins disposed on the heat pipe, the presser being provided with through-holes allowing the distal ends of the heat pipe to be inserted therein, a periphery of each through-hole being provided with an annular neck, the presser being provided with notches that are arranged circumferentially outside the annular neck; (b) covering the caps on the annular necks of the presser respectively, each caps extending downwards to form protruding flaps penetrating the notches; (c) disposing a plate-like die on the topmost fin of the heat sink; (d) inserting a distal end of the heat pipe through the through-hole of the presser to abut inside the cap, while folding the flaps outwards via the plate-like die.
摘要翻译：翅片式散热器的组装方法包括设置散热器，压脚和多个盖，所述散热器具有热管和设置在所述热管上的多个散热片，所述按压器设置有通孔允许热管的远端插入其中，每个通孔的周边设置有环形颈部，压脚设置有周向设置在环形颈部周围的凹口; （b）分别覆盖按压器的环形颈部上的盖，每个盖向下延伸以形成穿过凹口的突出的翼片; （c）将板状模具设置在散热器的最上面的翅片上; （d）将热管的远端穿过压脚的通孔插入盖中，同时通过板状模具向外折叠翼片。

3. 发明申请

US20110197598A1 Heat-Dissipating Device For Supplying Cold Airflow 失效
标题翻译：用于供应冷气流的散热装置
公开(公告)号：US20110197598A1
公开(公告)日：2011-08-18
申请号：US12707805
申请日：2010-02-18
申请人： Chih-Hung CHENG , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
发明人： Chih-Hung CHENG , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
IPC分类号： F25B21/02 , F28D15/00 , F28F1/20
CPC分类号： H01L23/427 , F25B21/02 , F25B2321/0251 , H01L23/3675 , H01L23/38 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102). The heat generated by the hot-end surface (31) is dissipated to the hot air outlet (121) by the thermal conduction of the heat-dissipating module (40). The cold generated by the cold-end surface (32) is conducted and distributed uniformly by the cold-airflow supplying module (50) to the cold air outlet (110).
摘要翻译：散热装置（1）包括壳体（10）和设置在壳体（10）内的绝热板（20）。绝热板（20）将壳体（10）的内部分成第一容纳空间（101）和第二容纳空间（102）。所述壳体（10）的热风出口（121）和第一空气入口（122）与所述第一容纳空间（101）连通。壳体（10）的冷气出口（110）和第二空气入口（123）与第二容纳空间（102）连通。一个热电冷却芯片（30）设置在绝热板（20）的通孔（200）中并且具有面向第一容纳空间（101）的热端表面（31）和冷端表面 32）面向第二容纳空间（102）。散热模块（40）被容纳在第一容纳空间（101）中。冷气流供给模块（50）被容纳在第二容纳空间（102）中。热端面（31）产生的热量通过散热模块（40）的热传导而散热到热风出口（121）。由冷端表面32产生的冷由冷气流供给模块50均匀地传导并均匀地分配到冷气出口110。

4. 发明申请

US20110048677A1 HEAT-CONDUCTING ASSEMBLY FOR HEAT PIPES OF DIFFERENT DIAMETERS AND HEAT SINK HAVING THE SAME 审中-公开
标题翻译：不同直径的热管和带有相同热管的热传导组件
公开(公告)号：US20110048677A1
公开(公告)日：2011-03-03
申请号：US12550647
申请日：2009-08-31
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Ken HSU , Chih-Hung CHENG
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Ken HSU , Chih-Hung CHENG
IPC分类号： F28D15/04 , F28F7/00
CPC分类号： F28D15/0275 , F28F1/32 , F28F2210/08 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： In a heat-conducting assembly for heat pipes of different diameters and a heat sink having such assembly, the heat-conducting assembly includes a heat-conducting base, a set of first heat pipes and a set of second heat pipes. A heat-conducting surface of the heat-conducting base is provided with a plurality of accommodating troughs. The diameter of the set of second heat pipes is smaller than that of the set of first heat pipes. The first heat pipe and the second heat pipe of different diameters are disposed in the accommodating troughs respectively. The heat pipes penetrate a plurality of fins to form the heat sink. With this arrangement, the ratio of heat pipes arranged on the heat-conducting surface can be increased and the heat-conducting efficiency thereof can be improved.
摘要翻译：在用于不同直径的热管和具有这种组件的散热器的导热组件中，导热组件包括导热基座，一组第一热管和一组第二热管。导热底座的导热面设置有多个容纳槽。该组第二热管的直径小于该组第一热管的直径。不同直径的第一热管和第二热管分别设置在容纳槽中。热管穿透多个翅片以形成散热器。通过这种布置，可以提高布置在导热表面上的热管的比例，并且可以提高其导热效率。

5. 发明申请

US20110024088A1 HEAT-DISSIPATING FIN CAPABLE OF INCREASING HEAT-DISSIPATING AREA, HEAT SINK HAVING SUCH HEAT-DISSIPATING FINS, AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：用于增加散热区域的散热片，具有这种散热片的散热器及其制造方法
公开(公告)号：US20110024088A1
公开(公告)日：2011-02-03
申请号：US12511195
申请日：2009-07-29
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Ken HSU , Chih-Hung CHENG
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Ken HSU , Chih-Hung CHENG
IPC分类号： F28D15/04 , F28F7/00 , B21D53/02
CPC分类号： F28D15/02 , B21D53/085 , F28D15/0266 , F28D15/0275 , F28F1/126 , F28F1/32 , F28F3/02 , F28F7/00 , F28F2215/04 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/49359 , Y10T29/49364 , Y10T29/49373 , Y10T29/49377 , Y10T29/49378 , H01L2924/00
摘要： A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The present invention further provides a heat sink having such heat-dissipating fins, which includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.
摘要翻译：能够增加散热区域的散热片包括下板和上板。下板设有通孔。上板从下板延伸并弯曲成与下板重叠，从而在它们之间形成散热路径（b）。本发明还提供了一种具有这种散热翅片的散热器，其包括热管和散热翅片。热管具有吸热部和散热部。散热片具有下板和上板。上板弯曲成与下板重叠，从而在它们之间形成散热路径（b）。下板和上板分别设置有通孔，使得这两个通孔彼此对应。热管的散热部分依次穿透散热片的通孔。以这种方式，可以提高相同高度的散热区域，从而提高散热器的散热效率。

6. 发明申请

US20100314078A1 COOLER WITH GROUND HEATED PLANE AND GRINDING METHOD AND APPARATUS THEREOF 有权
标题翻译：具有加热板的冷却器及其研磨方法及装置
公开(公告)号：US20100314078A1
公开(公告)日：2010-12-16
申请号：US12482000
申请日：2009-06-10
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Jui-Ho LIU , Chih-Hung CHENG , Ken HSU
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Jui-Ho LIU , Chih-Hung CHENG , Ken HSU
IPC分类号： F28D15/02 , B24B1/00 , B24B7/00 , F28F1/24
CPC分类号： F28D15/0275 , B24B37/04 , B24B37/12 , B24B37/30 , B24B57/02 , F28D15/0233 , F28F13/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
摘要翻译：制造冷却器的加热平面的方法获得更好的平整度和粗糙度的方法包括具有研磨板和夹具的研磨机。然后，将冷却器布置在固定装置上。接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了冷却器和加热元件之间的导热效率。

7. 发明申请

US20110309734A1 LED LAMP AND A HEAT SINK THEREOF HAVING A WOUND HEAT PIPE 有权
标题翻译： LED灯和一个带有热管的散热片
公开(公告)号：US20110309734A1
公开(公告)日：2011-12-22
申请号：US12820453
申请日：2010-06-22
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Chih-Hung CHENG
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Chih-Hung CHENG
IPC分类号： H01J61/52 , F28D15/04
CPC分类号： F21V29/51 , F21K9/23 , F21K9/233 , F21V29/004 , F21V29/773 , F21V29/78 , F21Y2115/10 , F28D15/0275
摘要： The present invention relates to a LED lamp and a heat sink thereof having a wound heat pipe. The LED lamp includes the heat sink, a LED module and a lamp base electrically connected to the LED module. The heat sink includes a heat-conducting base, a heat-dissipating fin set and a wound heat pipe. The heat-dissipating fin set includes a plurality of heat-dissipating fins arranged at the outer periphery of the heat-conducting base. The heat-dissipating fins form an accommodating space. The wound heat pipe includes an evaporating section brought into thermal contact with the heat-conducting base and a condensing section brought into thermal contact with the heat-dissipating fins. The LED module abuts against the heat-conducting base and the evaporating section. By this structure, the heat-conducting path is shortened, the heat-conducting speed is accelerated, and the heat is rapidly and uniformly distributed to the heat-dissipating fins to improve the heat-dissipating efficiency.
摘要翻译：本发明涉及具有卷绕热管的LED灯及其散热器。 LED灯包括散热器，LED模块和与LED模块电连接的灯座。散热器包括导热基座，散热翅片组和绕线热管。散热片组包括布置在导热基底的外周的多个散热片。散热片形成容纳空间。卷绕的热管包括与导热基体热接触的蒸发部和与散热翅片热接触的冷凝部。 LED模块抵靠导热基座和蒸发部分。通过这种结构，导热路径缩短，导热速度加快，热量迅速均匀地分布到散热翅片，提高了散热效率。

8. 发明申请

US20090084528A1 METHOD FOR MANUFACTURING HEAT DISSIPATOR HAVING HEAT PIPES AND PRODUCT OF THE SAME 有权
标题翻译：用于制造具有热管及其产品的散热器的方法
公开(公告)号：US20090084528A1
公开(公告)日：2009-04-02
申请号：US11863583
申请日：2007-09-28
申请人： Chih-Hung CHENG , Ken Hsu
发明人： Chih-Hung CHENG , Ken Hsu
IPC分类号： F28D15/00 , B21D53/02
CPC分类号： F28D15/0275 , F28D15/0233 , F28F2210/08 , Y10T29/4935 , Y10T29/49353
摘要： A heat dissipator having heat pipes includes a heat-conducting base, a first heat pipe and a second heat pipe. The heat-conducting base has an accommodating trough. After the first heat pipe is accommodated in the accommodating trough, it is deformed so as to abut against the inner wall face of the accommodating trough. Further, the second heat pipe and the first heat pipe are provided in the same accommodating trough, and the second heat pipe is overlapped vertically on the first heat pipe. As a result, the second heat pipe is deformed so as to abut against the first heat pipe and the interior of the accommodating trough, thereby enhancing the heat-conducting performance of the heat dissipator.
摘要翻译：具有热管的散热器包括导热基座，第一热管和第二热管。导热基座具有容纳槽。在第一热管容纳在容纳槽中之后，其变形以抵靠容纳槽的内壁面。此外，第二热管和第一热管设置在相同的容纳槽中，第二热管在第一热管上垂直重叠。结果，第二热管变形成与第一热管和容纳槽的内部抵接，从而提高散热器的导热性能。

9. 发明申请

US20130298707A1 LINEAR ACTUATOR 有权
标题翻译：线性执行器
公开(公告)号：US20130298707A1
公开(公告)日：2013-11-14
申请号：US13542583
申请日：2012-07-05
申请人： Chih-Hung CHENG , Wei-Minh Huang
发明人： Chih-Hung CHENG , Wei-Minh Huang
IPC分类号： F16H19/02
CPC分类号： F16H25/2015 , F16H2025/209 , H02K7/06 , H02K7/1166 , H02K11/21 , Y10T74/18688 , Y10T74/18792 , Y10T74/19828
摘要： A linear actuator includes a motor, a movable unit, and a stroke control unit. The motor includes a spindle. The movable unit includes a worm gear and a rotary shaft. The worm is provided with annular spiral or helix teeth. The stroke control unit includes at least one transmission member and at least one micro switch. The at least one transmission member is engaged with and driven by the spiral or the helix teeth of the movable unit for synchronical rotation to activating or deactivating the micro switch. In this way, the linear actuator is simplified in structure and reduced in volume.
摘要翻译：线性致动器包括马达，可移动单元和行程控制单元。电机包括一个主轴。可移动单元包括蜗轮和旋转轴。蜗杆带有环形螺旋或螺旋齿。行程控制单元包括至少一个传动构件和至少一个微动开关。所述至少一个传动构件与所述可移动单元的螺旋或螺旋齿接合并由所述可移动单元的螺旋齿驱动，用于同步旋转以启动或停用所述微动开关。以这种方式，线性致动器的结构简化并且体积减小。

10. 发明申请

US20120153392A1 MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE, AND PIXEL STRUCTURE AND MANUFACTURING METHOD FOR THE SAME 审中-公开
标题翻译：半导体结构的制造方法及其像素结构及其制造方法
公开(公告)号：US20120153392A1
公开(公告)日：2012-06-21
申请号：US13053691
申请日：2011-03-22
申请人： Chih-Hung CHENG , Isaac Wing-Tak Chan
发明人： Chih-Hung CHENG , Isaac Wing-Tak Chan
IPC分类号： H01L29/786 , H01L21/336 , H01L21/20
CPC分类号： H01L27/1288 , H01L27/1251 , H01L27/14658 , H01L27/3244
摘要： A manufacturing method for a semiconductor structure, and a pixel structure and a manufacturing method for the same are provided. The manufacturing method for the semiconductor structure includes following steps. A substrate is provided. A first conductive layer is formed and patterned by using a first mask patterned. A first material film, including a first semiconductor layer, is formed and patterned by using a second mask. A second conductive layer is formed and patterned by using a third mask. A second material film, including a first dielectric layer, a second semiconductor layer and a second dielectric layer, is formed and patterned with using a fourth mask. The second dielectric layer is pattern by using a fifth mask. A third material film, including a third conductive layer, is formed and patterned by using a sixth mask.
摘要翻译：提供了半导体结构的制造方法以及像素结构及其制造方法。半导体结构的制造方法包括以下步骤。提供基板。通过使用图案化的第一掩模来形成和图案化第一导电层。通过使用第二掩模形成包括第一半导体层的第一材料膜并构图。通过使用第三掩模形成并图案化第二导电层。使用第四掩模形成并图案化包括第一介电层，第二半导体层和第二介电层的第二材料膜。第二介电层通过使用第五掩模进行图案化。通过使用第六掩模，形成并图案化包括第三导电层的第三材料膜。

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