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1. 发明申请

US20130220533A1 PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD 审中-公开
标题翻译：压敏胶粘剂，压敏粘合胶带，以及水处理方法
公开(公告)号：US20130220533A1
公开(公告)日：2013-08-29
申请号：US13822731
申请日：2011-09-14
申请人： Toru Tonegawa , Takahiro Asao , Yuichi Sumii , Shigeru Nomura , Masateru Fukuoka , Daihei Sugita
发明人： Toru Tonegawa , Takahiro Asao , Yuichi Sumii , Shigeru Nomura , Masateru Fukuoka , Daihei Sugita
IPC分类号： H01L21/683 , C09J133/10 , C09J183/04 , B32B38/10
CPC分类号： H01L21/6836 , B32B38/10 , C08G77/20 , C08L83/04 , C09J7/38 , C09J133/02 , C09J133/10 , C09J183/04 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2483/00 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T428/2891
摘要： The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200° C. or higher. The present invention also aims to provide an adhesive tape produced from the adhesive composition, and wafer treatment method using the adhesive composition. The present invention provides an adhesive composition including an adhesive component, a photoinitiator, and a silicone compound containing a functional group that is crosslinkable with the adhesive component.
摘要翻译：本发明的目的在于提供一种粘合剂组合物，其具有高的初始粘合性并且可以强烈固定被粘物，同时即使在200℃或更高温度下进行高温处理，也可以通过光照射容易地剥离。本发明的目的还在于提供一种由粘合剂组合物制造的胶带以及使用粘合剂组合物的晶片处理方法。本发明提供一种粘合剂组合物，其包含粘合剂组分，光引发剂和含有可与粘合剂组分交联的官能团的硅氧烷化合物。

2. 发明授权

US08197773B2 Micro fluid device 有权
标题翻译：微流体装置
公开(公告)号：US08197773B2
公开(公告)日：2012-06-12
申请号：US12921247
申请日：2009-03-11
申请人： Masateru Fukuoka , Kazuki Yamamoto , Yoshinori Akagi , Hiroji Fukui
发明人： Masateru Fukuoka , Kazuki Yamamoto , Yoshinori Akagi , Hiroji Fukui
IPC分类号： B01L3/00
CPC分类号： F04B19/006 , B01L3/50273 , B01L2300/0816 , B01L2300/0861 , B01L2300/0887 , B01L2400/046 , B01L2400/0487 , Y10T137/206
摘要： The present invention provides a microfluidic device with a micro-pump system in which the production process is simplified and the device is further downsized. A microfluidic device 1 has a gas generation portion 3. The gas generation portion 3 has a substrate 10 and a gas generation layer 20. The substrate 10 has a first main surface 10a and a second main surface 10b. The substrate 10 has a micro-channel 14 with an opening at least on the first main surface 10a. The gas generation layer 20 is disposed on the first main surface 10a of the substrate 10 so as to cover an opening 14a. The gas generation layer 20 generates gas by receiving an external stimulus.
摘要翻译：本发明提供了具有微型泵系统的微流体装置，其中生产过程被简化并且装置进一步小型化。微流体装置1具有气体产生部3.气体生成部3具有基板10和气体生成层20.基板10具有第一主面10a和第二主面10b。衬底10具有至少在第一主表面10a上具有开口的微通道14。气体产生层20设置在基板10的第一主表面10a上以覆盖开口14a。气体生成层20通过接收外部刺激而产生气体。

3. 发明申请

US20110129392A1 MICROPUMP DEVICE 有权
标题翻译： MICROPUMP设备
公开(公告)号：US20110129392A1
公开(公告)日：2011-06-02
申请号：US12674514
申请日：2009-03-17
申请人： Kazuki Yamamoto , Masateru Fukuoka , Yoshinori Akagi , Hiroji Fukui
发明人： Kazuki Yamamoto , Masateru Fukuoka , Yoshinori Akagi , Hiroji Fukui
IPC分类号： B01J19/08
CPC分类号： F04B19/006 , F04B9/12 , F04B19/20 , F04B19/24 , F04F1/06
摘要： To provide a micropump device having good controllability over the amount of gas generated from the gas generating material and thus the amount of liquid fed by the micropump. The micropump device includes a micropump 10 and a controller 50. The micropump 10 includes: a microchannel 22 serving as a channel for liquid; a gas generating material 34 generating a gas upon exposure to light and supplying the gas to the microchannel 22; and a light source 42 for irradiating the gas generating material 34 with light 44. The controller 50 supplies to the light source 42 a control pulse signal CS that causes the light source 42 to blink on and off in a binary manner by repeating a pulse train pattern composed of a fixed number of bits each capable of having two states, one of which is a first level allowing the light source 42 to be turned on and the other of which is a second level allowing the light source 42 to be turned off.
摘要翻译：提供一种对从气体发生材料产生的气体量以及由微型泵供给的液体量具有良好可控性的微型泵装置。微型泵装置包括微型泵10和控制器50.微型泵10包括：用作液体通道的微通道22; 气体发生材料34，其在暴露于光时产生气体并将气体供应到微通道22; 以及用于用光44照射气体发生材料34的光源42.控制器50向光源42提供控制脉冲信号CS，其使得光源42以二进制方式通过重复脉冲串来开启和关闭图案由固定数量的位组成，每个位都能够具有两个状态，其中一个是允许光源42接通的第一电平，另一个是允许光源42断开的第二电平。

4. 发明申请

US20110014096A1 PHOTORESPONSIVE GAS-GENERATING MATERIAL, MICROPUMP AND MICROFLUID DEVICE 有权
标题翻译：光电气体发生材料，微波和微流体装置
公开(公告)号：US20110014096A1
公开(公告)日：2011-01-20
申请号：US12920884
申请日：2009-03-11
申请人： Masateru Fukuoka , Kazuki Yamamoto , Yoshinori Akagi , Hiroji Fukui
发明人： Masateru Fukuoka , Kazuki Yamamoto , Yoshinori Akagi , Hiroji Fukui
IPC分类号： B01L3/00 , C06B45/10 , C06B25/04 , C06B45/12
CPC分类号： B01L3/50273 , B01L2300/0887 , B01L2400/046 , F04B19/006 , Y10T137/2082
摘要： The present invention provides a photoresponsive gas-generating material that is to be used in a micropump of a microfluid device having fine channels formed therein, and is capable of effectively generating gases for transporting a microfluid in response to light irradiation and transporting the microfluid at an improved transport efficiency. The present invention also provides a micropump incorporating the photoresponsive gas-generating material.A photoresponsive gas-generating material 13 is to be used in a micropump having fine channels formed in a substrate, and comprises a photo-sensitive acid-generating agent and an acid-sensitive gas-generating agent, and a micropump 10 has the photoresponsive gas-generating material 13 housed therein.
摘要翻译：本发明提供一种光响应性气体发生材料，其用于具有形成在其中的细通道的微流体装置的微型泵中，并且能够有效地产生响应于光照射而输送微流体的气体，并且在提高运输效率。本发明还提供了一种结合光响应气体发生材料的微型泵。光响应性气体发生材料13用于形成在基板上的细通道的微型泵中，并且包含光敏酸产生剂和酸敏感气体发生剂，微泵10具有光响应气体其中容纳有生产材料13。

5. 发明申请

US20080314507A1 Ic Chip Manufacturing Method 审中-公开
标题翻译： Ic芯片制造方法
公开(公告)号：US20080314507A1
公开(公告)日：2008-12-25
申请号：US11658880
申请日：2004-08-02
申请人： Munehiro Hatai , Satoshi Hayashi , Masateru Fukuoka , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Daihei Sugita , Yoshikazu Kitajima
发明人： Munehiro Hatai , Satoshi Hayashi , Masateru Fukuoka , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Daihei Sugita , Yoshikazu Kitajima
IPC分类号： B32B38/10
CPC分类号： C09J5/00 , C08K5/23 , C09J5/08 , C09J7/38 , C09J7/385 , C09J2201/128 , C09J2203/326 , C09J2205/102 , C09J2205/302 , C09J2433/00 , H01L21/67115
摘要： It is an object of the invention to provide a method for producing an IC chip capable of producing an IC chip with a thickness as extremely thin as 50 μm or thinner, for example, about 25 to 30 μm at a high productivity.The invention is a method for producing an IC chip, which comprises; at least a step 1 of fixing a wafer in a support plate by sticking the wafer to the gas generating agent-containing face of a pressure sensitive adhesive double-faced tape having a pressure sensitive adhesive layer containing a gas generating agent for generating a gas by light radiation in at least one face; a step 2 of grinding the wafer in a state of being fixed in the support plate through the pressure sensitive adhesive double-faced tape; a step 3 of radiating light to the pressure sensitive adhesive double-faced tape; and a step 4 of separating the pressure sensitive adhesive double-faced tape from the wafer, a gas releasing speed from the pressure sensitive adhesive double-faced tape being 5 L/cm2·min or higher in the step 3.
摘要翻译：本发明的目的是提供一种制造IC芯片的方法，所述IC芯片能够以高生产率制造厚度极薄至50μm或更薄，例如约25至30μm的IC芯片。本发明是一种制造IC芯片的方法，包括：至少步骤1，通过将晶片粘贴到具有压敏粘合剂层的压敏粘合剂双面胶带的气体发生剂含有面上，将晶片固定在支撑板中，该压敏粘合剂层含有用于产生气体的气体发生剂至少一面的光辐射; 在通过压敏双面胶带固定在支撑板上的状态下研磨晶片的步骤2; 向压敏胶双面胶带照射光的步骤3; 以及在步骤3中将压敏粘合剂双面胶带从晶片分离的步骤4，压敏粘合剂双面胶带的气体释放速度为5L / cm2.min以上。

6. 发明授权

US07335578B2 Method for manufacturing semiconductor chip 有权
标题翻译：制造半导体芯片的方法
公开(公告)号：US07335578B2
公开(公告)日：2008-02-26
申请号：US10490557
申请日：2003-04-09
申请人： Masateru Fukuoka , Munehiro Hatai , Satoshi Hayashi , Yasuhiko Oyama , Shigeru Danjo , Masahiko Kitamura , Koichi Yajima
发明人： Masateru Fukuoka , Munehiro Hatai , Satoshi Hayashi , Yasuhiko Oyama , Shigeru Danjo , Masahiko Kitamura , Koichi Yajima
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , B24B7/228 , B24B41/068 , H01L21/304 , H01L21/67092 , H01L21/67132 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/6834 , Y10S438/977
摘要： A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having individual circuits. By interposing an adhesive sheet, whose adhesive force is lowered by stimulation, between the semiconductor wafer (W) and the support plate (13), the front side of the semiconductor wafer (W) is adhered to the support plate (13), thereby exposing the rear face (10) of the semiconductor wafer (W). The rear face (10) of the semiconductor wafer (W) with the support plate (13) is ground. After the grinding is finished, the semiconductor wafer (W) held with the rear face (10) up is diced into semiconductor chips (C). The adhesive sheet is given stimulus to lower the adhesive force and the semiconductor chips (C) are removed from the support plate (13). The semiconductor wafer and semiconductor chips are always supported by the support plate, avoiding damage and deformation.
摘要翻译：在由街道划分的区域中形成电路的半导体晶片（W）被分成具有单独电路的半导体芯片。通过在半导体晶片（W）和支撑板（13）之间插入粘合剂片（其粘合力被刺激而降低），半导体晶片（W）的前侧被粘附到支撑板（13），由此暴露半导体晶片（W）的背面（10）。研磨具有支撑板（13）的半导体晶片（W）的背面（10）。研磨完成后，将保持有背面（10）的半导体晶片（W）切成半导体芯片（C）。给予粘合片刺激以降低粘合力，并且将半导体芯片（C）从支撑板（13）移除。半导体晶片和半导体芯片总是由支撑板支撑，避免损坏和变形。

7. 发明申请

US20050173051A1 Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tape 审中-公开
标题翻译：粘合材料，剥离粘合剂材料的方法和压敏粘合带
公开(公告)号：US20050173051A1
公开(公告)日：2005-08-11
申请号：US10495516
申请日：2002-06-03
申请人： Munehiro Hatai , Masateru Fukuoka , Satoshi Hayashi , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Tsuyoshi Hasegawa
发明人： Munehiro Hatai , Masateru Fukuoka , Satoshi Hayashi , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Tsuyoshi Hasegawa
IPC分类号： C09J7/02 , C09J11/06 , B32B31/24 , C09J11/08 , C09J5/00 , B32B33/00 , B32B7/06 , B32B3/16 , B32B7/12
CPC分类号： C09J11/06 , C09J7/38 , Y10T156/1126 , Y10T428/14 , Y10T428/28 , Y10T428/2809 , Y10T428/2861
摘要： An object of the present invention is to provide an adhesive substance capable of being easily peeled off without damaging an adherend by giving stimulation thereto, a tape employing this adhesive substance, and a method for peeling off the adhesive substance. An adhesive substance, which contains a gas-generating agent for generating gas by stimulation, gas generated from said gas-generating agent being discharged to the outside of said adhesive substance so as not to foam said adhesive substance, and gas generated from said gas-generating agent peeling at least part of an adhesive surface of said adhesive substance off an adherend so as to decrease adhesive strength.
摘要翻译：本发明的目的是提供一种能够容易地剥离而不会对被粘物产生刺激而剥离的粘合剂物质，使用这种粘合物质的胶带以及剥离粘合剂物质的方法。一种粘合剂物质，其含有用于通过刺激产生气体的气体发生剂，从所述气体发生剂产生的气体排放到所述粘合剂物质的外部，以便不会使所述粘合剂物质发泡，发生剂将粘合剂物质的粘合剂表面的至少一部分从被粘物上剥离，以降低粘合强度。

8. 发明申请

US20110044863A1 MICRO FLUID DEVICE 有权
标题翻译：微流体装置
公开(公告)号：US20110044863A1
公开(公告)日：2011-02-24
申请号：US12921247
申请日：2009-03-11
申请人： Masateru Fukuoka , Kazuki Yamamoto , Yoshinori Akagi , Hiroji Fukui
发明人： Masateru Fukuoka , Kazuki Yamamoto , Yoshinori Akagi , Hiroji Fukui
IPC分类号： B01L3/00
CPC分类号： F04B19/006 , B01L3/50273 , B01L2300/0816 , B01L2300/0861 , B01L2300/0887 , B01L2400/046 , B01L2400/0487 , Y10T137/206
摘要： The present invention provides a microfluidic device with a micro-pump system in which the production process is simplified and the device is further downsized. A microfluidic device 1 has a gas generation portion 3. The gas generation portion 3 has a substrate 10 and a gas generation layer 20. The substrate 10 has a first main surface 10a and a second main surface 10b. The substrate 10 has a micro-channel 14 with an opening at least on the first main surface 10a. The gas generation layer 20 is disposed on the first main surface 10a of the substrate 10 so as to cover an opening 14a. The gas generation layer 20 generates gas by receiving an external stimulus.
摘要翻译：本发明提供了具有微型泵系统的微流体装置，其中生产过程被简化并且装置进一步小型化。微流体装置1具有气体产生部3.气体生成部3具有基板10和气体生成层20.基板10具有第一主面10a和第二主面10b。衬底10具有至少在第一主表面10a上具有开口的微通道14。气体产生层20设置在基板10的第一主表面10a上以覆盖开口14a。气体生成层20通过接收外部刺激而产生气体。

9. 发明申请

US20100099240A1 DICING/DIE-BONDING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP 审中-公开
标题翻译：用于制造半导体芯片的定影/贴合胶带和方法
公开(公告)号：US20100099240A1
公开(公告)日：2010-04-22
申请号：US12374285
申请日：2007-07-19
申请人： Kouji Watanabe , Kazuyuki Shohara , Shota Matsuda , Masateru Fukuoka , Yoshiyuki Takebe
发明人： Kouji Watanabe , Kazuyuki Shohara , Shota Matsuda , Masateru Fukuoka , Yoshiyuki Takebe
IPC分类号： H01L21/78 , B32B33/00 , B32B27/30 , B32B5/16
CPC分类号： H01L24/83 , C09J7/385 , C09J2203/326 , H01L21/67132 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01094 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , Y10T428/2891 , H01L2924/00 , H01L2924/3512
摘要： Obtained is a dicing and die bonding tape that makes it possible to pick up a semiconductor chip easily and reliably in dicing a semiconductor wafer to pickup the semiconductor chip together with the whole die bonding film. A dicing and die bonding tape used in dicing of a wafer, in obtaining a semiconductor chip, and in die bonding of the semiconductor chip, the dicing and die bonding tape having a die bonding film 3, and a non pressure sensitive adhesive film 4 bonded on one surface of the die bonding film 3, the separation strength between the die bonding film 3 and the non pressure sensitive adhesive film 4 being within a range of 1 to 6 N/m, the shear strength between the die bonding film 3 and the non pressure sensitive adhesive film 4 being 0.3 to 2 N/mm2.
摘要翻译：获得的是切割和芯片粘合胶带，使得可以容易且可靠地拾取半导体芯片以切割半导体晶片以与整个芯片接合膜一起拾取半导体芯片。用于切割晶片，获得半导体芯片以及半导体芯片的芯片接合，具有芯片接合薄膜3的切割和芯片粘合带以及粘结的非压敏粘合薄膜4的切割和芯片粘结胶带在芯片接合薄膜3的一个表面上，芯片接合薄膜3和非压敏粘合薄膜4之间的分离强度在1至6N / m的范围内，芯片接合薄膜3与裸片接合薄膜3之间的剪切强度非压敏粘合膜4为0.3〜2N / mm 2。

10. 发明申请

US20060269715A1 Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tape 审中-公开
标题翻译：粘合材料，剥离粘合剂材料的方法和压敏粘合带
公开(公告)号：US20060269715A1
公开(公告)日：2006-11-30
申请号：US11491280
申请日：2006-07-24
申请人： Munehiro Hatai , Masateru Fukuoka , Satoshi Hayashi , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Tsuyoshi Hasegawa
发明人： Munehiro Hatai , Masateru Fukuoka , Satoshi Hayashi , Shigeru Danjo , Yasuhiko Oyama , Kazuhiro Shimomura , Tsuyoshi Hasegawa
IPC分类号： B32B9/04 , C08K5/23
CPC分类号： C09J11/06 , C09J7/38 , Y10T156/1126 , Y10T428/14 , Y10T428/28 , Y10T428/2809 , Y10T428/2861
摘要： An object of the present invention is to provide an adhesive substance capable of being easily peeled off without damaging an adherend by giving stimulation thereto, a tape employing this adhesive substance, and a method for peeling off the adhesive substance. An adhesive substance, which contains a gas-generating agent for generating gas by stimulation, gas generated from said gas-generating agent being discharged to the outside of said adhesive substance so as not to foam said adhesive substance, and gas generated from said gas-generating agent peeling at least part of an adhesive surface of said adhesive substance off an adherend so as to decrease adhesive strength.
摘要翻译：本发明的目的是提供一种能够容易地剥离而不会对被粘物产生刺激而剥离的粘合剂物质，使用这种粘合物质的胶带以及剥离粘合剂物质的方法。一种粘合剂物质，其含有用于通过刺激产生气体的气体发生剂，从所述气体发生剂产生的气体排放到所述粘合剂物质的外部，以便不会使所述粘合剂物质发泡，发生剂将粘合剂物质的粘合剂表面的至少一部分从被粘物上剥离，以降低粘合强度。

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