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    • 3. 发明授权
    • Optoelectronic devices and manufacturing method thereof
    • 光电器件及其制造方法
    • US06476379B2
    • 2002-11-05
    • US09764287
    • 2001-01-19
    • Kazunori AndoShoichi TakahashiHiroshi Naka
    • Kazunori AndoShoichi TakahashiHiroshi Naka
    • G02B636
    • G02B6/4201G02B6/4212G02B6/4239G02B6/4243G02B6/4245G02B6/4253G02B6/4265G02B6/4274
    • It is a subject to realize an optoelectronic device for reliably monitoring a laser optical beam intensity by a photodetector. In the optoelectric device, a semiconductor laser chip, an optical fiber for taking a front laser beam of the semiconductor laser chip from the top end surface and a photodetector for receiving a rear laser beam of the semiconductor laser chip are fixed on a main surface of a platform, and each of the optical parts and portions including. an optical channels between each of the optical parts are covered with a silicone gel, wherein a portion of the main surface of the platform between the top end of the optical fiber and the semiconductor laser chip and between the photodetector and the semiconductor laser chip has concaves so that voids are not formed upon curing of the silicone gel. The edge of the concave on the side of the semiconductor laser chip is situated closer to the semiconductor laser chip than to the emitting facet of the semiconductor laser chip. The end of the bonding portion for fixing the semiconductor laser chip to the platform recedes inward of the emitting facet.
    • 实现用于通过光电检测器可靠地监测激光光束强度的光电子器件是一个主题。 在光电装置中,半导体激光芯片,从顶端面取出半导体激光芯片的前方激光束的光纤和用于接收半导体激光芯片的后方激光的光检测器固定在 平台,以及每个光学部件和部分。 在每个光学部件之间的光通道被硅凝胶覆盖,其中在光纤的顶端和半导体激光器芯片之间以及光电检测器和半导体激光器芯片之间的平台的主表面的一部分具有凹部 使得硅氧烷凝胶固化后不会形成空隙。 半导体激光芯片侧的凹部的边缘比半导体激光器芯片的发光面更靠近半导体激光器芯片。 用于将半导体激光芯片固定到平台的接合部分的末端在发射面的内侧后退。