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1. 发明授权

US06371664B1 Photoelectronic device and method of manufacturing the same 有权
公开(公告)号：US06371664B1
公开(公告)日：2002-04-16
申请号：US09864317
申请日：2001-05-25
申请人： Shoichi Takahashi , Hiroshi Naka , Toshimasa Miura , Shuji Eguchi
发明人： Shoichi Takahashi , Hiroshi Naka , Toshimasa Miura , Shuji Eguchi
IPC分类号： G02B636
摘要： There is provided a method for manufacturing a photoelectronic device comprising a silicon platform (support substrate) having a groove for guiding an optical fiber, a semiconductor laser chip secured on the substrate and an optical fiber fitted in the groove at one end thereof to be secured on the support substrate wherein the optical fiber fitted in the groove is secured on the support substrate with a first bonding element constituted by an adhesive injected to fill the groove under the optical fiber; one surface of the support substrate is covered with silicone gel; the support substrate is secured in a package made of plastic; and the package is filled with the silicone gel which is a protective film transparent to light transmitted by the optical fiber and resistant to humidity.

2. 发明授权

US06282350B1 Photoelectronic device and method of manufacturing the same 有权
标题翻译：光电器件及其制造方法
公开(公告)号：US06282350B1
公开(公告)日：2001-08-28
申请号：US09379468
申请日：1999-08-24
申请人： Shoichi Takahashi , Hiroshi Naka , Toshimasa Miura , Shuji Eguchi
发明人： Shoichi Takahashi , Hiroshi Naka , Toshimasa Miura , Shuji Eguchi
IPC分类号： G02B636
CPC分类号： G02B6/4239 , G02B6/4202 , G02B6/423 , G02B6/4243 , G02B6/4253 , G02B6/4257 , G02B6/4265 , G02B6/4273 , G02B6/4286 , H01L2224/48247 , H01L2924/181 , H01L2924/00012
摘要： There is provided a method for manufacturing a photoelectronic device comprising a silicon platform (support substrate) having a groove for guiding an optical fiber, a semiconductor laser chip secured on the substrate and an optical fiber fitted in the groove at one end thereof to be secured on the support substrate wherein the optical fiber fitted in the groove is secured on the support substrate with a first bonding element constituted by an adhesive injected to fill the groove under the optical fiber; one surface of the support substrate is covered with silicone gel; the support substrate is secured in a package made of plastic; and the package is filled with the silicone gel which is a protective film transparent to light transmitted by the optical fiber and resistant to humidity.
摘要翻译：提供了一种制造光电器件的方法，该光电子器件包括具有用于引导光纤的沟槽的硅平台（支撑衬底），固定在衬底上的半导体激光器芯片和在其一端嵌入槽中的光纤以固定在支撑基板上，其中安装在凹槽中的光纤被固定在支撑基板上，第一接合元件由注入的粘合剂构成，以填充光纤下方的凹槽; 支撑基板的一个表面被硅胶覆盖; 支撑基板被固定在由塑料制成的包装中; 并且该封装填充有硅凝胶，该硅凝胶是对由光纤传输的光透明并且耐潮湿的保护膜。

3. 发明授权

US5435535A Device for further processing after copying 失效
标题翻译：复印后进一步处理的装置
公开(公告)号：US5435535A
公开(公告)日：1995-07-25
申请号：US247750
申请日：1994-05-23
申请人： Kaoru Suzuki , Tadahiro Ando , Hiroshi Naka , Mitsutoshi Sawada , Tomonori Ohata , Hiroshi Miura , Masayoshi Nakabayashi , Eiiti Ando
发明人： Kaoru Suzuki , Tadahiro Ando , Hiroshi Naka , Mitsutoshi Sawada , Tomonori Ohata , Hiroshi Miura , Masayoshi Nakabayashi , Eiiti Ando
IPC分类号： B42C1/12 , B65H29/32 , B65H29/58 , B65H29/60 , G03G15/00 , B31B1/68
CPC分类号： G03G15/6541 , B42C1/12 , B65H29/32 , B65H29/58 , B65H29/60 , G03G15/6538 , G03G15/6552 , G03G15/6582 , B65H2511/214 , B65H2511/414 , B65H2511/51 , B65H2513/50 , G03G2215/00426 , G03G2215/00818 , G03G2215/00827 , G03G2215/00911 , Y10S414/105
摘要： A transport path is branched into a main pass and a bypass. A deflector is provided at a branch point, for switching the path either to the bypass or to the main pass. Sheet detection switches are respectively provided along the bypass and the main pass, and also on a stapler plate, for controlling the rotation of a transfer roller. In this way, a first sheet being transported through the main pass and a second sheet being transported through the bypass can be discharged onto the stapler plate at the same time. As a result, the problem of the device being made larger or reducing the quality of the sheets can be prevented, and a faster process after copying can be achieved. If a second sheet of a next set is not detected on the bypass within a predetermined time period, the sheet in the main pass is discharged.
摘要翻译：传输路径分支为主通道和旁路。偏转器设置在分支点处，用于将路径切换到旁路或主通道。纸张检测开关分别沿旁路和主通道设置，并且还在装订器板上设置，用于控制转印辊的旋转。以这种方式，通过主通道传送的第一片材和通过旁路传送的第二片材可以同时被排出到订书机板上。结果，可以防止设备变大或降低纸张质量的问题，并且可以实现复印之后的更快的处理。如果在预定时间段内没有在旁路上检测到下一组的第二张，则主通道中的纸张被排出。

4. 发明授权

US5344130A Device for further processing after copying 失效
标题翻译：复印后进一步处理的装置
公开(公告)号：US5344130A
公开(公告)日：1994-09-06
申请号：US982320
申请日：1992-11-25
申请人： Kaoru Suzuki , Tadahiro Ando , Hiroshi Naka , Mitsutoshi Sawada , Tomonori Ohata , Hiroshi Miura , Masayoshi Nakabayashi , Eiiti Ando
发明人： Kaoru Suzuki , Tadahiro Ando , Hiroshi Naka , Mitsutoshi Sawada , Tomonori Ohata , Hiroshi Miura , Masayoshi Nakabayashi , Eiiti Ando
IPC分类号： B42C1/12 , B65H29/32 , B65H29/58 , B65H29/60 , G03G15/00 , B65H39/10 , B42B2/00 , B65H31/08
CPC分类号： G03G15/6541 , B42C1/12 , B65H29/32 , B65H29/58 , B65H29/60 , G03G15/6538 , G03G15/6552 , G03G15/6582 , B65H2511/214 , B65H2511/414 , B65H2511/51 , B65H2513/50 , G03G2215/00426 , G03G2215/00818 , G03G2215/00827 , G03G2215/00911 , Y10S414/105
摘要： A transport path is branched into a main pass and a bypass. A deflector is provided at a branch point, for switching the path either to the bypass or to the main pass. Sheet detection switches are respectively provided along the bypass and the main pass, and also on a stapler plate, for controlling the rotation of a transfer roller. In this way, a first sheet being transported through the main pass and a second sheet being transported through the bypass can be discharged onto the stapler plate at the same time. As a result, the problem of the device being made larger or reducing the quality of the sheets can be prevented, and a faster process after copying can be achieved.
摘要翻译：传输路径分支为主通道和旁路。偏转器设置在分支点处，用于将路径切换到旁路或主通道。纸张检测开关分别沿旁路和主通道设置，并且还在装订器板上设置，用于控制转印辊的旋转。以这种方式，通过主通道传送的第一片材和通过旁路传送的第二片材可以同时被排出到订书机板上。结果，可以防止设备变大或降低纸张质量的问题，并且可以实现复印之后的更快的处理。

5. 再颁专利

USRE34378E Light emitting device with improved electrode structure to minimize short circuiting 失效
公开(公告)号：USRE34378E
公开(公告)日：1993-09-14
申请号：US615827
申请日：1990-11-15
申请人： Masaaki Sawai , Masamichi Kobayashi , Shoji Hayashi , Hiroshi Naka , Masahiro Ichiki
发明人： Masaaki Sawai , Masamichi Kobayashi , Shoji Hayashi , Hiroshi Naka , Masahiro Ichiki
IPC分类号： H01L33/38 , H01S5/02 , H01S5/042 , H01S5/227
CPC分类号： H01S5/0425 , H01L33/38 , H01S5/0202 , H01S5/227 , H01S5/2275 , H01S5/2277
摘要： A light emitting device is disclosed which includes a semiconductor block, an active layer disposed in such a fashion as to penetrate through the mutually facing end surfaces of the semiconductor block, and an electrode disposed on the main plane of the semiconductor block, wherein the electrode consists of a first electrode portion disposed along the active layer, and a second electrode portion continuing integrally the first electrode portion and having the periphery thereof out of contact from the periphery of the second main plane of the semiconductor block. A current is caused to uniformly flow through the entire active layer, and a light emitting operation is carried out stably. Since the electrode is not disposed on the periphery of the semiconductor block, the occurrence of junction short-curcuit, which might otherwise occur when a wafer is cut off to produce laser chips or when the corners of the chip break off, can be reduced.

6. 发明授权

US4692927A Light emitting device with improved electrode structure to minimize short circuiting 失效
标题翻译：具有改善的电极结构的发光器件以使短路最小化
公开(公告)号：US4692927A
公开(公告)日：1987-09-08
申请号：US712029
申请日：1985-03-15
申请人： Masaaki Sawai , Masamichi Kobayashi , Shoji Hayashi , Hiroshi Naka , Masahiro Ichiki
发明人： Masaaki Sawai , Masamichi Kobayashi , Shoji Hayashi , Hiroshi Naka , Masahiro Ichiki
IPC分类号： H01L33/38 , H01S5/02 , H01S5/042 , H01S5/227 , H01S5/40 , H01S3/19
CPC分类号： H01S5/4031 , H01L24/05 , H01L33/38 , H01S5/0425 , H01S5/32 , H01L2224/04042 , H01L2224/48463 , H01L2924/12036 , H01L2924/12042 , H01L33/385 , H01S5/0202 , H01S5/227 , H01S5/2275 , H01S5/2277
摘要： A light emitting device is disclosed which includes a semiconductor block, an active layer disposed in such a fashion as to penetrate through the mutually facing end surfaces of the semiconductor block, and an electrode disposed on the main plane of the semiconductor block, wherein the electrode consists of a first electrode portion disposed along the active layer, and a second electrode portion continuing integrally the first electrode portion and having the periphery thereof out of contact from the periphery of the second main plane of the semiconductor block. A current is caused to uniformly flow through the entire active layer, and a light emitting operation is carried out stably. Since the electrode is not disposed on the periphery of the semiconductor block, the occurrence of junction short-circuit, which might otherwise occur when a wafer is cut off to produce laser chips or when the corners of the chip break off, can be reduced.
摘要翻译：公开了一种发光器件，其包括半导体块，以穿透半导体块的相互面对的端面的方式设置的有源层和设置在半导体块的主平面上的电极，其中，包括沿着有源层设置的第一电极部分和第二电极部分，该第二电极部分一体地连接第一电极部分，并且其周边与半导体块的第二主平面的周边不接触。导致电流均匀地流过整个有源层，并且稳定地执行发光操作。由于电极没有设置在半导体块的周围，所以可以减少当晶片被切断以产生激光芯片时或当芯片的角落断裂时可能发生的结短路的发生。

7. 发明授权

US07275453B2 Analyzing apparatus and fine particle collecting apparatus 有权
标题翻译：分析装置和微粒收集装置
公开(公告)号：US07275453B2
公开(公告)日：2007-10-02
申请号：US10773743
申请日：2004-02-06
申请人： Masanori Ishikawa , Naoya Sasaki , Katsumi Nagumo , Shigenori Morishima , Hiroshi Naka
发明人： Masanori Ishikawa , Naoya Sasaki , Katsumi Nagumo , Shigenori Morishima , Hiroshi Naka
IPC分类号： G01N1/00
CPC分类号： G01N1/2214 , G01N1/2208 , G01N1/24 , G01N2001/022 , G01N2001/028 , G01N2001/2223
摘要： A simple and convenient analyzing apparatus is provided which easily, conveniently, and efficiently collects a material in the state of fine particles adhered to a target object, extracts the object to be analyzed, and analyzes the extracted object. An apparatus for detecting fine particles in a gas which sucks the gas under measurement from the target object by using a suction pump, extracts the fine particles contained in the gas under measurement, and performs measurement by using a spectrometer is embodied such that an inertial impactor for collecting the fine particles having diameters not less than a specified particle diameter is disposed upstream of the spectrometer, the fine particles are collected in the fine particle collector of the inertial impactor, the collector containing the collected fine particles is heated such that the collected fine particles are vaporized into a gas, and the vaporized fluid to be examined is supplied to the spectrometer to be measured thereby.
摘要翻译：提供了一种简单便利的分析装置，其容易地，方便地且有效地收集粘附到目标物体上的细小颗粒状态的材料，提取待分析物体，并分析提取的物体。一种用于检测气体中的微粒的装置，其通过使用抽吸泵从目标物体吸取测量中的气体，提取测量气体中所含的微粒，并且通过使用光谱仪进行测量，使得惯性冲击器为了收集直径不小于规定粒径的微粒，配置在光谱仪的上游侧，将微粒收集在惯性冲击器的微粒收集体中，将收集的微粒的收集体加热使得收集的细将颗粒蒸发成气体，将待检测的汽化流体供给到待测量的光谱仪。

8. 发明授权

US5605322A Device for further processing after copying 失效
公开(公告)号：US5605322A
公开(公告)日：1997-02-25
申请号：US538574
申请日：1995-10-03
申请人： Kaoru Suzuki , Tadahiro Ando , Hiroshi Naka , Mitsutoshi Sawada , Tomonori Ohata , Hiroshi Miura , Masayoshi Nakabayashi , Eiiti Ando
发明人： Kaoru Suzuki , Tadahiro Ando , Hiroshi Naka , Mitsutoshi Sawada , Tomonori Ohata , Hiroshi Miura , Masayoshi Nakabayashi , Eiiti Ando
IPC分类号： B42C1/12 , B65H29/32 , B65H29/58 , B65H29/60 , G03G15/00 , B42B5/00 , B65H31/12
CPC分类号： G03G15/6541 , B42C1/12 , B65H29/32 , B65H29/58 , B65H29/60 , G03G15/6538 , G03G15/6552 , G03G15/6582 , B65H2511/214 , B65H2511/414 , B65H2511/51 , B65H2513/50 , G03G2215/00426 , G03G2215/00818 , G03G2215/00827 , G03G2215/00911 , Y10S414/105
摘要： A transport path is branched into a main pass and a bypass. A deflector is provided at a branch point, for switching the path either to the bypass or to the main pass. Sheet detection switches are respectively provided along the bypass and the main pass, and also on a stapler plate, for controlling the rotation of a transfer roller. In this way, a first sheet being transported through the main pass and a second sheet being transported through the bypass can be discharged onto the stapler plate at the same time. As a result, the problem of the device being made larger or reducing the quality of the sheets can be prevented, and a faster process after copying can be achieved.

9. 发明授权

US4785455A Light emitting device with improved electrode structure to minimize short circuiting 失效
标题翻译：具有改善的电极结构的发光器件以使短路最小化
公开(公告)号：US4785455A
公开(公告)日：1988-11-15
申请号：US78097
申请日：1987-07-27
申请人： Masaaki Sawai , Masamichi Kobayashi , Shoji Hayashi , Hiroshi Naka , Masahiro Ichiki
发明人： Masaaki Sawai , Masamichi Kobayashi , Shoji Hayashi , Hiroshi Naka , Masahiro Ichiki
IPC分类号： H01L33/38 , H01S5/02 , H01S5/042 , H01S5/227 , H01S5/40 , H01S3/19
CPC分类号： H01S5/4031 , H01L24/05 , H01L33/38 , H01S5/0425 , H01S5/32 , H01L2224/04042 , H01L2224/48463 , H01L2924/12036 , H01L2924/12042 , H01L33/385 , H01S5/0202 , H01S5/227 , H01S5/2275 , H01S5/2277
摘要： A light emitting device is disclosed which includes a semiconductor block, an active layer disposed in such a fashion as to penetrate through the mutually facing end surfaces of the semiconductor block, and an electrode disposed on the main plane of the semiconductor block, wherein the electrode consists of a first electrode portion disposed along the active layer, and a second electrode portion continuing integrally the first electrode portion and having the periphery thereof out of contact from the periphery of the second main plane of the semiconductor block. A current is caused to uniformly flow through the entire active layer, and a light emitting operation is carried out stably. Since the electrode is not disposed on the periphery of the semiconductor block, the occurrence of junction short-curcuit, which might otherwise occur when a wafer is cut off to produce laser chips or when the corners of the chip break off, can be reduced.
摘要翻译：公开了一种发光器件，其包括半导体块，以穿透半导体块的相互面对的端面的方式设置的有源层和设置在半导体块的主平面上的电极，其中，包括沿着有源层设置的第一电极部分和第二电极部分，该第二电极部分一体地连接第一电极部分，并且其周边与半导体块的第二主平面的周边不接触。导致电流均匀地流过整个有源层，并且稳定地进行发光操作。由于电极没有设置在半导体块的周围，所以可以减少当晶片被切断以产生激光芯片时或当芯片的角落断开时可能发生的结短路。

10. 发明授权

US4701927A Light emitting chip and optical communication apparatus using the same 失效
标题翻译：发光芯片和使用其的光通信装置
公开(公告)号：US4701927A
公开(公告)日：1987-10-20
申请号：US695005
申请日：1985-01-25
申请人： Hiroshi Naka , Ichiro Seko , Shuji Kobayashi , Makoto Haneda
发明人： Hiroshi Naka , Ichiro Seko , Shuji Kobayashi , Makoto Haneda
IPC分类号： G02B6/42 , H01S5/00 , H01S5/02 , H01S5/227 , H04B10/00 , H04B10/40 , H04B10/50 , H04B10/60 , H01L33/00 , H01S3/19
CPC分类号： H01L33/24 , G02B6/4202 , H01S5/2275 , H01S5/02208 , H01S5/02284 , H01S5/2201 , H01S5/2222
摘要： This invention relates to a semiconductor laser of a buried-hetero structure. In this semiconductor laser, the side surfaces of an active layer are in contact with a plane having a stable state of interface. As a result, the threshold current value of this semiconductor laser is low, and a stable operation can be obtained without causing any kink (projection ) in the current-optical output characteristics. An optical communication system using this semiconductor layer has a low operating current, and can maintain high coupling efficiency with an optical fiber without the occurrence of noise, so that optical communication having high reliability is possible.
摘要翻译：本发明涉及一种埋入异质结构的半导体激光器。在该半导体激光器中，有源层的侧面与具有稳定的界面状态的平面接触。结果，该半导体激光器的阈值电流值低，并且可以获得稳定的操作而不会导致电流 - 光输出特性中的任何扭结（投影）。使用该半导体层的光通信系统具有低的工作电流，并且可以在不发生噪声的情况下保持与光纤的高耦合效率，使得具有高可靠性的光通信成为可能。

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