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1. 发明授权

US06372860B1 Mother mold-forming silicone rubber composition and mother mold 失效
标题翻译：母模成型硅橡胶组合物和母模
公开(公告)号：US06372860B1
公开(公告)日：2002-04-16
申请号：US09520885
申请日：2000-04-05
申请人： Kei Miyoshi , Kouichi Tanaka
发明人： Kei Miyoshi , Kouichi Tanaka
IPC分类号： C08L8310
CPC分类号： C08L83/04 , C08G77/14 , C08G77/20 , C08G77/24 , C08G77/46 , C08G77/70 , C08L83/00
摘要： In a silicone rubber composition comprising an organopolysiloxane as a base polymer, 0.1-50 parts by weight of a modified silicone fluid having a melting point of up to 100° C. and a refractive index difference of 0.01-0.05 from the base polymer is blended per 100 parts by weight of the composition. The composition is cast and cured to form a mother mold which maintains parting properties over a long term.
摘要翻译：在包含作为基础聚合物的有机聚硅氧烷的硅橡胶组合物中，混合0.1-50重量份熔点高达100℃的改性硅氧烷流体和与基础聚合物的折射率差为0.01-0.05的混合物每100重量份组合物。将组合物浇铸和固化以形成长期保持分离性能的母模。

2. 发明申请

US20120029229A1 METHOD FOR PRODUCING HIGH PURITY TERMINAL OLEFIN COMPOUND 有权
标题翻译：生产高纯度终端烯烃化合物的方法
公开(公告)号：US20120029229A1
公开(公告)日：2012-02-02
申请号：US13262372
申请日：2010-01-08
申请人： Kei Miyoshi , Goro Asanuma
发明人： Kei Miyoshi , Goro Asanuma
IPC分类号： C07C7/04 , C07C253/34 , C07C67/54 , C07C45/82
CPC分类号： C07C45/85 , C07C7/005 , C07C7/04 , C07C45/82 , C07C67/60 , C07C253/34 , C07C11/02 , C07C47/21 , C07C69/533 , C07C255/07
摘要： An industrially advantageous method for producing a high purity terminal olefin is disclosed, comprising the steps of (a) contacting a mixture comprising a terminal olefin represented by formula (1): and one or more corresponding internal olefins as impurities, with a brominating agent in the presence of water or an alcohol, to convert the internal olefin(s) to compound(s) having a higher boiling point than the terminal olefin; and (b) purifying the terminal olefin by distillation from the reaction mixture.
摘要翻译：公开了一种用于生产高纯度末端烯烃的工业上有利的方法，其包括以下步骤：（a）将包含由式（1）表示的末端烯烃与一种或多种相应的内部烯烃作为杂质的混合物与溴化剂存在水或醇，将内烯烃转化成沸点高于末端烯烃的化合物; 和（b）通过蒸馏从反应混合物中纯化末端烯烃。

3. 发明授权

US07838117B2 Silicone-sealed LED 有权
标题翻译：硅胶密封LED
公开(公告)号：US07838117B2
公开(公告)日：2010-11-23
申请号：US11334471
申请日：2006-01-19
申请人： Kei Miyoshi , Eiichi Tabei
发明人： Kei Miyoshi , Eiichi Tabei
IPC分类号： B32B27/00 , H01L21/56 , C08L83/00 , C08G77/04
CPC分类号： H01L33/56 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08L83/04 , Y10T428/31663 , C08L83/00
摘要： Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.
摘要翻译：本发明提供一种硅密封LED，其包括：LED芯片，涂覆LED芯片的固化硅橡胶层和涂覆固化的硅橡胶层的周边的固化的有机硅树脂层。还提供了用于制造硅树脂密封LED的工艺和用于密封LED的工艺。在硅酮密封型LED中，设置在表示密封体的有机硅树脂层和LED芯片之间的硅橡胶层用作缓冲层，意味着在代表密封体的有机硅树脂层中不容易产生裂纹，同时充分利用硅橡胶和硅树脂的优异的耐热性，耐候性和色牢度。

4. 发明授权

US07705104B2 Addition curable silicon resin composition for light emitting diode 有权
标题翻译：用于发光二极管的加成可固化硅树脂组合物
公开(公告)号：US07705104B2
公开(公告)日：2010-04-27
申请号：US11461895
申请日：2006-08-02
申请人： Naoki Yamakawa , Kei Miyoshi
发明人： Naoki Yamakawa , Kei Miyoshi
IPC分类号： C08G77/12
CPC分类号： C08G77/44 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08G77/80 , C08L83/04 , C08L2205/02 , C08L2205/035 , C08L83/00
摘要： An addition curable silicone resin composition for a light emitting diode is provided The composition includes an organopolysiloxane that includes a straight-chain segment represented by a formula: —(R12SiO)n— wherein, R1 is an unsaturated aliphatic bonding-free monovalent hydrocarbon group, and n is an integer of 1 or greater, and a resin-like segment consisting of R23SiO1/2 units wherein, R2 is a monovalent hydrocarbon group, an alkoxy group, or a hydroxyl group, SiO2 units, and/or R2SiO3/2 units wherein, R2 is as defined above, in which at least two of all the R2 groups are alkenyl groups. The composition exhibits strong resistance to thermal shock, and is resistant to cracking even under severe temperature cycling.
摘要翻译：提供了一种用于发光二极管的可加成固化的有机硅树脂组合物。该组合物包括有机聚硅氧烷，其包括由下式表示的直链链段： - （R 12 SiO）n - ，其中，R 1是不饱和的无脂族键结的一价烃基，和n为1以上的整数，以及由R 23 SiO 1/2单元构成的树脂状链段，其中，R 2为一价烃基，烷氧基或羟基，SiO 2单元和/或R 2 SiO 3/2单元其中R2如上所定义，其中所有R2基团中的至少两个是烯基。该组合物显示出对热冲击的强耐受性，并且即使在剧烈的温度循环下也能耐裂纹。

5. 发明申请

US20060159937A1 Silicone-sealed LED 有权
标题翻译：硅胶密封LED
公开(公告)号：US20060159937A1
公开(公告)日：2006-07-20
申请号：US11334471
申请日：2006-01-19
申请人： Kei Miyoshi , Eiichi Tabei
发明人： Kei Miyoshi , Eiichi Tabei
IPC分类号： B32B27/00 , H01L21/56 , C08L83/00
CPC分类号： H01L33/56 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08L83/04 , Y10T428/31663 , C08L83/00
摘要： Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.
摘要翻译：本发明提供一种硅密封LED，其包括：LED芯片，涂覆LED芯片的固化硅橡胶层和涂覆固化的硅橡胶层的周边的固化的有机硅树脂层。还提供了用于制造硅树脂密封LED的方法和用于密封LED的工艺。在硅酮密封型LED中，设置在表示密封体的有机硅树脂层和LED芯片之间的硅橡胶层用作缓冲层，意味着在代表密封体的有机硅树脂层中不容易产生裂纹，同时充分利用硅橡胶和硅树脂的优异的耐热性，耐候性和色牢度。

6. 发明授权

US5482992A Room temperature quick curable organopolysiloxane composition excellent in water resistance 失效
标题翻译：室温快速固化有机聚硅氧烷组合物耐水性优良
公开(公告)号：US5482992A
公开(公告)日：1996-01-09
申请号：US328515
申请日：1994-10-25
申请人： Tsuneo Kimura , Kei Miyoshi , Masatoshi Arai
发明人： Tsuneo Kimura , Kei Miyoshi , Masatoshi Arai
IPC分类号： C08K5/04 , C08G65/336 , C08K5/07 , C08K5/17 , C08L71/02 , C08L83/04 , C08L83/06 , C08J3/00 , C08K3/20 , C08L83/00 , C08G77/00
CPC分类号： C08G65/336 , C08K5/07
摘要： A room temperature curable rubber composition of a condensation curing type that comprises as a base polymer a diorganopolysiloxane or a polyoxyalkylene in which both ends of the molecular chain are blocked with a hydrolyzable silyl group, and a .beta.-dicarbonyl compound and an amino group containing organic compound that are blended with the base polymer. Since the room temperature curable rubber composition is cured with water in the air and at the same time the dehydration condensation of the .beta.-carbonyl group and the amino group produces water in the composition, the quick curability and deep curability are improved remarkably. In addition, since this dehydration condensation reaction is an irreversible reaction, the product produced by the condensation dehydration is hydrolyzed to prevent the amino group containing compound from being regenerated, and as a result the hydrophilic nature of the cured product is prevented from increasing not to damage the water resistance.
摘要翻译：一种缩合固化型室温可固化橡胶组合物，其包含作为基础聚合物的二有机聚硅氧烷或分子链两端用可水解甲硅烷基封端的聚氧化烯，以及β-二羰基化合物和含氨基的有机物与基础聚合物共混的化合物。由于室温固化橡胶组合物在空气中用水固化，同时β-羰基和氨基的脱水缩合在组合物中产生水，因此快速固化性和深度固化性显着提高。此外，由于该脱水缩合反应是不可逆反应，所以通过缩合脱水生成的产物被水解以防止含氨基化合物再生，结果，防止了固化产物的亲水性增加，不会增加损坏防水性。

7. 发明授权

US5371116A Vulcanizable organopolysiloxane composition 失效
标题翻译：可硫化的有机聚硅氧烷组合物
公开(公告)号：US5371116A
公开(公告)日：1994-12-06
申请号：US90374
申请日：1993-07-13
申请人： Takafumi Sakamoto , Masatoshi Arai , Kei Miyoshi
发明人： Takafumi Sakamoto , Masatoshi Arai , Kei Miyoshi
IPC分类号： C08K3/16 , C08F2/46 , C08K5/057 , C08K5/098 , C08K5/54 , C08K5/5419 , C08K5/5425 , C08K5/57 , C08L83/04 , C08L83/06
CPC分类号： C08K5/5425 , C08K5/5419 , C08K5/57 , C08L83/04 , C08G77/16
摘要： Vulcanizable organopolysiloxane compositions comprise a hydroxy-terminated organopolysiloxane, an acrylic or methacryllc functional alkoxy silane, a divalent tin compound, an alkoxy-.alpha.-silyl ester, a photopolymerization initiator, and a curing catalyst whereby the composition is cured by UV irradiation and/or by the action of moisture in air. The composition has good shelf stability and can yield rubber elastomers having good physical properties.
摘要翻译：可硫化的有机聚硅氧烷组合物包含羟基封端的有机聚硅氧烷，丙烯酸或甲基丙烯酸官能的烷氧基硅烷，二价锡化合物，烷氧基-α-甲硅烷基酯，光聚合引发剂和固化催化剂，由此组合物通过UV照射和/或通过空气中的水分作用。该组合物具有良好的贮存稳定性并且可以产生具有良好物理性能的橡胶弹性体。

8. 发明授权

US07951891B2 Silicone resin composition for die bonding 有权
标题翻译：用于芯片粘合的硅树脂组合物
公开(公告)号：US07951891B2
公开(公告)日：2011-05-31
申请号：US11447100
申请日：2006-06-06
申请人： Kei Miyoshi , Tomoyuki Goto , Naoki Yamakawa
发明人： Kei Miyoshi , Tomoyuki Goto , Naoki Yamakawa
IPC分类号： C08G77/00 , C08G77/04 , C08G77/12 , C08G77/20 , C08F283/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L2666/14 , C08L83/00
摘要： A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23° C., (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.
摘要翻译：提供了用于芯片接合的有机硅树脂组合物。该组合物包括（A）具有硅键合链烯基并且粘度不超过1000mPa·s的直链有机聚硅氧烷，（B）三维网状有机聚硅氧烷树脂，其为蜡状或固体（C）具有SiH基团的有机氢聚硅氧烷，（D）铂族金属类催化剂。组合物在低波长区域产生具有高硬度，良好的耐热性，透明性和透光性的固化产物。

9. 发明申请

US20080057325A1 HEAT-CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF 有权
标题翻译：导热硅胶组合物及其固化产品
公开(公告)号：US20080057325A1
公开(公告)日：2008-03-06
申请号：US11846862
申请日：2007-08-29
申请人： Ikuo Sakurai , Nobuaki Matsumoto , Kei Miyoshi , Kunihiro Yamada
发明人： Ikuo Sakurai , Nobuaki Matsumoto , Kei Miyoshi , Kunihiro Yamada
IPC分类号： C08G77/12
CPC分类号： C09J183/04 , C08G77/045 , C08G77/18 , C08G77/20 , C08K3/22 , C08K5/56 , C08L83/00 , Y10T428/31663
摘要： Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler. Heat generated by a heat-generating electronic component can be dissipated into a heat-radiating component by sandwiching the cured product between the heat-generating electronic component and the heat-radiating component.
摘要翻译：提供一种导热性有机硅组合物，其包含：（A）100体积份的具有特定结构的有机聚硅氧烷，（B）0.1〜50体积份作为润湿剂的有机硅化合物，并且含有三有机氧基甲硅烷基键合通过可以被支链的亚烷基连接到一个末端，（C）100-2,500体积份的导热填料，和（D）有效量的固化剂。还提供了通过固化该组合物获得的导热硅氧烷固化产物。即使填充有大量导热填料以提供优异的导热性，导热硅氧烷组合物的粘度或塑性的增加也最小，并保持良好的操作性和成型性。即使填充有大量的导热性填料，导热性硅酮固化物也具有优异的柔软性。由发热电子部件产生的热可以通过将固化物夹在发热电子部件和散热部件之间而散发到散热部件中。

10. 发明申请

US20070042533A1 Heat conductive silicone grease composition and cured product thereof 审中-公开
标题翻译：导热硅脂组合物及其固化产物
公开(公告)号：US20070042533A1
公开(公告)日：2007-02-22
申请号：US11505435
申请日：2006-08-17
申请人： Akihiro Endo , Kunihiro Yamada , Hiroaki Kizaki , Kei Miyoshi
发明人： Akihiro Endo , Kunihiro Yamada , Hiroaki Kizaki , Kei Miyoshi
IPC分类号： H01L21/00 , C08L83/04 , B32B9/04
CPC分类号： H01L23/3737 , C10M169/04 , C10M2201/041 , C10M2201/05 , C10M2201/053 , C10M2201/061 , C10M2229/041 , C10M2229/0415 , C10M2229/044 , C10M2229/046 , C10N2210/01 , C10N2210/03 , C10N2210/07 , C10N2210/08 , C10N2220/082 , C10N2230/02 , H01L2224/32245 , Y10T428/31663
摘要： Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to provide from 0.1 to 5.0 hydrogen atoms bonded to silicon atoms within the component (B) for each alkenyl group within the component (A), (C) 100 to 2,200 parts by mass of a heat conductive filler, (D) an effective quantity of a platinum-based catalyst, and (E) an effective quantity of an addition reaction retarder, in which the component (C) includes more than 90% by mass and no more than 100% by mass of an indium powder with an average particle size of 0.1 to 100 μm. Also provided is a heat conductive silicone cured product obtained by curing the above composition by heating at a temperature equal to, or greater than, the melting point of the indium powder. Further provided is an electronic device including an electronic component, a heat radiating member, and a heat conductive member including the above cured product disposed between the electronic component and the heat radiating member. Still further provided is a method of curing the above composition. Even further provided is a method of forming a heat conductive member between an electronic component and a heat radiating member. The above heat conductive silicone grease composition generates a suitably thin cured product with excellent thermal conductivity that prevents problems such as the contamination of components other than the coated component, and the leakage of oily materials from the product if used over extended periods.
摘要翻译：本发明提供一种导热性硅氧烷润滑脂组合物，其包含（A）100质量份在每个分子内含有2个以上与硅原子键合的烯基的有机聚硅氧烷，（B）含有2个以上与各原子中的硅原子键合的氢原子的有机氢聚硅氧烷分子，提供组分（A），（C）中每个链烯基组分（B）内与硅原子键合的0.1至5.0个氢原子，100至2200质量份的导热填料（ D）有效量的铂系催化剂和（E）有效量的加成反应缓凝剂，其中组分（C）包含大于90质量％且不大于100质量％的铟平均粒径为0.1〜100μm的粉末。还提供了通过在等于或大于铟粉末的熔点的温度下加热固化上述组合物而获得的导热硅酮固化产物。还提供了一种电子设备，包括电子部件，散热构件和导热构件，其包括设置在电子部件和散热构件之间的上述固化物。还提供了固化上述组合物的方法。进一步提供一种在电子部件和散热部件之间形成导热部件的方法。上述导热硅脂组合物产生具有优异导热性的合适薄的固化产物，其防止诸如涂层组分之外的组分的污染等问题，以及如果长时间使用则油品从产品中泄漏。

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