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1. 发明申请

US20080211565A1 Mute Circuit 失效
标题翻译：静音电路
公开(公告)号：US20080211565A1
公开(公告)日：2008-09-04
申请号：US12099500
申请日：2008-04-08
申请人： Kazuhiro Shimomura , Makoto Yamamoto
发明人： Kazuhiro Shimomura , Makoto Yamamoto
IPC分类号： H03K17/16 , H03F1/14
CPC分类号： H03F3/72
摘要： AnNchMOS transistor (1) is provided for muting of an output terminal (10) to which positive and negative output signals are outputted, and a mute switch circuit (3) is provided for controlling on/off of the transistor (1) by switching a voltage applied to the gate of the transistor (1). When muting is turned off, the back gate of the transistor (1) is biased by resistance division between resistors (R1 and R2) connected in series between the output terminal (10) and a predetermined negative potential (VSS).
摘要翻译： AnNchMOS晶体管（1）用于使正输出和负输出信号输出的输出端子（10）静音，并且提供静音开关电路（3），用于通过切换晶体管（1）来控制晶体管（1）的导通/截止施加到晶体管（1）的栅极的电压。当静音被关闭时，晶体管（1）的背栅极通过串联连接在输出端子（10）和预定负电位（VSS）之间的电阻器（R 1和R 2）之间的电阻分压来偏置。

2. 发明申请

US20070076903A1 Mute circuit 失效
标题翻译：静音电路
公开(公告)号：US20070076903A1
公开(公告)日：2007-04-05
申请号：US11492120
申请日：2006-07-25
申请人： Kazuhiro Shimomura , Makoto Yamamoto
发明人： Kazuhiro Shimomura , Makoto Yamamoto
IPC分类号： H04B15/00 , H03F1/14
CPC分类号： H03F3/72
摘要： An NchMOS transistor (1) is provided for muting of an output terminal (10) to which positive and negative output signals are outputted, and a mute switch circuit (3) is provided for controlling on/off of the transistor (1) by switching a voltage applied to the gate of the transistor (1). When muting is turned off, the back gate of the transistor (1) is biased by resistance division between resistors (R1 and R2) connected in series between the output terminal (10) and a predetermined negative potential (VSS).
摘要翻译：提供NchMOS晶体管（1），用于使输出端和输出端输出的输出端子（10）静音，并设置静音开关电路（3），用于通过切换控制晶体管（1）的导通/截止施加到晶体管（1）的栅极的电压。当静音被关闭时，晶体管（1）的背栅极通过串联连接在输出端子（10）和预定负电位（VSS）之间的电阻器（R 1和R 2）之间的电阻分压来偏置。

3. 发明授权

US07579893B2 Mute circuit 失效
标题翻译：静音电路
公开(公告)号：US07579893B2
公开(公告)日：2009-08-25
申请号：US12099500
申请日：2008-04-08
申请人： Kazuhiro Shimomura , Makoto Yamamoto
发明人： Kazuhiro Shimomura , Makoto Yamamoto
IPC分类号： H03L5/00
CPC分类号： H03F3/72
摘要： An NchMOS transistor (1) is provided for muting of an output terminal (10) to which positive and negative output signals are outputted, and a mute switch circuit (3) is provided for controlling on/off of the transistor (1) by switching a voltage applied to the gate of the transistor (1). When muting is turned off, the back gate of the transistor (1) is biased by resistance division between resistors (R1 and R2) connected in series between the output terminal (10) and a predetermined negative potential (VSS).
摘要翻译：提供NchMOS晶体管（1），用于使输出端和输出端输出的输出端子（10）静音，并设置静音开关电路（3），用于通过切换控制晶体管（1）的导通/截止施加到晶体管（1）的栅极的电压。当静音被关闭时，晶体管（1）的背栅通过串联连接在输出端子（10）和预定负电位（VSS）之间的电阻器（R1和R2）之间的电阻分压而偏置。

4. 发明授权

US07372325B2 Mute circuit 失效
标题翻译：静音电路
公开(公告)号：US07372325B2
公开(公告)日：2008-05-13
申请号：US11492120
申请日：2006-07-25
申请人： Kazuhiro Shimomura , Makoto Yamamoto
发明人： Kazuhiro Shimomura , Makoto Yamamoto
IPC分类号： H03F1/14
CPC分类号： H03F3/72
摘要： An NchMOS transistor (1) is provided for muting of an output terminal (10) to which positive and negative output signals are outputted, and a mute switch circuit (3) is provided for controlling on/off of the transistor (1) by switching a voltage applied to the gate of the transistor (1). When muting is turned off, the back gate of the transistor (1) is biased by resistance division between resistors (R1 and R2) connected in series between the output terminal (10) and a predetermined negative potential (VSS).
摘要翻译：提供NchMOS晶体管（1），用于使输出端和输出端输出的输出端子（10）静音，并设置静音开关电路（3），用于通过切换控制晶体管（1）的导通/截止施加到晶体管（1）的栅极的电压。当静音被关闭时，晶体管（1）的背栅极通过串联连接在输出端子（10）和预定负电位（VSS）之间的电阻器（R 1和R 2）之间的电阻分压来偏置。

5. 发明申请

US20060269715A1 Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tape 审中-公开
标题翻译：粘合材料，剥离粘合剂材料的方法和压敏粘合带
公开(公告)号：US20060269715A1
公开(公告)日：2006-11-30
申请号：US11491280
申请日：2006-07-24
申请人： Munehiro Hatai , Masateru Fukuoka , Satoshi Hayashi , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Tsuyoshi Hasegawa
发明人： Munehiro Hatai , Masateru Fukuoka , Satoshi Hayashi , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Tsuyoshi Hasegawa
IPC分类号： B32B9/04 , C08K5/23
CPC分类号： C09J11/06 , C09J7/38 , Y10T156/1126 , Y10T428/14 , Y10T428/28 , Y10T428/2809 , Y10T428/2861
摘要： An object of the present invention is to provide an adhesive substance capable of being easily peeled off without damaging an adherend by giving stimulation thereto, a tape employing this adhesive substance, and a method for peeling off the adhesive substance. An adhesive substance, which contains a gas-generating agent for generating gas by stimulation, gas generated from said gas-generating agent being discharged to the outside of said adhesive substance so as not to foam said adhesive substance, and gas generated from said gas-generating agent peeling at least part of an adhesive surface of said adhesive substance off an adherend so as to decrease adhesive strength.
摘要翻译：本发明的目的是提供一种能够容易地剥离而不会对被粘物产生刺激而剥离的粘合剂物质，使用这种粘合物质的胶带以及剥离粘合剂物质的方法。一种粘合剂物质，其含有用于通过刺激产生气体的气体发生剂，从所述气体发生剂产生的气体排放到所述粘合剂物质的外部，以便不会使所述粘合剂物质发泡，发生剂将粘合剂物质的粘合剂表面的至少一部分从被粘物上剥离，以降低粘合强度。

6. 发明授权

US06866739B2 Film with metal foil 有权
标题翻译：薄膜带金属箔
公开(公告)号：US06866739B2
公开(公告)日：2005-03-15
申请号：US10183239
申请日：2002-06-26
申请人： Akihiko Nishimoto , Katsura Hayashi , Yasuhiko Ohyama , Shigeru Danjo , Kazuhiro Shimomura
发明人： Akihiko Nishimoto , Katsura Hayashi , Yasuhiko Ohyama , Shigeru Danjo , Kazuhiro Shimomura
IPC分类号： B32B7/12 , B32B15/08 , H05K3/06 , H05K3/20 , H05K3/40 , H05K3/46 , B32B31/20
CPC分类号： B32B15/08 , B32B7/12 , B32B2457/08 , H05K3/06 , H05K3/20 , H05K3/4069 , H05K3/4614 , Y10S156/922 , Y10T156/11 , Y10T428/31678 , Y10T428/31692 , Y10T428/31699
摘要： In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.
摘要翻译：在本发明的带有金属箔的薄膜中，通过粘合剂层将金属箔粘附到树脂膜的表面。通过使（甲基）丙烯酸酯与含羧基的自由基聚合性单体的共聚得到的丙烯酸类聚合物与具有与羧基反应的官能团的多官能化合物交联而形成粘合剂。具有金属箔的膜对于通过所谓的转印方法制造多层布线板非常有用。通过使用该膜，可以制造具有精细且高度密集的布线/电路层并具有非常优异的平坦表面的多层布线板。

7. 发明授权

US06451441B1 Film with metal foil 失效
标题翻译：薄膜带金属箔
公开(公告)号：US06451441B1
公开(公告)日：2002-09-17
申请号：US09539261
申请日：2000-03-30
申请人： Akihiko Nishimoto , Katsura Hayashi , Yasuhiko Ohyama , Shigeru Danjo , Kazuhiro Shimomura
发明人： Akihiko Nishimoto , Katsura Hayashi , Yasuhiko Ohyama , Shigeru Danjo , Kazuhiro Shimomura
IPC分类号： B32B1508
CPC分类号： B32B15/08 , B32B7/12 , B32B2457/08 , H05K3/06 , H05K3/20 , H05K3/4069 , H05K3/4614 , Y10S156/922 , Y10T156/11 , Y10T428/31678 , Y10T428/31692 , Y10T428/31699
摘要： In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.
摘要翻译：在本发明的带有金属箔的薄膜中，通过粘合剂层将金属箔粘附到树脂膜的表面。通过使（甲基）丙烯酸酯与含羧基的自由基聚合性单体的共聚得到的丙烯酸类聚合物与具有与羧基反应的官能团的多官能化合物交联而形成粘合剂。具有金属箔的膜对于通过所谓的转印方法制造多层布线板非常有用。通过使用该膜，可以制造具有精细且高度密集的布线/电路层并具有非常优异的平坦表面的多层布线板。

8. 发明申请

US20070037364A1 Method for manufacturing semiconductor chip 审中-公开
标题翻译：制造半导体芯片的方法
公开(公告)号：US20070037364A1
公开(公告)日：2007-02-15
申请号：US10577442
申请日：2004-12-02
申请人： Daihei Sugita , Masateru Fukuoka , Munehiro Hatai , Satoshi Hayashi , Kazuhiro Shimomura , Yoshikazu Kitajima , Yasuhiko Oyama
发明人： Daihei Sugita , Masateru Fukuoka , Munehiro Hatai , Satoshi Hayashi , Kazuhiro Shimomura , Yoshikazu Kitajima , Yasuhiko Oyama
IPC分类号： H01L21/00
CPC分类号： H01L21/67132
摘要： It is the object of the invention to provide a method for manufacturing a semiconductor chip capable of obtaining a semiconductor chip at a high manufacturing efficiency without damages. The invention is a method for manufacturing a semiconductor chip, which comprises a tape adhesion step of sticking a pressure sensitive adhesive tape for dicing having a pressure sensitive adhesive layer containing a gas generating agent for generating a gas by radiating light to a semiconductor wafer with a circuit formed; a dicing step for dicing the wafer with the pressure sensitive adhesive tape for dicing stuck and dividing the semiconductor wafer into each semiconductor chip; a separation step of separating at least a portion of the pressure sensitive adhesive tape for dicing from the semiconductor chip by radiating light to the divided each semiconductor chip; and a pickup step of picking the semiconductor chip up by a needle-less pickup method.
摘要翻译：本发明的目的是提供一种能够以高制造效率获得半导体芯片而不损坏的半导体芯片的制造方法。本发明是一种半导体芯片的制造方法，其特征在于，包括粘贴粘合带的粘合步骤，该粘合带具有粘合层，该压敏粘合带具有含有用于产生气体的气体发生剂的压敏粘合剂层，电路形成; 切割步骤，用用于切割粘合的压敏粘合带切割晶片并将半导体晶片分成每个半导体芯片; 分离步骤，通过向所述分割的每个半导体芯片照射光来将用于切割的所述压敏粘合带的至少一部分与所述半导体芯片分离; 以及通过无针拾取方法拾取半导体芯片的拾取步骤。

9. 发明申请

US20080314507A1 Ic Chip Manufacturing Method 审中-公开
标题翻译： Ic芯片制造方法
公开(公告)号：US20080314507A1
公开(公告)日：2008-12-25
申请号：US11658880
申请日：2004-08-02
申请人： Munehiro Hatai , Satoshi Hayashi , Masateru Fukuoka , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Daihei Sugita , Yoshikazu Kitajima
发明人： Munehiro Hatai , Satoshi Hayashi , Masateru Fukuoka , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Daihei Sugita , Yoshikazu Kitajima
IPC分类号： B32B38/10
CPC分类号： C09J5/00 , C08K5/23 , C09J5/08 , C09J7/38 , C09J7/385 , C09J2201/128 , C09J2203/326 , C09J2205/102 , C09J2205/302 , C09J2433/00 , H01L21/67115
摘要： It is an object of the invention to provide a method for producing an IC chip capable of producing an IC chip with a thickness as extremely thin as 50 μm or thinner, for example, about 25 to 30 μm at a high productivity.The invention is a method for producing an IC chip, which comprises; at least a step 1 of fixing a wafer in a support plate by sticking the wafer to the gas generating agent-containing face of a pressure sensitive adhesive double-faced tape having a pressure sensitive adhesive layer containing a gas generating agent for generating a gas by light radiation in at least one face; a step 2 of grinding the wafer in a state of being fixed in the support plate through the pressure sensitive adhesive double-faced tape; a step 3 of radiating light to the pressure sensitive adhesive double-faced tape; and a step 4 of separating the pressure sensitive adhesive double-faced tape from the wafer, a gas releasing speed from the pressure sensitive adhesive double-faced tape being 5 L/cm2·min or higher in the step 3.
摘要翻译：本发明的目的是提供一种制造IC芯片的方法，所述IC芯片能够以高生产率制造厚度极薄至50μm或更薄，例如约25至30μm的IC芯片。本发明是一种制造IC芯片的方法，包括：至少步骤1，通过将晶片粘贴到具有压敏粘合剂层的压敏粘合剂双面胶带的气体发生剂含有面上，将晶片固定在支撑板中，该压敏粘合剂层含有用于产生气体的气体发生剂至少一面的光辐射; 在通过压敏双面胶带固定在支撑板上的状态下研磨晶片的步骤2; 向压敏胶双面胶带照射光的步骤3; 以及在步骤3中将压敏粘合剂双面胶带从晶片分离的步骤4，压敏粘合剂双面胶带的气体释放速度为5L / cm2.min以上。

10. 发明申请

US20050173051A1 Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tape 审中-公开
标题翻译：粘合材料，剥离粘合剂材料的方法和压敏粘合带
公开(公告)号：US20050173051A1
公开(公告)日：2005-08-11
申请号：US10495516
申请日：2002-06-03
申请人： Munehiro Hatai , Masateru Fukuoka , Satoshi Hayashi , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Tsuyoshi Hasegawa
发明人： Munehiro Hatai , Masateru Fukuoka , Satoshi Hayashi , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Tsuyoshi Hasegawa
IPC分类号： C09J7/02 , C09J11/06 , B32B31/24 , C09J11/08 , C09J5/00 , B32B33/00 , B32B7/06 , B32B3/16 , B32B7/12
CPC分类号： C09J11/06 , C09J7/38 , Y10T156/1126 , Y10T428/14 , Y10T428/28 , Y10T428/2809 , Y10T428/2861
摘要： An object of the present invention is to provide an adhesive substance capable of being easily peeled off without damaging an adherend by giving stimulation thereto, a tape employing this adhesive substance, and a method for peeling off the adhesive substance. An adhesive substance, which contains a gas-generating agent for generating gas by stimulation, gas generated from said gas-generating agent being discharged to the outside of said adhesive substance so as not to foam said adhesive substance, and gas generated from said gas-generating agent peeling at least part of an adhesive surface of said adhesive substance off an adherend so as to decrease adhesive strength.
摘要翻译：本发明的目的是提供一种能够容易地剥离而不会对被粘物产生刺激而剥离的粘合剂物质，使用这种粘合物质的胶带以及剥离粘合剂物质的方法。一种粘合剂物质，其含有用于通过刺激产生气体的气体发生剂，从所述气体发生剂产生的气体排放到所述粘合剂物质的外部，以便不会使所述粘合剂物质发泡，发生剂将粘合剂物质的粘合剂表面的至少一部分从被粘物上剥离，以降低粘合强度。

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