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    • 1. 发明授权
    • BJT with surface resistor connection
    • BJT带表面电阻连接
    • US06563194B1
    • 2003-05-13
    • US09666848
    • 2000-09-21
    • Kazuhisa Sakamoto
    • Kazuhisa Sakamoto
    • H01L27082
    • H01L27/0658H01L29/7304
    • A semiconductor device having: a base area of the first conduction type formed on a semiconductor substrate; an emitter area of the second conduction type formed in the base area; and a collector area of the second conduction type formed as joined to the base area. In the collector area, an impurity area of the first conduction type is formed as separated from the base area. A surface resistor is connected to a base electrode connected to the base area. The surface resistor is connected, at other position thereof, to the impurity area.
    • 一种半导体器件,具有:在半导体衬底上形成的第一导电类型的基极区域; 形成在基部区域中的第二导电类型的发射极区域; 以及形成为接合到基部区域的第二导电类型的集电极区域。 在集电极区域中,形成与基极区域分离的第一导电类型的杂质区域。 表面电阻器连接到连接到基座区域的基极。 表面电阻器的其他位置连接到杂质区域。
    • 5. 发明授权
    • Semiconductor device having MOS field-effect transistor
    • 具有MOS场效应晶体管的半导体器件
    • US06747315B1
    • 2004-06-08
    • US10030089
    • 2002-01-14
    • Kazuhisa Sakamoto
    • Kazuhisa Sakamoto
    • H01L2976
    • H01L29/7805H01L29/0696H01L29/1095H01L29/7806H01L29/7811
    • P-wells (21) are formed in, for example, a matrix in an N-type semiconductor layer (20). At an outer periphery of each of the P-wells (21) is formed, for example, a rectangular ring-shaped N+-type diffused source region (22), between which and an N-type semiconductor layer (20) which provides a drain region (23) is formed a channel region (26). A source electrode (33) is formed in such a manner as to be contact with the center portion of each of the P-wells (21) and the source region (22) in such a construction that a contact portion (40) of the P-well with the source electrode consists of P+-type regions and N+-type regions formed alternately. As a result, it is possible to rapidly eliminate the minority carrier generated in the P-well owing to a counter electromotive force etc., thus speeding the switching operations.
    • P阱(21)形成在例如N型半导体层(20)中的矩阵中。 在每个P阱(21)的外周形成例如矩形的N +型N +型扩散源极区(22),N型半导体层(20)与N型半导体层 其提供漏极区(23)形成沟道区(26)。 源电极(33)以与每个P阱(21)和源极区(22)的中心部分接触的方式形成为这样的结构:使得接触部分 源电极的P阱由交替形成的P +型区域和N +型区域组成。 结果,可以通过反电动势等快速地消除在P阱中产生的少数载流子,从而加速切换操作。
    • 6. 发明授权
    • Junction field-effect transistor
    • 结场效应晶体管
    • US06740907B2
    • 2004-05-25
    • US10263800
    • 2002-10-04
    • Kazuhisa Sakamoto
    • Kazuhisa Sakamoto
    • H01L2974
    • H01L29/41725H01L29/42316H01L29/808
    • A junction field-effect transistor is formed by providing a p-type gate region in a surface of an n-type semiconductor layer and n-type drain and source regions sandwiching the gate region on the surface of the n-type semiconductor layer. A p-type diffusion region is formed at least in the region on the side of the drain close to the gate region on the surface of the n-type semiconductor layer. A drain electrode is formed so that it contacts with the p-type diffusion region. As a result, the junction FET can be reduced in drain-source leak current Idss to a small, stable value. Thus, a high-gain junction field-effect transistor is obtained which has small variation in performance among actual units manufactured.
    • 通过在n型半导体层的表面上设置p型栅极区域和在n型半导体层的表面上夹持栅极区域的n型漏极和源极区域来形成结型场效应晶体管。 至少在靠近n型半导体层的表面上的栅极区域的漏极侧的区域中形成p型扩散区。 漏极形成为与p型扩散区接触。 结果,可以将漏极 - 源极泄漏电流Idss中的结FET减小到一个小的稳定值。 因此,获得了在制造的实际单元中性能变化小的高增益结型场效应晶体管。
    • 7. 发明授权
    • Semiconductor apparatus having field limiting rings
    • 具有场限制环的半导体装置
    • US5841181A
    • 1998-11-24
    • US716412
    • 1996-09-20
    • Kazuhisa Sakamoto
    • Kazuhisa Sakamoto
    • H01L29/73H01L21/331H01L21/761H01L29/06H01L29/732H01L29/74H01L29/78H01L29/861H01L23/58H01L27/082
    • H01L29/7322H01L29/0619H01L2924/0002
    • It is an object to provide a semiconductor apparatus having improved dielectric breakdown strength characteristics both by eliminating the discontinuity caused to the interface between a semiconductor layer and the overlying insulator film on account of the FLR provided for increasing the dielectric breakdown strength and by preventing the redistribution of impurities from the FLR into the insulator film. Another object is to provide a process for fabricating such improved semiconductor apparatus. The semiconductor layers of a first conduction type (i.e., n.sup.- type semiconductor layer 1b and epitaxial layer 1c) are provided with the semiconductor region of a second conduction type (i.e., p-type base region 2) to form a semiconductor device (transistor) and FLRs 4a and 4b are provided external to the perimeter of said semiconductor region but without being exposed from the surface of the epitaxial layer 1c.
    • PCT No.PCT / JP96 / 00367 Sec。 371日期:1996年9月20日 102(e)1996年9月20日PCT PCT 1996年2月19日PCT公布。 公开号WO96 / 26547 日期为1996年8月29日的目的在于提供一种具有改善的介电击穿强度特性的半导体装置,其特征在于,通过消除由于为提高介电击穿强度而提供的FLR而导致的半导体层与上覆绝缘膜之间的界面的不连续性 并且通过防止杂质从FLR再分配到绝缘膜中。 另一个目的是提供一种用于制造这种改进的半导体装置的方法。 第一导电类型(即n型半导体层1b和外延层1c)的半导体层设置有第二导电类型(即,p型基极区域2)的半导体区域,以形成半导体器件(晶体管 )和FLR 4a和4b设置在所述半导体区域的周边的外部,但不暴露于外延层1c的表面。