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1. 发明申请

US20050098539A1 Method of manufacturing article having uneven surface 有权
标题翻译：制造具有不平坦表面的制品的方法
公开(公告)号：US20050098539A1
公开(公告)日：2005-05-12
申请号：US10993587
申请日：2004-11-19
申请人： Keiji Tsunetomo , Shinya Okamoto , Yasuhiro Saito , Junji Kurachi , Akihiro Koyama , Hirotaka Koyo , Takeshi Hidaka , Hiroaki Kasai , Masamichi Hijino , Yasushi Nakamura
发明人： Keiji Tsunetomo , Shinya Okamoto , Yasuhiro Saito , Junji Kurachi , Akihiro Koyama , Hirotaka Koyo , Takeshi Hidaka , Hiroaki Kasai , Masamichi Hijino , Yasushi Nakamura
IPC分类号： C03C17/00 , C23F1/00 , B44C1/22 , H01L21/84
CPC分类号： C03C17/001 , C03C2217/77 , C03C2218/33
摘要： The present invention improves a method of forming a surface unevenness using a difference in etching rates, and relaxes limitations on substrates in this method. In a method of the present invention, an uneven surface is formed by a method including applying pressure to a predetermined region in a surface of a thin film formed on a substrate, and etching a region including at least a portion of the predetermined region and at least a portion of the reminder of the surface that excludes the predetermined region. An etching rate difference within the thin film increases freedom in selecting a substrate material.
摘要翻译：本发明改进了使用蚀刻速率差异形成表面凹凸的方法，并且在该方法中放宽了对基板的限制。在本发明的方法中，通过包括对形成在基板上的薄膜的表面中的规定区域施加压力的方法形成凹凸表面，并且蚀刻包含至少一部分预定区域的区域和排除了预定区域的表面的提醒的至少一部分。薄膜内的蚀刻速率差增加了选择衬底材料的自由度。

2. 发明授权

US07407889B2 Method of manufacturing article having uneven surface 有权
标题翻译：制造具有不平坦表面的制品的方法
公开(公告)号：US07407889B2
公开(公告)日：2008-08-05
申请号：US10993587
申请日：2004-11-19
申请人： Keiji Tsunetomo , Shinya Okamoto , Yasuhiro Saito , Junji Kurachi , Akihiro Koyama , Hirotaka Koyo , Takeshi Hidaka , Hiroaki Kasai , Masamichi Hijino , Yasushi Nakamura
发明人： Keiji Tsunetomo , Shinya Okamoto , Yasuhiro Saito , Junji Kurachi , Akihiro Koyama , Hirotaka Koyo , Takeshi Hidaka , Hiroaki Kasai , Masamichi Hijino , Yasushi Nakamura
IPC分类号： H01L21/311
CPC分类号： C03C17/001 , C03C2217/77 , C03C2218/33
摘要： The present invention improves a method of forming a surface unevenness using a difference in etching rates, and relaxes limitations on substrates in this method. In a method of the present invention, an uneven surface is formed by a method including applying pressure to a predetermined region in a surface of a thin film formed on a substrate, and etching a region including at least a portion of the predetermined region and at least a portion of the reminder of the surface that excludes the predetermined region. An etching rate difference within the thin film increases freedom in selecting a substrate material.
摘要翻译：本发明改进了使用蚀刻速率差异形成表面凹凸的方法，并且在该方法中放宽了对基板的限制。在本发明的方法中，通过包括对形成在基板上的薄膜的表面中的规定区域施加压力的方法形成凹凸表面，并且蚀刻包含至少一部分预定区域的区域和排除了预定区域的表面的提醒的至少一部分。薄膜内的蚀刻速率差增加了选择衬底材料的自由度。

3. 发明申请

US20050130426A1 Processing method for glass substrate, processed glass product and stress applying apparatus 有权
标题翻译：玻璃基板，加工玻璃制品和应力施加装置的加工方法
公开(公告)号：US20050130426A1
公开(公告)日：2005-06-16
申请号：US10993422
申请日：2004-11-19
申请人： Takeshi Hidaka , Hiroaki Kasai , Masamichi Hijino , Yasushi Nakamura , Akihiro Koyama , Keiji Tsunetomo , Junji Kurachi , Hirotaka Koyo , Shinya Okamoto , Yasuhiro Saito
发明人： Takeshi Hidaka , Hiroaki Kasai , Masamichi Hijino , Yasushi Nakamura , Akihiro Koyama , Keiji Tsunetomo , Junji Kurachi , Hirotaka Koyo , Shinya Okamoto , Yasuhiro Saito
IPC分类号： C03C15/00 , C03C17/22 , C03C17/34 , C03C19/00 , C03C23/00 , G11B5/84 , H01L21/44 , B65G49/07 , H01L21/302 , H01L21/461
CPC分类号： C03C23/007 , C03C15/00 , C03C17/22 , C03C17/3411 , C03C19/00 , C03C2218/31 , C03C2218/32 , G11B5/7315 , G11B5/8404 , Y10T428/218 , Y10T428/24355
摘要： A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part having a different etching rate from that of other parts with respect to an etching reagent to be used, on the surface of the glass substrate and in the vicinity thereof, and performing chemical etching using the etching reagent on the glass substrate having the compression stressed part formed thereon, so as to form a relief on the surface of the glass substrate.
摘要翻译：本发明的玻璃基板的加工方法包括：向玻璃基板施加热和外力，然后将其冷却，从而形成与蚀刻剂相对于其它部分的蚀刻速率不同的压缩应力部分，在玻璃基板的表面及其附近，使用在其上形成有压缩应力部的玻璃基板上的蚀刻剂进行化学蚀刻，以在玻璃基板的表面上形成凸版。

4. 发明授权

US07354526B2 Processing method for glass substrate, processed glass product and stress applying apparatus 有权
标题翻译：玻璃基板，加工玻璃制品和应力施加装置的加工方法
公开(公告)号：US07354526B2
公开(公告)日：2008-04-08
申请号：US10993422
申请日：2004-11-19
申请人： Takeshi Hidaka , Hiroaki Kasai , Masamichi Hijino , Yasushi Nakamura , Akihiro Koyama , Keiji Tsunetomo , Junji Kurachi , Hirotaka Koyo , Shinya Okamoto , Yasuhiro Saito
发明人： Takeshi Hidaka , Hiroaki Kasai , Masamichi Hijino , Yasushi Nakamura , Akihiro Koyama , Keiji Tsunetomo , Junji Kurachi , Hirotaka Koyo , Shinya Okamoto , Yasuhiro Saito
IPC分类号： B44C1/22
CPC分类号： C03C23/007 , C03C15/00 , C03C17/22 , C03C17/3411 , C03C19/00 , C03C2218/31 , C03C2218/32 , G11B5/7315 , G11B5/8404 , Y10T428/218 , Y10T428/24355
摘要： A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part having a different etching rate from that of other parts with respect to an etching reagent to be used, on the surface of the glass substrate and in the vicinity thereof, and performing chemical etching using the etching reagent on the glass substrate having the compression stressed part formed thereon, so as to form a relief on the surface of the glass substrate.
摘要翻译：本发明的玻璃基板的加工方法包括：向玻璃基板施加热和外力，然后将其冷却，从而形成与蚀刻剂相对于其它部分的蚀刻速率不同的压缩应力部分，在玻璃基板的表面及其附近，使用在其上形成有压缩应力部的玻璃基板上的蚀刻剂进行化学蚀刻，以在玻璃基板的表面上形成凸版。

5. 发明申请

US20070138130A1 Method for manaufacturing glass substrate having uneven surface 审中-公开
标题翻译：制造具有不平坦表面的玻璃基板的方法
公开(公告)号：US20070138130A1
公开(公告)日：2007-06-21
申请号：US10589548
申请日：2005-02-04
申请人： Junji Kurachi , Akihiro Koyama , Shinya Okamoto , Yasuhiro Saito , Keiji Tsunetomo , Hirotaka Koyo , Takeshi Hidaka , Hiroaki Kasai , Yasushi Nakamura
发明人： Junji Kurachi , Akihiro Koyama , Shinya Okamoto , Yasuhiro Saito , Keiji Tsunetomo , Hirotaka Koyo , Takeshi Hidaka , Hiroaki Kasai , Yasushi Nakamura
IPC分类号： B44C1/22
CPC分类号： C03C3/091 , C03C15/00 , C03C19/00 , G11B5/7315 , G11B5/8404
摘要： The present invention provides a glass substrate having a minute texture being provided on the surface and having good acid durability with high protrusion forming efficiency. According to the present invention, unevenness is formed on the surface by pressing a predetermined area of the surface of the glass substrate containing at least one oxide selected from the group consisting of SiO2, B2O3, P2O5, GeO2, As2O5, ZrO2, TiO2, SnO2, A2O3, MgO, and BeO and having a composition wherein the content of this at least one oxide is above 90 mol %, and subsequently by etching an area including this predetermined area. In the composition of this glass substrate, the ratio of oxides of network formers or intermediates is high, so that the glass substrate becomes easy to be compressed. This enables to obtain high protrusion forming efficiency even when selective leaching of a component easily leached into etchant is not employed, thereby satisfying acid durability as well.
摘要翻译：本发明提供一种具有微细纹理的玻璃基板，其表面具有良好的酸性耐久性和高的突起形成效率。根据本发明，通过按压包含至少一种选自SiO 2，B 2的氧化物的玻璃基板的表面的规定区域，在表面上形成凹凸 3，O 3，O 2，O 2，O 2，O 2， O 2，ZrO 2，TiO 2，SnO 2，A 2，N 2，具有其中所述至少一种氧化物的含量高于90mol％的组成，随后通过蚀刻包括该预定区域的区域的组成。在该玻璃基板的组成中，网络形成体或中间体的氧化物的比例高，玻璃基板容易被压缩。即使不使用容易浸出到蚀刻剂中的成分的选择性浸出，也能够获得高的突起形成效率，因此也能够得到耐酸性。

6. 发明申请

US20090291261A1 Glass Substrate Processing Method and Glass Component 有权
标题翻译：玻璃基板加工方法和玻璃成分
公开(公告)号：US20090291261A1
公开(公告)日：2009-11-26
申请号：US12091168
申请日：2006-11-22
申请人： Takeshi Hidaka , Yasushi Nakamura , Tomonori Imamura , Shinya Okamoto , Hirotaka Koyo , Yasuhiro Saito , Keiji Tsunetomo
发明人： Takeshi Hidaka , Yasushi Nakamura , Tomonori Imamura , Shinya Okamoto , Hirotaka Koyo , Yasuhiro Saito , Keiji Tsunetomo
IPC分类号： B32B3/02 , B44C1/22
CPC分类号： B28D1/00 , B23K26/0006 , B23K26/0624 , B23K26/355 , B23K26/40 , B23K2103/16 , B23K2103/50 , C03C15/00 , C03C23/0025 , C03C2217/77 , Y10T428/24479
摘要： A glass substrate processing method includes irradiating laser light L onto a glass substrate 1 such that the laser light L is focused within the glass substrate 1, thereby forming a high density area 3 that has a higher density than areas where the laser light L is not irradiated around the portion where the laser light L is focused; and performing chemical etching on the glass substrate 1 using an etching solution such that at least a portion of the high density area is allowed to remain, thereby forming a projection 2 on a surface 1a of the glass substrate 1.
摘要翻译：玻璃基板处理方法包括将激光L照射到玻璃基板1上，使得激光L聚焦在玻璃基板1内，从而形成具有比激光L不比区域高的密度的高密度区域3 照射在激光L聚焦的部分周围; 并使用蚀刻溶液对玻璃基板1进行化学蚀刻，使得能够保留高密度区域的至少一部分，从而在玻璃基板1的表面1a上形成突起2。

7. 发明授权

US08307672B2 Glass substrate processing method and glass component 有权
标题翻译：玻璃基板加工方法和玻璃成分
公开(公告)号：US08307672B2
公开(公告)日：2012-11-13
申请号：US12091168
申请日：2006-11-22
申请人： Takeshi Hidaka , Yasushi Nakamura , Tomonori Imamura , Shinya Okamoto , Hirotaka Koyo , Yasuhiro Saito , Keiji Tsunetomo
发明人： Takeshi Hidaka , Yasushi Nakamura , Tomonori Imamura , Shinya Okamoto , Hirotaka Koyo , Yasuhiro Saito , Keiji Tsunetomo
IPC分类号： C03C15/00 , C03C23/00
CPC分类号： B28D1/00 , B23K26/0006 , B23K26/0624 , B23K26/355 , B23K26/40 , B23K2103/16 , B23K2103/50 , C03C15/00 , C03C23/0025 , C03C2217/77 , Y10T428/24479
摘要： A glass substrate processing method includes irradiating laser light L onto a glass substrate 1 such that the laser light L is focused within the glass substrate 1, thereby forming a high density area 3 that has a higher density than areas where the laser light L is not irradiated around the portion where the laser light L is focused; and performing chemical etching on the glass substrate 1 using an etching solution such that at least a portion of the high density area is allowed to remain, thereby forming a projection 2 on a surface 1a of the glass substrate 1.
摘要翻译：玻璃基板处理方法包括将激光L照射到玻璃基板1上，使得激光L聚焦在玻璃基板1内，从而形成具有比激光L不比区域高的密度的高密度区域3 照射在激光L聚焦的部分周围; 并使用蚀刻溶液对玻璃基板1进行化学蚀刻，使得能够保留高密度区域的至少一部分，从而在玻璃基板1的表面1a上形成突起2。

8. 发明授权

US07524783B2 Glass for laser processing 失效
标题翻译：玻璃激光加工
公开(公告)号：US07524783B2
公开(公告)日：2009-04-28
申请号：US10262864
申请日：2002-10-03
申请人： Hirotaka Koyo , Tadashi Koyama , Keiji Tsunetomo
发明人： Hirotaka Koyo , Tadashi Koyama , Keiji Tsunetomo
IPC分类号： C03C3/089 , C03C3/064 , C03C3/062
CPC分类号： C03C3/089 , C03C3/064 , C03C3/091 , C03C23/0025
摘要： Titanium is added in the form of atoms, a colloid, or ions to a glass to be subjected to laser processing in which the ablation or vaporization caused by the energy of an absorbed laser light is utilized. Since titanium can be incorporated into the glass through melting, the threshold value for processing can be easily regulated by changing the amount titanium to be added and a material having evenness in processability can be obtained.
摘要翻译：将钛以原子，胶体或离子的形式加入玻璃以进行激光加工，其中利用由吸收的激光的能量引起的烧蚀或汽化。由于可以通过熔化将钛结合到玻璃中，因此可以通过改变添加量的钛容易地调节加工阈值，并且可以获得加工性均匀的材料。

9. 发明申请

US20090013724A1 Glass Processing Method Using Laser and Processing Device 审中-公开
标题翻译：使用激光和加工装置的玻璃加工方法
公开(公告)号：US20090013724A1
公开(公告)日：2009-01-15
申请号：US12224150
申请日：2006-02-22
申请人： Hirotaka Koyo , Keiji Tsunetomo , Masanori Shojiya
发明人： Hirotaka Koyo , Keiji Tsunetomo , Masanori Shojiya
IPC分类号： C03C17/22
CPC分类号： B23K26/0093 , B23K26/0622 , B23K26/082 , B23K26/18 , B23K26/384 , B23K26/40 , B23K2103/50 , C03C15/00 , C03C23/0025
摘要： A glass processing method comprising steps (i), (ii) carried out in the order mentioned. In step (i), a laser pulse (11) with a wavelength λ is condensed by a lens and is applied to a glass plate (12) to form an altered portion (13) at the portion, irradiated with a laser pulse (11), of the glass plate (12). In step (ii), the altered portion (13) is etched by using an etchant having an etching rate larger for the altered portion (13) than that for the glass plate (12). The laser beam used includes the following conditions: The pulse width of a laser pulse (11) ranges from ins to 200 ns, with a wavelength λ being up to 535 nm. The absorption coefficient of the glass plate (12) at a wavelength λ is up to 50 cm−1. A value obtained from a lens focal distance L (mm) divided by the beam diameter D (mm) of the laser pulse (11) when entering the lens is at least 7.
摘要翻译：一种玻璃加工方法，包括按照上述顺序进行的步骤（i），（ii）。在步骤（i）中，具有波长λ的激光脉冲（11）被透镜冷凝，并被施加到玻璃板（12），以在该部分处形成改变部分（13），用激光脉冲（11 ），玻璃板（12）。在步骤（ii）中，通过使用对于改变部分（13）的蚀刻速率大于玻璃板（12）蚀刻速率的蚀刻剂来蚀刻改变部分（13）。使用的激光束包括以下条件：激光脉冲（11）的脉冲宽度范围从ins到200ns，波长λ高达535nm。玻璃板（12）在波长λ处的吸收系数高达50cm -1。从进入透镜时的透镜焦距L（mm）除以激光脉冲（11）的光束直径D（mm）得到的值为7以上。

10. 发明授权

US07399721B2 Glass for laser processing 失效
标题翻译：玻璃激光加工
公开(公告)号：US07399721B2
公开(公告)日：2008-07-15
申请号：US10522046
申请日：2003-07-22
申请人： Hirotaka Koyo , Keiji Tsunetomo
发明人： Hirotaka Koyo , Keiji Tsunetomo
IPC分类号： C03C3/089 , C03C3/091 , C03C3/093
CPC分类号： C03C3/089 , C03C3/076 , C03C23/0025
摘要： A glass for laser processing of the present invention can be laser-processed by causing ablation or evaporation by laser beam energy absorbed therein, wherein the glass for laser processing has a composition that satisfies the following conditions: 60≦SiO2+B2O3≦79 mol %; 5≦Al2O3+TiO2≦20 mol %; and 5≦Li2O+Na2O+K2O+Rb2O+Cs2O+MgO+CaO+SrO+BaO≦20 mol %, where 5≦TiO2≦20 mol %. The present invention can provide a glass for laser processing that has a low laser processing threshold value as well as a low thermal expansion coefficient.
摘要翻译：本发明的激光加工用玻璃可以通过在其中吸收的激光束能量进行烧蚀或蒸镀来进行激光加工，其中，激光加工用玻璃具有满足以下条件的组成：＆lt; “In-line Formulas”end =“lead”？> 60 <= SIO 2 + B 2 O 3 <= 79 mol％; <？in-line-formula description =“In-line Formulas”end =“tail”？> <？in-line-formula description =“In-line Formulas”end =“lead”？> 5 <= AL _{2 3 + TiO 2 = 20摩尔％; 和<？in-line-formula description =“In-line Formulas”end =“tail”？> <？in-line-formula description =“In-line Formulas”end =“lead”？> 5 <= LI < 2 O + Na 2 O + K 2 O + Rb 2 O + Cs 2 O + MgO + CaO + SrO + BaO <= 20mol％，<？在线公式描述=“在线公式”end =“tail”？>其中5 <= TIO 2 <= 20摩尔％。本发明可以提供具有低激光加工阈值和低热膨胀系数的用于激光加工的玻璃。}

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