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    • 6. 发明授权
    • Solid-state color-image sensor and process for fabricating the same
    • 固态彩色图像传感器及其制造方法
    • US4418284A
    • 1983-11-29
    • US242577
    • 1981-03-11
    • Kazufumi OgawaShigeru KondoYoshiko YasudaTaketoshi YonezawaIsamu Kitahiro
    • Kazufumi OgawaShigeru KondoYoshiko YasudaTaketoshi YonezawaIsamu Kitahiro
    • G03F7/00H01L31/0216B29C27/10B32B31/20H01L31/18
    • G03F7/0007H01L31/02162Y10T156/1074
    • In a step for bonding a color filter to a solid-state image sensor so as to provide a color-sensitive image sensor (to be referred to as "a color-image sensor" in this specification), a method for bonding the color filter to the image sensor with an adhesive which is curable by ultraviolet radiation and also the constructions of color filters and image sensors which can facilitate the bonding step. Further techniques for mass producing high-precision and high-quality solid-state color-image sensors, each of which is bonded with a color filter with a higher degree of accuracy in alignment and by a higher degree of adhesive strength, by carrying out the bonding step in an atmosphere containing oxygen so as to inhibit an adhesive squeezed out of the space between the image sensor and the color filter from being cured and subsequently facilitate the removal of uncured adhesive and by forming protective layers or films over the surfaces to be bonded of the image sensor and color filter prior to the bonding step so as to prevent these surfaces from being damaged during the bonding step.
    • 在将滤色器粘合到固态图像传感器以便提供感光图像传感器(在本说明书中称为“彩色图像传感器”)的步骤中,将滤色器 通过可通过紫外线辐射固化的粘合剂以及彩色滤光片和图像传感器的结构,使图像传感器能够促进粘合步骤。 用于批量生产高精度和高质量固态彩色图像传感器的进一步技术,其中每个通过执行更高精度的校准和更高程度的粘合强度的滤色器粘合 包含氧的气​​氛中的粘合步骤,以便抑制从图像传感器和滤色器之间的空间挤出的粘合剂被固化,并且随后便于去除未固化的粘合剂,并且在待粘合的表面上形成保护层或膜 的粘合步骤之前的图像传感器和滤色器,以防止在接合步骤期间这些表面被损坏。
    • 7. 发明授权
    • Aligning exposure method
    • 调整曝光方式
    • US4636077A
    • 1987-01-13
    • US599734
    • 1984-04-12
    • Noboru NomuraKoichi KugimiyaTakayoshi MatsumuraTaketoshi Yonezawa
    • Noboru NomuraKoichi KugimiyaTakayoshi MatsumuraTaketoshi Yonezawa
    • G03F7/20G03F9/00G01B9/02
    • G03F9/7049G03F7/70408G03F9/7076
    • Disclosed in an aligning and exposing method suitable for use in the production of LSIs. Coherent ray beams are applied from two directions to form interference fringe through interference of the coherent rays. A diffraction grid is disposed in the optic paths of the ray beams substantially in parallel with the interference fringe. The ray beams reflected and transmitted by the grid are converged by a lens system and the intensities of the ray beams are measured to detect the relative position between the interference fringe formed by two coherent ray beams and the diffraction grid, thereby to permit a highly accurate alignment of fine semiconductor element. The pitch of the grid on the substrate is selected to be n (n being an integer) times as large as the pitch of the interference fringe, so that the grid for alignment purpose is formed simultaneously with the formation of the LSI pattern by photolithographic technic. With this method, it is possible to attain a high degree of accuracy of alignment, and to conduct the subsequent exposure using the same ray beam source as that used for the alignment.
    • 公开了适用于制造LSI的对准和曝光方法。 从两个方向施加相干射线束,以形成干涉条纹通过相干射线的干涉。 衍射栅格设置在基本上与干涉条纹平行的射线束的光路中。 由栅格反射和透射的光束由透镜系统会聚,并且测量射线束的强度以检测由两个相干射线束和衍射栅格形成的干涉条纹之间的相对位置,从而允许高精度 精细半导体元件的对准。 衬底上的栅格的间距选择为干涉条纹的间距的n(n是整数)倍,使得用于对准目的的栅格与通过光刻技术形成LSI图案同时形成 。 利用该方法,可以获得高精度的对准,并且可以使用与用于对准的相同的光束源进行后续曝光。
    • 8. 发明授权
    • Solid-state color-image sensor and process for fabricating the same
    • 固态彩色图像传感器及其制造方法
    • US4523102A
    • 1985-06-11
    • US462396
    • 1983-01-31
    • Ogawa KazufumiShigeru KondoYoshiko YasudaTaketoshi YonezawaIsamu Kitahiro
    • Ogawa KazufumiShigeru KondoYoshiko YasudaTaketoshi YonezawaIsamu Kitahiro
    • G03F7/00H01L31/0216H01L31/18H01J40/14
    • G03F7/0007H01L31/02162H01L31/18Y10S522/91Y10T428/31533
    • In a step for bonding a color filter to a solid-state color-image sensor chip with an adhesive which is curable not only by light or more particularly ultraviolet-ray irradiation but also by heating, pre-curing or partial curing is effected by irradiating light rays after the color filter and the chip has been pressed against each other and correctly aligned with each other in a bonding device and then the chip with the partially-bonded color filter is removed from the bonding device and complete curing of the adhesive is accomplished by heating. According to one embodiment of the present invention the bonding step is carried out in an atmosphere containing the oxygen so that the adhesive which has been squeezed out from the space between the color filter and the chip may be prevented from being cured and subsequently removed in a simple manner. According to a further embodiment of the present invention, prior to the bonding step, the color filter and chip are covered with protective layers or films so that surface flaws may be avoided. Thus, the color filters can be bonded to the chips with a higher degree of accuracy and a higher degree of adhesive strength and the mass production of solid-state color-image sensors can be much facilitated.
    • 在将滤色器与固态彩色图像传感器芯片接合的步骤中,不仅可以通过光线或更具体的紫外线照射而固化,而且通过加热固化,固化或部分固化可以通过照射 在滤色器之后的光线和芯片已经在接合装置中彼此压靠并且彼此正确地对准,然后将具有部分粘合的滤色器的芯片从接合装置移除并完成粘合剂的完全固化 通过加热。 根据本发明的一个实施方案,粘结步骤在含有氧的气氛中进行,从而可以防止从滤色器和芯片之间的空间挤出的粘合剂被固化并随后在 简单的方式。 根据本发明的另一实施例,在接合步骤之前,滤色器和芯片被保护层或膜覆盖,从而可以避免表面缺陷。 因此,可以以更高的准确度和更高的粘合强度将滤色器结合到芯片,并且可以大大方便固态彩色图像传感器的批量生产。
    • 9. 发明授权
    • Optical head apparatus including concentric, periodic grating in a
waveguide
    • 光头设备包括波导中的同心圆周期光栅
    • US4991919A
    • 1991-02-12
    • US415224
    • 1989-10-18
    • Seiji NishiwakiYoshinao TaketomiShinji UchidaTakaaki TomitaTaketoshi YonezawaSadao Mizuno
    • Seiji NishiwakiYoshinao TaketomiShinji UchidaTakaaki TomitaTaketoshi YonezawaSadao Mizuno
    • C09B23/00C09B23/02C09B23/10C09B23/14C09B29/00C09B67/46G03C1/825G03C1/83G03C5/16G11B7/09G11B7/12G11B7/13G11B7/135
    • G03C5/16G03C1/832G11B7/0901G11B7/0917G11B7/124G11B7/13G11B7/1384G03C2001/7448G03C2200/44G03C2200/46
    • This invention provides an optical head apparatus in which a grating coupler (8), which is formed on a circular region which has a center on an axis (18) and has a periodical structure with dents and projections in a configuration of concentric circles or spirals around the axis (18), input-couples laser light (7) emitted from a semiconductor laser (5) and turns it into waveguided light (16B) which transmits in a waveguiding layer (15B). The waveguided light (16B) is converted, in a region where the waveguiding layer (15B) and a waveguiding layer (15A) overlap each other, to waveguided light (16A) which transmits in the waveguiding layer (15A). By a grating coupler (9), formed on a ring-shaped area which is located around the axis (18), which has a periodic structure with dents and projections of a configuration of concentric circles or spirals around the axis (18), the waveguided light (16A) is radiated and focused onto points (FA), (FB) and (FC) which are located on the axis (18). Light reflected from a reflecting surface (19) is input-coupled by the grating coupler (9) and is converted to waveguided light (21) which transmits through the waveguiding layer (15A) toward the center. The waveguided light (21) is radiated at the innermost edge of the waveguiding layer (15A) and the amount of radiated light is detected by a light detector (10) to obtained control signal and playback signals.
    • PCT No.PCT / JP88 / 01344 Sec。 371日期:1989年10月18日 102(e)日期1989年10月18日PCT提交1988年12月28日PCT公布。 出版物WO89 / 06424 日期:1989年7月13日。本发明提供了一种光学头装置,其中形成在圆形区域上的光栅耦合器(8),该圆形区域具有在轴线(18)上的中心并且具有凹陷和突起的周期结构 围绕轴线(18)的同心圆或螺旋的构造,从半导体激光器(5)发射的输入耦合激光(7),并将其转换成在波导层(15B)中透射的波导光(16B)。 波导层(16B)在波导层(15B)和波导层(15A)彼此重叠的区域中被转换成在波导层(15A)中透射的波导光(16A)。 通过形成在围绕轴线(18)的环形区域上的光栅耦合器(9),该环形区域具有围绕轴线(18)的同心圆或螺旋构型的凹陷和突起的周期性结构, 波导光(16A)被辐射并聚焦到位于轴线(18)上的点(FA),(FB)和(FC)上。 从反射面(19)反射的光被光栅耦合器(9)输入耦合,并被转换成通过波导层(15A)向中心透射的波导光(21)。 波导光(21)被辐射在波导层(15A)的最内边缘,并且由光检测器(10)检测辐射光量,以获得控制信号和重放信号。