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    • 1. 发明授权
    • Rotation introduction mechanism, substrate transfer apparatus, and vacuum processing apparatus
    • 旋转导入机构,基板输送装置和真空处理装置
    • US08366375B2
    • 2013-02-05
    • US12513873
    • 2007-11-13
    • Kazuhiro MushaHirofumi MinamiTakafumi Kawaguchi
    • Kazuhiro MushaHirofumi MinamiTakafumi Kawaguchi
    • H01L21/677
    • F16J15/54B25J9/1065B25J18/04F16J15/324F16J15/40H01L21/67742Y10T74/20207
    • There are provided a rotation introduction mechanism which transmits a rotating motion on the atmosphere side into vacuum, is arranged simply, has a low sliding resistance, and has a long life, a substrate transfer apparatus, a substrate transfer apparatus having a small pivot radius and generating a smaller amount of dusts, and a vacuum processing apparatus. A lubricant holding member is attached to a vacuum seal mechanism. The substrate transfer apparatus is arranged such that a first link mechanism includes a first arm and a fourth arm, a second link mechanism includes a second arm and a third arm, the first arm is fixedly attached to a first drive shaft, the first arm is fixedly attached to a second drive shaft, the third arm is rotatably attached to the first drive shaft, and the fourth arm is rotatably attached to the second drive shaft. The vacuum processing apparatus includes the substrate transfer apparatus.
    • 提供一种旋转引导机构,其将气氛侧的旋转运动变为真空,简单地设置,具有低滑动阻力,寿命长,旋转半径小的基板输送装置,基板输送装置, 产生较少量的灰尘,以及真空处理设备。 润滑剂保持构件附接到真空密封机构。 衬底传送装置被布置成使得第一连杆机构包括第一臂和第四臂,第二连杆机构包括第二臂和第三臂,第一臂固定地附接到第一驱动轴,第一臂是 固定地连接到第二驱动轴上,第三臂可转动地安装在第一驱动轴上,第四臂可转动地安装在第二驱动轴上。 真空处理装置包括基板输送装置。
    • 3. 发明申请
    • Substrate Holding Mechanism and Substrate Assembly Apparatus Including the Same
    • 基板保持机构及其基板装配装置
    • US20100109220A1
    • 2010-05-06
    • US12596455
    • 2008-04-15
    • Kazuhiro MushaHirofumi MinamiTakafumi Kawaguchi
    • Kazuhiro MushaHirofumi MinamiTakafumi Kawaguchi
    • B25B1/00
    • H01L21/6833B65G49/061B65G49/067B65G2249/02B65G2249/045G02F1/1303H01L21/67092H01L21/6838
    • Object To provide a substrate assembly apparatus capable of simplifying a structure of the apparatus and performing appropriate detachment of a substrate constantly.Solving Means A substrate assembly apparatus according to the present invention includes a support base and a holding mechanism. The support base is for supporting a lower substrate. The holding mechanism includes a holding surface and a functional element. The holding surface is for holding an upper surface of an upper substrate. The functional element is provided on the holding surface and has a holding force variable in accordance with a magnitude of a voltage. The holding mechanism causes a lower surface of the upper substrate to face an upper surface of the lower substrate supported by the support base. With this structure, it becomes possible to electrically control the holding force with respect to the substrate and simplify the structure of the holding mechanism. Further, since the holding force of the substrate can be changed smoothly, appropriate detachment is constantly allowed even with respect to a thin substrate.
    • 本发明提供能够简化装置的结构并且不断地进行基板的适当脱离的基板组装装置。 解决方案根据本发明的基板组装设备包括支撑基座和保持机构。 支撑底座用于支撑下基板。 保持机构包括保持面和功能元件。 保持表面用于保持上基板的上表面。 功能元件设置在保持表面上,并且具有根据电压的大小可变的保持力。 保持机构使得上基板的下表面面对由支撑基座支撑的下基板的上表面。 利用这种结构,可以电控制相对于基板的保持力并简化保持机构的结构。 此外,由于可以平滑地改变基板的保持力,即使对于薄的基板也能够持续地进行适当的分离。
    • 4. 发明申请
    • Substrate Conveyance Method and Substrate Conveyance System
    • 基板输送方法和基板输送系统
    • US20130129462A1
    • 2013-05-23
    • US13812745
    • 2011-07-25
    • Hirofumi MinamiKazuhiro Musha
    • Hirofumi MinamiKazuhiro Musha
    • B65G47/92
    • B65G47/92H01L21/67742H01L21/67748H01L21/6831
    • [Object] To provide a wafer conveyance method and a wafer conveyance system that are able to quickly transfer a wafer without losing positional accuracy.[Solving Means] Using an electrostatic chuck mechanism in the holding of a wafer (W) by the holding surface (210) of a conveyance robot, the wafer (W) is transferred from a supporting surface (303) to the holding surface (210) in the state where an electrostatic attraction force is generated at the holding surface (210). As a result, since it is possible to hold the wafer by means of the electrostatic attraction force starting immediately after the wafer (W) has been transferred to the holding surface (210), it is possible to rapidly execute a wafer (W) conveying operation and thus it is possible to reduce the conveying time of the wafer between processing chambers.
    • 本发明提供能够在不损失位置精度的情况下快速转印晶片的晶片输送方法和晶片输送系统。 [解决方案]使用静电卡盘机构,通过输送机器人的保持面(210)保持晶片(W),将晶片(W)从支撑面(303)转移到保持面(210) )在保持面(210)处产生静电吸引力的状态。 结果,由于可以通过在晶片(W)已经被转移到保持表面210之后立即开始的静电吸引力来保持晶片,所以可以快速地执行晶片(W)输送 因此可以减少处理室之间的晶片的输送时间。
    • 5. 发明授权
    • Transport apparatus
    • 运输设备
    • US08382421B2
    • 2013-02-26
    • US12564572
    • 2009-09-22
    • Kazuhiro MushaHirofumi MinamiKenji AgoTakashi AsaishiToshio Koike
    • Kazuhiro MushaHirofumi MinamiKenji AgoTakashi AsaishiToshio Koike
    • B25J18/00
    • B25J9/107B25J9/042B25J9/102B25J9/104H01L21/67742Y10T74/20305
    • A compact transport apparatus that does not cause pollution to its environment is provided. In a transport apparatus according to a first aspect of the present invention, an installation area of the apparatus is small because first and second rotary shafts are arranged concentrically, and a dead center escaping mechanism has a simple structure with a small thickness. Since a connecting portion of a hand portion can be made thin, an opening of a gate valve through which the hand portion is inserted can be reduced. As a result, it becomes difficult for dust inside a transport chamber to enter a processing chamber. A second aspect of the present invention is directed to a spaced dual shaft-type transport apparatus. Although the lengths of first arms provided at rotating shafts may differ from the lengths of second arms provided between the first arms and a substrate supporting portion, the apparatus is free from malfunction even when the lengths thereof differ because the transmission of a rotative force of a dead center escaping mechanism is released at a position except at a dead center in the present invention.
    • 提供一种不会对其环境造成污染的紧凑型运输装置。 在本发明的第一方面的输送装置中,由于第一旋转轴和第二旋转轴同心地配置,所以装置的安装面积小,死角逸出机构的结构简单。 由于可以使手部的连接部分变薄,所以可以减少插入手部的闸阀的开口。 结果,传送室内的灰尘难以进入处理室。 本发明的第二方面涉及一种间隔开的双轴型输送装置。 虽然设置在旋转轴上的第一臂的长度可以不同于设置在第一臂和基板支撑部之间的第二臂的长度,但是即使其长度不同,该装置也不会发生故障,因为它的传播力 在本发明的除死点以外的位置释放死点移除机构。
    • 8. 发明授权
    • Seal mechanism and treatment apparatus
    • 密封机构及处理装置
    • US08840116B2
    • 2014-09-23
    • US13129889
    • 2009-12-02
    • Kazuhiro MushaHirofumi MinamiKiyotaka Yamada
    • Kazuhiro MushaHirofumi MinamiKiyotaka Yamada
    • F16J15/32
    • F16J15/324
    • [Object] To provide a seal mechanism that reduces a maintenance frequency for replenishment of a lubricating material and has small friction resistance, and a treatment apparatus equipped with the seal mechanism.[Solving Means] A lip seal (12) of a seal mechanism (100) is arranged so as to surround a drive shaft (25), and a lip portion (12b) thereof includes a seal portion (12c) that comes into contact with the drive shaft (25). A wall member (15) is attached to the drive shaft (25) so as to close a lower opening of a mounting member (30) and face the lip seal (12). By at least the mounting member (30) and the wall member (15), a container capable of accommodating a lubricating material (16) is formed. A gap (17) set such that the lubricating material (16) does not pass therethrough is provided between the wall member (15) and a holding base body (60). With such a structure, a space for accommodating the lubricating material (16) can be secured and the seal mechanism (100) and the drive shaft (25) are allowed to be in contact with each other only at the seal portion (12c) of the lip seal (12).
    • 提供减少补充润滑材料的维护频率并具有小的摩擦阻力的密封机构,以及配备有密封机构的处理装置。 [解决方案]密封机构(100)的唇形密封件(12)被布置成围绕驱动轴(25),并且其唇部(12b)包括与 驱动轴(25)。 壁构件(15)附接到驱动轴(25),以封闭安装构件(30)的下开口并面对唇形密封件(12)。 通过至少安装构件(30)和壁构件(15)形成容纳润滑材料(16)的容器。 在壁构件(15)和保持基体(60)之间设置有使润滑材料(16)不通过的间隙(17)。 通过这样的结构,可以确保用于容纳润滑材料(16)的空间,并且密封机构(100)和驱动轴(25)只能在密封部分(12c)处彼此接触 唇形密封件(12)。
    • 9. 发明授权
    • Substrate conveyance method and substrate conveyance system
    • 基板输送方法和基板输送系统
    • US08717737B2
    • 2014-05-06
    • US13812745
    • 2011-07-25
    • Hirofumi MinamiKazuhiro Musha
    • Hirofumi MinamiKazuhiro Musha
    • H02N13/00
    • B65G47/92H01L21/67742H01L21/67748H01L21/6831
    • Disclosed are a substrate conveyance method and substrate conveyance system that are able to quickly transfer a substrate without losing positional accuracy. Using an electrostatic chuck mechanism in the holding of a wafer (W) by the holding surface (210) of a conveyance robot, the wafer (W) is transferred from a supporting surface (303) to the holding surface (210) in the state where an electrostatic attraction force is generated at the holding surface (210). As a result, since it is possible to hold the wafer by means of the electrostatic attraction force starting immediately after the wafer (W) has been transferred to the holding surface (210), it is possible to rapidly execute a wafer (W) conveying operation and thus it is possible to reduce the conveying time of the wafer between processing chambers.
    • 公开了能够快速地传送衬底而不失去位置精度的衬底输送方法和衬底输送系统。 在通过输送机器人的保持面(210)保持晶片(W)的状态下,使用静电卡盘机构,将晶片(W)从支撑面(303)转移到保持面(210)的状态 其中在保持表面(210)处产生静电吸引力。 结果,由于可以通过在晶片(W)已经被转移到保持表面210之后立即开始的静电吸引力来保持晶片,所以可以快速地执行晶片(W)输送 因此可以减少处理室之间的晶片的输送时间。