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    • 4. 发明授权
    • Wafer processing system, wafer processing method, and ion implantation system
    • 晶圆处理系统,晶圆加工方法和离子注入系统
    • US08096744B2
    • 2012-01-17
    • US11254854
    • 2005-10-21
    • Keiji OkadaFumiaki SatoHiroaki Nakaoka
    • Keiji OkadaFumiaki SatoHiroaki Nakaoka
    • H01L21/677
    • H01L21/67213H01L21/67201H01L21/67745
    • Two load lock chambers having a load lock pedestal are provided adjacent to a vacuum process chamber through a vacuum intermediate chamber. A passage opening is provided between the vacuum process chamber and the vacuum intermediate chamber. Two wafer retaining arms are installed between a platen device in the vacuum process chamber and the vacuum intermediate chamber. The two wafer retaining arms are reciprocatingly movable between the corresponding load lock pedestals and the platen device while passing through the passage opening and crossing with an overpass each other at different levels. By retaining an unprocessed wafer by one of the wafer retaining arms and retaining a processed wafer by the other wafer retaining arm, transfer of the unprocessed wafer from one of the load lock pedestals to the platen device and transfer of the processed wafer from the platen device to the other load lock pedestal are performed simultaneously.
    • 具有负载锁定基座的两个负载锁定室通过真空中间室邻近真空处理室设置。 在真空处理室和真空中间室之间设有通道开口。 两个晶片保持臂安装在真空处理室中的压板装置和真空中间室之间。 两个晶片保持臂在相应的负载锁定基座和压板装置之间可往复运动,同时穿过通道开口并与不同级别的立交桥交叉。 通过用晶片保持臂中的一个保持未加工的晶片并通过另一个晶片保持臂保持经处理的晶片,将未加工的晶片从负载锁定基座之一转移到压板装置,并将经处理的晶片从压板装置 到另一个负载锁定基座同时进行。
    • 5. 发明申请
    • Wafer processing system, wafer processing method, and ion implantation system
    • 晶圆处理系统,晶圆加工方法和离子注入系统
    • US20060182532A1
    • 2006-08-17
    • US11254854
    • 2005-10-21
    • Keiji OkadaFumiaki SatoHiroaki Nakaoka
    • Keiji OkadaFumiaki SatoHiroaki Nakaoka
    • B65G1/00
    • H01L21/67213H01L21/67201H01L21/67745
    • Two load lock chambers having a load lock pedestal are provided adjacent to a vacuum process chamber through a vacuum intermediate chamber. A passage opening is provided between the vacuum process chamber and the vacuum intermediate chamber. Two wafer retaining arms are installed between a platen device in the vacuum process chamber and the vacuum intermediate chamber. The two wafer retaining arms are reciprocatingly movable between the corresponding load lock pedestals and the platen device while passing through the passage opening and crossing with an overpass each other at different levels. By retaining an unprocessed wafer by one of the wafer retaining arms and retaining a processed wafer by the other wafer retaining arm, transfer of the unprocessed wafer from one of the load lock pedestals to the platen device and transfer of the processed wafer from the platen device to the other load lock pedestal are performed simultaneously.
    • 具有负载锁定基座的两个负载锁定室通过真空中间室邻近真空处理室设置。 在真空处理室和真空中间室之间设有通道开口。 两个晶片保持臂安装在真空处理室中的压板装置和真空中间室之间。 两个晶片保持臂在相应的负载锁定基座和压板装置之间可往复运动,同时穿过通道开口并与不同级别的立交桥交叉。 通过用晶片保持臂中的一个保持未加工的晶片并通过另一个晶片保持臂保持经处理的晶片,将未加工的晶片从负载锁定基座之一转移到压板装置,并将经处理的晶片从压板装置 到另一个负载锁定基座同时进行。