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1. 发明授权

US07323250B2 Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device 有权
标题翻译：可固化硅树脂组合物，光半导体用密封材料和光半导体装置
公开(公告)号：US07323250B2
公开(公告)日：2008-01-29
申请号：US11087599
申请日：2005-03-24
申请人： Eiichi Tabei , Kei Miyoshi
发明人： Eiichi Tabei , Kei Miyoshi
IPC分类号： B32B9/04 , C08L83/04
CPC分类号： H01L23/296 , C08G77/045 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08K5/13 , C08K5/3435 , C08L83/04 , H01L2924/0002 , Y10T428/31663 , C08L83/00 , C08L2666/28 , H01L2924/00
摘要： Provided is a curable silicone resin composition including (A) a siloxane-based compound containing at least 2 addition reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a hydrosilylation reaction catalyst, (D) a phenol-based antioxidant, and (E) a hindered amine compound. Also provided are an optical semiconductor sealing material including such a composition, and an optical semiconductor device that has been sealed with such a composition. The curable silicone composition generates a cured product with high hardness and strength, excellent transparency, and excellent light transmittance and photostability particularly in the short wavelength region.
摘要翻译：提供一种可固化的有机硅树脂组合物，其包含（A）在每个分子内含有至少2个加成反应性碳 - 碳双键的硅氧烷基化合物，（B）含有至少2个与硅原子键合的氢原子的硅氧烷基化合物每个分子，（C）氢化硅烷化反应催化剂，（D）苯酚类抗氧化剂和（E）受阻胺化合物。还提供了包括这种组合物的光学半导体密封材料和已经用这种组合物密封的光学半导体器件。可固化硅氧烷组合物产生具有高硬度和强度，优异的透明度和优异的透光率和光稳定性的固化产物，特别是在短波长区域。

2. 发明申请

US20050213926A1 Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device 有权
标题翻译：可固化硅树脂组合物，光半导体用密封材料和光半导体装置
公开(公告)号：US20050213926A1
公开(公告)日：2005-09-29
申请号：US11087599
申请日：2005-03-24
申请人： Eiichi Tabei , Kei Miyoshi
发明人： Eiichi Tabei , Kei Miyoshi
IPC分类号： C08L83/07 , C08K5/13 , C08K5/3435 , C08L83/05 , G02B6/00 , H01L23/29 , H01L23/31
CPC分类号： H01L23/296 , C08G77/045 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08K5/13 , C08K5/3435 , C08L83/04 , H01L2924/0002 , Y10T428/31663 , C08L83/00 , C08L2666/28 , H01L2924/00
摘要： Provided is a curable silicone resin composition including (A) a siloxane-based compound containing at least 2 addition reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a hydrosilylation reaction catalyst, (D) a phenol-based antioxidant, and (E) a hindered amine compound. Also provided are an optical semiconductor sealing material including such a composition, and an optical semiconductor device that has been sealed with such a composition. The curable silicone composition generates a cured product with high hardness and strength, excellent transparency, and excellent light transmittance and photostability particularly in the short wavelength region.
摘要翻译：提供一种可固化的有机硅树脂组合物，其包含（A）在每个分子内含有至少2个加成反应性碳 - 碳双键的硅氧烷基化合物，（B）含有至少2个与硅原子键合的氢原子的硅氧烷基化合物每个分子，（C）氢化硅烷化反应催化剂，（D）苯酚类抗氧化剂和（E）受阻胺化合物。还提供了包括这种组合物的光学半导体密封材料和已经用这种组合物密封的光学半导体器件。可固化硅氧烷组合物产生具有高硬度和强度，优异的透明度和优异的透光率和光稳定性的固化产物，特别是在短波长区域。

3. 发明授权

US07838117B2 Silicone-sealed LED 有权
标题翻译：硅胶密封LED
公开(公告)号：US07838117B2
公开(公告)日：2010-11-23
申请号：US11334471
申请日：2006-01-19
申请人： Kei Miyoshi , Eiichi Tabei
发明人： Kei Miyoshi , Eiichi Tabei
IPC分类号： B32B27/00 , H01L21/56 , C08L83/00 , C08G77/04
CPC分类号： H01L33/56 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08L83/04 , Y10T428/31663 , C08L83/00
摘要： Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.
摘要翻译：本发明提供一种硅密封LED，其包括：LED芯片，涂覆LED芯片的固化硅橡胶层和涂覆固化的硅橡胶层的周边的固化的有机硅树脂层。还提供了用于制造硅树脂密封LED的工艺和用于密封LED的工艺。在硅酮密封型LED中，设置在表示密封体的有机硅树脂层和LED芯片之间的硅橡胶层用作缓冲层，意味着在代表密封体的有机硅树脂层中不容易产生裂纹，同时充分利用硅橡胶和硅树脂的优异的耐热性，耐候性和色牢度。

4. 发明申请

US20060159937A1 Silicone-sealed LED 有权
标题翻译：硅胶密封LED
公开(公告)号：US20060159937A1
公开(公告)日：2006-07-20
申请号：US11334471
申请日：2006-01-19
申请人： Kei Miyoshi , Eiichi Tabei
发明人： Kei Miyoshi , Eiichi Tabei
IPC分类号： B32B27/00 , H01L21/56 , C08L83/00
CPC分类号： H01L33/56 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08L83/04 , Y10T428/31663 , C08L83/00
摘要： Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.
摘要翻译：本发明提供一种硅密封LED，其包括：LED芯片，涂覆LED芯片的固化硅橡胶层和涂覆固化的硅橡胶层的周边的固化的有机硅树脂层。还提供了用于制造硅树脂密封LED的方法和用于密封LED的工艺。在硅酮密封型LED中，设置在表示密封体的有机硅树脂层和LED芯片之间的硅橡胶层用作缓冲层，意味着在代表密封体的有机硅树脂层中不容易产生裂纹，同时充分利用硅橡胶和硅树脂的优异的耐热性，耐候性和色牢度。

5. 发明授权

US07452571B2 Method of sealing semiconductor element mounted on gold-plated printed circuit board 有权
标题翻译：密封安装在镀金印刷电路板上的半导体元件的方法
公开(公告)号：US07452571B2
公开(公告)日：2008-11-18
申请号：US11557249
申请日：2006-11-07
申请人： Eiichi Tabei , Hideyoshi Yanagisawa
发明人： Eiichi Tabei , Hideyoshi Yanagisawa
IPC分类号： B05D3/10 , C08G77/12 , C08G77/20 , C08G77/04 , C08G77/00
CPC分类号： C08L83/06 , H01L23/296 , H01L23/3142 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.
摘要翻译：提供密封半导体元件的方法。所述方法包括以下步骤：用可固化的硅树脂涂覆安装在镀金印刷电路板上的半导体元件，然后固化可固化的硅树脂。在一种方法中，使用包含含酸酐基团的烷氧基硅烷和/或部分水解缩合产物的处理剂对镀金印刷电路板进行预处理。另一种方法中，可固化有机硅树脂包括处理剂。该方法在密封时产生良好的附着力。

6. 发明申请

US20070015884A1 Epoxy resin additives and epoxy resin compositions 审中-公开
标题翻译：环氧树脂添加剂和环氧树脂组合物
公开(公告)号：US20070015884A1
公开(公告)日：2007-01-18
申请号：US11483587
申请日：2006-07-11
申请人： Akira Yamamoto , Shoji Ichinohe , Eiichi Tabei
发明人： Akira Yamamoto , Shoji Ichinohe , Eiichi Tabei
IPC分类号： C08L63/00 , C08L83/00 , C08G77/04 , B32B27/38
CPC分类号： C08L63/00 , C07F7/0838 , C08G59/306 , C08K5/54 , C08L83/00
摘要： Epoxy-modified low molecular weight silicones are added to epoxy resins for reducing surface tension and improving fluidity.
摘要翻译：将环氧改性的低分子量硅氧烷加入到环氧树脂中以降低表面张力并提高流动性。

7. 发明授权

US07019100B2 Curable silicone resin composition 有权
标题翻译：可固化硅树脂组合物
公开(公告)号：US07019100B2
公开(公告)日：2006-03-28
申请号：US10829282
申请日：2004-04-22
申请人： Eiichi Tabei , Mitsuhiro Takarada
发明人： Eiichi Tabei , Mitsuhiro Takarada
IPC分类号： C08G77/50
CPC分类号： C08G77/52
摘要： A curable silicone resin composition is provided which is useful as a material for optical devices or parts, insulation material for electronic devices or parts, or coating material, and which produces a cured product having high hardness and strength and further having good optical transmission in the short wavelength region. The composition includes (A) an aromatic hydrocarbon compound having at least two hydrogen atoms bonded to silicon atoms with the silicon atoms being bonded to the hydrocarbon skeleton of the aromatic hydrocarbon compound, (B) a cyclic siloxane compound having at least two silicon atom-bonded alkenyl groups, and (C) a hydrosilylation reaction catalyst, or (D) an aromatic hydrocarbon compound having at least two alkenyl groups bonded to silicon atoms with the silicon atoms being bonded to the hydrocarbon skeleton of the aromatic hydrocarbon compound, (E) a cyclic siloxane compound having at least two silicon atom-bonded hydrogen atoms, and (C) a hydrosilylation reaction catalyst.
摘要翻译：提供可用作光学器件或部件的材料，电子器件或部件的绝缘材料或涂层材料的可固化的有机硅树脂组合物，并且其产生具有高硬度和强度的固化产物，并且在短波长区域。该组合物包括（A）具有至少两个与硅原子键合的氢原子的芳族烃化合物，其中硅原子与芳族烃化合物的烃骨架结合，（B）具有至少两个硅原子的环状硅氧烷化合物，（C）氢化硅烷化反应催化剂，或（D）具有至少两个与硅原子键合的烯基与芳族烃化合物的烃骨架键合的芳族烃化合物，（E）具有至少两个与硅原子键合的氢原子的环状硅氧烷化合物，和（C）氢化硅烷化反应催化剂。

8. 发明授权

US6140449A Crosslinkable silicon polymer compositions 失效
标题翻译：可交联硅聚合物组合物
公开(公告)号：US6140449A
公开(公告)日：2000-10-31
申请号：US236589
申请日：1999-01-26
申请人： Shigeru Mori , Eiichi Tabei
发明人： Shigeru Mori , Eiichi Tabei
IPC分类号： C08K5/10 , C08G77/60 , C08K5/14 , C08K5/23 , C08L83/16 , C09D183/16 , C08G77/08
CPC分类号： C08G77/60 , C09D183/16
摘要： A crosslinkable silicon polymer composition is provided comprising (A) a silicon polymer containing Si--Si bonds and Si--H groups and having a Mn of 500-500,000, (B) a polyfunctional aromatic carboxylic acid allyl ester, and (C) an organic peroxide or azo compound. The composition cures into a crosslinked polysilane film which is solvent insoluble, tough, and abrasion resistant.
摘要翻译：提供一种可交联的硅聚合物组合物，其包含（A）包含Si-Si键和Si-H基并具有500-500,000的Mn的硅聚合物，（B）多官能芳族羧酸烯丙基酯和（C）有机过氧化物或偶氮化合物。该组合物固化成溶剂不溶性，韧性和耐磨性的交联聚硅烷膜。

9. 发明授权

US5407987A Polycyclic aromatic group - pendant polysilanes and conductive polymers derived therefrom 失效
标题翻译：多环芳基 - 侧基聚硅烷和由其衍生的导电聚合物
公开(公告)号：US5407987A
公开(公告)日：1995-04-18
申请号：US202627
申请日：1994-02-28
申请人： Motoo Fukushima , Eiichi Tabei , Shigeru Mori
发明人： Motoo Fukushima , Eiichi Tabei , Shigeru Mori
IPC分类号： C08G77/60 , H01B1/12 , C08K5/06
CPC分类号： C08G77/60 , H01B1/12
摘要： Polycyclic aromatic group-pendant polysilanes of the following general formula are described.[(R.sup.1 R.sup.2 Si).sub.k (R.sup.3 R.sup.4 Si).sub.m ].sub.nwherein R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are, respectively, a hydrogen atom or a monovalent hydrocarbon group provided that at least one of R.sup.3 and R.sup.4 is a monovalent hydrocarbon group having a polycyclic aromatic group or a biphenyl group. When the polysilane is doped with an oxidative dopant, the polymer is rendered electrically conductive and has thus wide utility in various fields of photoconductive and electrically conductive materials without involving degradation of the polysilane.
摘要翻译：描述了以下通式的多环芳基 - 侧基聚硅烷。 [（R 1 R 2 Si）k（R 3 R 4 Si）m] n其中R 1，R 2，R 3和R 4分别为氢原子或一价烃基，条件是R 3和R 4中的至少一个为具有多环芳香族的一价烃基组或联苯基。当聚硅烷掺杂有氧化掺杂剂时，聚合物变得具有导电性，因此在光导和导电材料的各个领域中具有广泛的用途，而不涉及聚硅烷的降解。

10. 发明申请

US20080281056A1 CURABLE ORGANOSILICON COMPOSITION AND CURED PRODUCT THEREOF 有权
标题翻译：可固化有机硅组合物及其固化产品
公开(公告)号：US20080281056A1
公开(公告)日：2008-11-13
申请号：US12115821
申请日：2008-05-06
申请人： Eiichi Tabei
发明人： Eiichi Tabei
IPC分类号： C08G77/38
CPC分类号： C08K5/5425 , C08G77/52 , C08K5/0025 , C08K5/5419 , C08K5/549 , C08L83/04 , C08L83/00
摘要： Provided is a curable organosilicon composition comprising (A) a polycyclic hydrocarbon group-containing organosilicon compound, which comprises two hydrogen atoms bonded to silicon atoms within each molecule, and is an addition reaction product of (a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule, and (b) a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound having two or more alkenyl groups bonded to silicon atoms within each molecule, and (C) a hydrosilylation reaction catalyst. The curable organosilicon composition yields a cured product that has a high degree of hardness and excellent transparency, crack resistance and heat resistance, and is useful as a curable silicone material, an encapsulating material for optical devices such as optical elements, an encapsulating material for other electronic devices such as semiconductor elements, and an electrically insulating coating material.
摘要翻译：本发明提供一种可固化的有机硅组合物，其包含（A）含有多环烃基的有机硅化合物，其包含在每个分子内与硅原子键合的两个氢原子，并且是（a）具有两个氢原子键合的有机硅化合物的加合反应产物（b）在每个分子内具有两个氢化硅烷化反应性碳 - 碳双键的多环烃化合物，（B）在每个分子内具有两个或多个与硅原子键合的烯基的硅氧烷基化合物，和（C）氢化硅烷化反应催化剂。可固化的有机硅组合物产生具有高硬度和优异的透明度，耐裂纹性和耐热性的固化产物，并且可用作可固化的硅酮材料，用于诸如光学元件的光学装置的封装材料，用于其它的封装材料电子器件如半导体元件和电绝缘涂层材料。

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