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    • 3. 发明申请
    • MOISTURE-PROOF INSULATING MATERIAL
    • 防潮保温材料
    • US20130178578A1
    • 2013-07-11
    • US13824253
    • 2011-10-17
    • Kazuhiko OogaRitsuko Azuma
    • Kazuhiko OogaRitsuko Azuma
    • H01B7/28
    • H01B7/28C09D7/20C09D7/65C09D153/02H05K3/285H05K2201/0129H05K2201/0133C08L57/02C08K5/01
    • Provided are: a moisture-proof insulating material having superior long-term insulating reliability and adhesiveness to polyimides and glass substrates, and has a solid content concentration that can secure a thickness that realizes sufficient moisture-proof performance after application and drying in a viscosity region that can be easily coated by means of a dispenser; and an electronic component that has been insulation-processed by means of the moisture-proof insulating material. The moisture-proof insulating material contains a styrene-based thermoplastic elastomer, a tackifying agent, and a solvent, and is characterized by the solvent containing an aliphatic hydrocarbon solvent (for example, methylcyclohexane or cyclohexane) having a boiling point that is at least 80° C. and less than 110° C. The solvent preferably further contains an aliphatic hydrocarbon solvent (for example, ethylcyclohexane or dimethylcyclohexane) having a boiling point that is at least 110° C. and less than 140° C.
    • 提供:具有优异的长期绝缘可靠性和与聚酰亚胺和玻璃基板的粘合性的防潮绝缘材料,并且具有固体含量浓度,其可以确保在粘度区域中施加和干燥后实现足够的防潮性能的厚度 可以通过分配器容易地涂覆; 以及通过防湿绝缘材料进行绝缘处理的电子部件。 防潮绝缘材料含有苯乙烯类热塑性弹性体,增粘剂和溶剂,其特征在于含有沸点至少为80的脂族烃溶剂(例如甲基环己烷或环己烷)的溶剂 ℃且小于110℃。溶剂优选还含有沸点至少为110℃且小于140℃的脂族烃溶剂(例如乙基环己烷或二甲基环己烷)。
    • 6. 发明申请
    • POLYMERIZABLE COMPOUND AND CURABLE COMPOSITION COMPRISING SAME
    • 可聚合化合物和包含其的可固化组合物
    • US20120232183A1
    • 2012-09-13
    • US13512815
    • 2010-12-06
    • Kazuhiko OogaRitsuko Azuma
    • Kazuhiko OogaRitsuko Azuma
    • H01B3/30C08J3/28C08G18/83
    • H05K1/0346C08G18/3212C08G18/718C08G18/8019C08G18/8116C09D175/16H05K3/287
    • Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1): wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2): wherein R3s each independently represent CH3 or CH2CH3, and R4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof. The structure having the structural unit derived from a dimerdiol is preferably represented by formula (3):
    • 提供一种可聚合化合物,可光固化组合物和用于安装电路板的光固化防潮绝缘涂层材料,其降低环境影响,在低照射剂量下表面固化性优异,并且对基材材料具有高粘合性。 根据本发明的化合物具有衍生自二聚二醇的结构单元,并且具有作为端基的由式(1)表示的基团:其中R 1表示H或CH 3,R 2表示具有2至12个碳原子的烃基 ,在结尾。 优选地,化合物具有作为端基的由式(1)表示的基团和由式(2)表示的基团:其中R 3各自独立地表示CH 3或CH 2 CH 3,并且R 4表示具有3至9个碳原子的烃基, 在最后。 具有来自二聚二醇的结构单元的结构优选由式(3)表示: