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    • 6. 发明授权
    • Method of purging CVD apparatus and method for judging maintenance of times of semiconductor production apparatuses
    • 吹扫CVD装置的方法以及用于判断半导体制造装置的维护时间的方法
    • US06887721B2
    • 2005-05-03
    • US10021259
    • 2001-12-19
    • Hiroyuki HasegawaTomonori YamaokaYoshio IshiharaHiroshi MasusakiTakayuki SatouKatsumasa SuzukiHiroki Tokunaga
    • Hiroyuki HasegawaTomonori YamaokaYoshio IshiharaHiroshi MasusakiTakayuki SatouKatsumasa SuzukiHiroki Tokunaga
    • H01L21/00C23C16/44C23C16/52H01L21/205H01L21/66
    • C23C16/4408C23C16/4401C23C16/52
    • The present invention discloses a CVD apparatus which, together with being able to efficiently perform purging treatment after maintenance, uses for the purge gas a mixed gas of a gas having high thermal conductivity and an inert gas during heated flow purging treatment after maintenance to perform startup of the CVD apparatus while reducing the amount of time required for purging treatment. Purging treatment before semiconductor film formation is performed by repeating the pumping of a vacuum and the introduction of inert gas a plurality of times. In addition, in order to judge suitable maintenance times of semiconductor production apparatuses that perform corrosive gas treatment in a reaction chamber, the moisture concentration in reaction chamber is measured with moisture meter connected to the reaction chamber when performing the corrosive gas treatment, and maintenance times of the semiconductor production apparatus are determined according to changes in the moisture concentration when corrosive gas treatment is performed repeatedly. In addition, in order to measure the moisture of corrosive gas during processing while preventing obstruction of piping in a moisture monitoring apparatus and semiconductor production apparatus equipped therewith, a moisture monitoring apparatus, which is equipped with a pipe, of which one end is connected to reaction chamber into which corrosive gas flows, and a moisture meter connected to the other end of that pipe which measures the moisture contained in the corrosive gas introduced from the reaction chamber, is at least equipped with pipe heating mechanism that heats the pipe.
    • 本发明公开了一种CVD装置,其能够在维护后能够有效地进行清洗处理,在维护后的加热流动清洗处理中,使用具有高导热性的气体和惰性气体的混合气体进行吹扫,以进行启动 的CVD装置,同时减少清洗处理所需的时间。 在半导体膜形成之前的清洗处理通过重复抽真空和引入惰性气体进行多次。 此外,为了判断在反应室中进行腐蚀性气体处理的半导体制造装置的合适的维护时间,在进行腐蚀性气体处理时,在与反应室连接的水分计测量反应室中的水分浓度,并进行维护时间 根据重复进行腐蚀性气体处理时的水分浓度的变化来确定半导体制造装置。 此外,为了在加工过程中测量腐蚀性气体的湿度,同时防止水分监测装置和配备的半导体制造装置中的管道的阻塞,配备有管道的水分监测装置,其一端连接到 腐蚀性气体流入的反应室和与该管的另一端连接的湿度计,其测量从反应室引入的腐蚀性气体中含有的水分,至少配备有加热管道的管道加热机构。
    • 7. 发明授权
    • Semiconductor manufacturing method and semiconductor manufacturing apparatus
    • 半导体制造方法和半导体制造装置
    • US06794204B2
    • 2004-09-21
    • US10254601
    • 2002-09-26
    • Hiroyuki HasegawaTomonori YamaokaYoshio IshiharaHiroshi Masusaki
    • Hiroyuki HasegawaTomonori YamaokaYoshio IshiharaHiroshi Masusaki
    • G01R3126
    • C23C16/4408C23C16/4401C23C16/52C23C16/54C30B25/14C30B25/165H01L21/67242Y10S438/906Y10S438/908Y10T29/41
    • A semiconductor manufacturing method whereby reactive gas processing such as selective epitaxial growth can be carried out with high precision by correctly adjusting conditions during processing is performed by a semiconductor manufacturing apparatus which can restrict increases in the moisture content, prevent heavy metal pollution and the like, and investigate the correlation between moisture content in the process chamber and outside regions. The moisture content in a reaction chamber and in a gas discharge system of the reaction chamber are measured when a substrate is provided, and the conditions for reactive gas processing are adjusted based on the moisture content. Furthermore, the moisture content in the airtight space is measured by a first moisture measuring device which is connected to the airtight space, and thereafter, the substrate is inserted and ejected by a substrate carrying system, and a reactive gas is processed while measuring the moisture content in the reaction chamber by a second moisture measuring device, which is connected to the reaction chamber, after the moisture content in the airtight space is measured.
    • 通过半导体制造装置可以通过正确调整处理条件,可以高精度地进行诸如选择性外延生长的反应气体处理的半导体制造方法,该半导体制造装置可以限制水分含量的增加,防止重金属污染等, 并研究了处理室和外部区域的含水量之间的相关性。 在提供基板时测量反应室和反应室的气体放电系统中的含水量,并且基于水分含量调节反应气体处理条件。 此外,气密空间中的水分含量通过连接到气密空间的第一湿度测量装置测量,然后由基板承载系统插入和喷射基板,并且在测量湿气的同时处理反应气体 在测量气密空间中的水分含量之后,通过与反应室连接的第二湿度测量装置在反应室中的含量。
    • 9. 发明授权
    • Analysis method for gases and apparatus therefor
    • 气体及其设备分析方法
    • US6040915A
    • 2000-03-21
    • US147349
    • 1998-12-07
    • Shang-Qian WuJun-ichi MorishitaYoshio IshiharaTetsuya Kimijima
    • Shang-Qian WuJun-ichi MorishitaYoshio IshiharaTetsuya Kimijima
    • G01N21/39G01N21/61
    • G01N21/39G01N21/3504
    • A method for analyzing an impurity in a gas including the steps of: introducing a gas with an impurity into a first cell; introducing a gas with no impurity into a second cell; maintaining identical pressures in the first and second cells; irradiating a light from a light irradiating source; varying the frequency of the light over a frequency spectrum including an absorption frequency of the impurity; splitting the light by a splitting device in order to pass a first beam through the first cell and to pass a second beam through the second cell; measuring the intensity of the light passing through the first cell over the frequency spectrum with a first measuring device and the intensity of the light passing through the second cell over the frequency spectrum with a second measuring device; and determining an absorption spectrum of the impurity in the gas based on the difference between data measured with the first measuring device and data from measured with the second measuring device.
    • PCT No.PCT / JP98 / 01608 Sec。 371日期1998年12月7日第 102(e)日期1998年12月7日PCT提交1998年4月8日PCT公布。 WO98 / 45686 PCT公开 日期:1998年10月15日一种用于分析气体中的杂质的方法,包括以下步骤:将具有杂质的气体引入第一电池; 将无杂质的气体引入第二电池; 在第一和第二细胞中保持相同的压力; 照射来自光照射源的光; 在包括杂质的吸收频率的频谱上改变光的频率; 通过分离装置分离光,以使第一光束通过第一单元并使第二光束通过第二单元; 利用第一测量装置测量在频谱上通过第一单元的光的强度,并用第二测量装置测量通过频谱通过第二单元的光的强度; 以及基于由第一测量装置测量的数据与由第二测量装置测量的数据之间的差异来确定气体中的杂质的吸收光谱。