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1. 发明授权

US08674017B2 (Poly)carbonate polyol and carboxyl group-containing polyurethane obtained from the (poly)carbonate polyol 有权
标题翻译：（聚）碳酸酯多元醇和由（多）碳酸酯多元醇得到的含羧基的聚氨酯
公开(公告)号：US08674017B2
公开(公告)日：2014-03-18
申请号：US13145241
申请日：2010-01-20
申请人： Kazuhiko Ooga , Ritsuko Azuma , Atsushi Umino
发明人： Kazuhiko Ooga , Ritsuko Azuma , Atsushi Umino
IPC分类号： C08L75/00 , C08G18/08 , H05K1/00 , B05D5/12
CPC分类号： H05K3/285 , C08G18/12 , C08G18/341 , C08G18/44 , C08G18/6659 , C08G18/758 , C09D175/04 , H05K1/0393 , C08G18/282
摘要： An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a), a polyisocyanate (b) and a carboxyl group-containing polyol (c). The (poly) carbonate polyol includes an organic residue derived from a dimer diol and an organic residue derived from a polyol having a C10-20 alicyclic structure.
摘要翻译：本发明的目的是提供具有小的固化翘曲的含羧基的聚氨酯，并且可以得到具有优异的电绝缘性和柔软性的固化产物，含有含羧基的聚氨酯的可固化组合物，并且可以产生具有良好电绝缘性的固化产物性能，由组合物获得的固化产物，用固化产物覆盖的柔性电路板，以及用于制造柔性电路板的工艺。含羧基的聚氨酯可以由包含（多）碳酸酯多元醇（a），多异氰酸酯（b）和含羧基的多元醇（c）的材料获得。（聚）碳酸酯多元醇包括衍生自二聚二醇的有机残基和衍生自具有C10-20脂环结构的多元醇的有机残基。

2. 发明申请

US20120232183A1 POLYMERIZABLE COMPOUND AND CURABLE COMPOSITION COMPRISING SAME 审中-公开
标题翻译：可聚合化合物和包含其的可固化组合物
公开(公告)号：US20120232183A1
公开(公告)日：2012-09-13
申请号：US13512815
申请日：2010-12-06
申请人： Kazuhiko Ooga , Ritsuko Azuma
发明人： Kazuhiko Ooga , Ritsuko Azuma
IPC分类号： H01B3/30 , C08J3/28 , C08G18/83
CPC分类号： H05K1/0346 , C08G18/3212 , C08G18/718 , C08G18/8019 , C08G18/8116 , C09D175/16 , H05K3/287
摘要： Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1): wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2): wherein R3s each independently represent CH3 or CH2CH3, and R4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof. The structure having the structural unit derived from a dimerdiol is preferably represented by formula (3):
摘要翻译：提供一种可聚合化合物，可光固化组合物和用于安装电路板的光固化防潮绝缘涂层材料，其降低环境影响，在低照射剂量下表面固化性优异，并且对基材材料具有高粘合性。根据本发明的化合物具有衍生自二聚二醇的结构单元，并且具有作为端基的由式（1）表示的基团：其中R 1表示H或CH 3，R 2表示具有2至12个碳原子的烃基，在结尾。优选地，化合物具有作为端基的由式（1）表示的基团和由式（2）表示的基团：其中R 3各自独立地表示CH 3或CH 2 CH 3，并且R 4表示具有3至9个碳原子的烃基，在最后。具有来自二聚二醇的结构单元的结构优选由式（3）表示：

3. 发明授权

US07741411B2 Carboxyl group-containing polyurethane and heat-curable polyurethane resin composition 有权
标题翻译：含羧基的聚氨酯和热固性聚氨酯树脂组合物
公开(公告)号：US07741411B2
公开(公告)日：2010-06-22
申请号：US12089500
申请日：2006-10-04
申请人： Hiroshi Uchida , Ritsuko Azuma
发明人： Hiroshi Uchida , Ritsuko Azuma
IPC分类号： C08F283/04
CPC分类号： C08G18/348 , C08G18/0823 , C08G18/3212 , C08G18/44 , C08G18/664 , C08G18/758 , C09D11/102 , C09D175/06 , H05K3/285 , Y10S428/901 , Y10T428/31551 , C08L2666/22
摘要： A carboxyl group-containing polyurethane is capable of giving cured products excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability. The carboxyl group-containing polyurethane includes a structure derived from a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule. The carboxyl group-containing polyurethane is produced by reacting: (A) a polyisocyanate compound; (B) a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule; and (C) a carboxyl group-containing dihydroxy compound (other than the compound (B)).
摘要翻译：含羧基的聚氨酯能够提供与基材的粘合性优异的弯曲性，柔软性，耐电镀性，耐焊接性和长期可靠性。含羧基的聚氨酯包括衍生自每分子具有1至10个羟基和18至72个碳原子的多元醇化合物的结构。含羧基的聚氨酯通过使（A）多异氰酸酯化合物反应而制备，（B）每分子具有1〜10个羟基和18〜72个碳原子的多元醇化合物; 和（C）含羧基的二羟基化合物（化合物（B）以外）。

4. 发明申请

US20090171015A1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION SOLUTION, FILM FORMING MATERIAL AND THEIR CURED PRODUCT 有权
标题翻译：热固性树脂组合物，热固性树脂组合物溶液，成膜材料及其固化产品
公开(公告)号：US20090171015A1
公开(公告)日：2009-07-02
申请号：US12095990
申请日：2006-12-07
申请人： Hiroshi Uchida , Ritsuko Azuma
发明人： Hiroshi Uchida , Ritsuko Azuma
IPC分类号： C08L75/04
CPC分类号： C09D175/14 , C08G18/0823 , C08G18/12 , C08G18/44 , C08G18/4854 , C08G18/61 , C08G18/6576 , C08G18/69 , C08G18/698 , C08G18/758 , C08G59/423 , C08L63/00 , C08L75/04 , H05K1/0393 , H05K3/285 , H05K2203/124 , C08G18/6692 , C08G18/6659 , C08L2666/20
摘要： Disclosed is a thermosetting resin composition including; (A) a carboxyl group-containing polyurethane prepared by using (a) a polyisocyanate compound (b) polyol compounds (c) a carboxyl group-containing dihydroxy compound as raw materials, (B) a curing agent, wherein the polyol compounds (b) are one or more kinds of polyol compound(s) selected from Group (I) and one or more kinds of polyol compound(s) selected from Group (II); Group I: polycarbonate polyol, polyether polyol, polyester polyol, and polylactone polyol, Group II: polybutadiene polyol, polysilicone having terminal hydroxyl groups, and such a polyol that has 18 to 72 carbon atoms and oxygen atoms present only in hydroxyl groups. The thermosetting resin composition can give a protection film for flexible printed circuits that has excellent long-term reliability of electric insulation, flexibility, and low warpage from curing shrinkage, and particularly low tackiness.
摘要翻译：公开了一种热固性树脂组合物，其包含：（A）通过使用（a）多异氰酸酯化合物（b）多元醇化合物（c），含羧基的二羟基化合物作为原料制备的含羧基的聚氨酯，（B）固化剂，其中多元醇化合物（b ）是选自组（I）的一种或多种多元醇化合物和选自组（II）的一种或多种多元醇化合物; 组I：聚碳酸酯多元醇，聚醚多元醇，聚酯多元醇和聚内酯多元醇，组II：聚丁二烯多元醇，具有末端羟基的聚硅氧烷，以及仅具有羟基的碳原子数为18〜72的多元醇和氧原子。热固性树脂组合物可以提供柔性印刷电路用保护膜，该保护膜具有优异的电绝缘性，长期可靠的电绝缘性，柔软性和低硬化收缩翘曲性，特别是低粘性。

5. 发明申请

US20130178578A1 MOISTURE-PROOF INSULATING MATERIAL 审中-公开
标题翻译：防潮保温材料
公开(公告)号：US20130178578A1
公开(公告)日：2013-07-11
申请号：US13824253
申请日：2011-10-17
申请人： Kazuhiko Ooga , Ritsuko Azuma
发明人： Kazuhiko Ooga , Ritsuko Azuma
IPC分类号： H01B7/28
CPC分类号： H01B7/28 , C09D7/20 , C09D7/65 , C09D153/02 , H05K3/285 , H05K2201/0129 , H05K2201/0133 , C08L57/02 , C08K5/01
摘要： Provided are: a moisture-proof insulating material having superior long-term insulating reliability and adhesiveness to polyimides and glass substrates, and has a solid content concentration that can secure a thickness that realizes sufficient moisture-proof performance after application and drying in a viscosity region that can be easily coated by means of a dispenser; and an electronic component that has been insulation-processed by means of the moisture-proof insulating material. The moisture-proof insulating material contains a styrene-based thermoplastic elastomer, a tackifying agent, and a solvent, and is characterized by the solvent containing an aliphatic hydrocarbon solvent (for example, methylcyclohexane or cyclohexane) having a boiling point that is at least 80° C. and less than 110° C. The solvent preferably further contains an aliphatic hydrocarbon solvent (for example, ethylcyclohexane or dimethylcyclohexane) having a boiling point that is at least 110° C. and less than 140° C.
摘要翻译：提供：具有优异的长期绝缘可靠性和与聚酰亚胺和玻璃基板的粘合性的防潮绝缘材料，并且具有固体含量浓度，其可以确保在粘度区域中施加和干燥后实现足够的防潮性能的厚度可以通过分配器容易地涂覆; 以及通过防湿绝缘材料进行绝缘处理的电子部件。防潮绝缘材料含有苯乙烯类热塑性弹性体，增粘剂和溶剂，其特征在于含有沸点至少为80的脂族烃溶剂（例如甲基环己烷或环己烷）的溶剂 ℃且小于110℃。溶剂优选还含有沸点至少为110℃且小于140℃的脂族烃溶剂（例如乙基环己烷或二甲基环己烷）。

6. 发明申请

US20110272183A1 (POLY)CARBONATE POLYOL AND CARBOXYL GROUP-CONTAINING POLYURETHANE OBTAINED FROM THE (POLY)CARBONATE POLYOL 有权
标题翻译：（POLY）碳酸酯多元醇和由（多）碳酸酯多元醇获得的含羧基的聚氨酯
公开(公告)号：US20110272183A1
公开(公告)日：2011-11-10
申请号：US13145241
申请日：2010-01-20
申请人： Kazuhiko Ooga , Ritsuko Azuma , Atsushi Umino
发明人： Kazuhiko Ooga , Ritsuko Azuma , Atsushi Umino
IPC分类号： H05K1/02 , C08G18/71 , C08L75/04 , B05D3/00 , C07C69/96 , H05K3/22 , B05D3/02 , C08G18/44 , C08K5/06
CPC分类号： H05K3/285 , C08G18/12 , C08G18/341 , C08G18/44 , C08G18/6659 , C08G18/758 , C09D175/04 , H05K1/0393 , C08G18/282
摘要： An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a), a polyisocyanate (b) and a carboxyl group-containing polyol (c). The (poly) carbonate polyol includes an organic residue derived from a dimer diol and an organic residue derived from a polyol having a C10-20 alicyclic structure.
摘要翻译：本发明的目的是提供具有小的固化翘曲的含羧基的聚氨酯，并且可以得到具有优异的电绝缘性和柔软性的固化产物，含有含羧基的聚氨酯的可固化组合物，并且可以产生具有良好电绝缘性的固化产物性能，由组合物获得的固化产物，用固化产物覆盖的柔性电路板，以及用于制造柔性电路板的工艺。含羧基的聚氨酯可以由包含（多）碳酸酯多元醇（a），多异氰酸酯（b）和含羧基的多元醇（c）的材料获得。（聚）碳酸酯多元醇包括衍生自二聚二醇的有机残基和衍生自具有C10-20脂环结构的多元醇的有机残基。

7. 发明申请

US20090118422A1 CARBOXYL GROUP-CONTAINING POLYURETHANE AND USES THEREOF 有权
标题翻译：含羧基的聚氨酯组合物及其用途
公开(公告)号：US20090118422A1
公开(公告)日：2009-05-07
申请号：US11994442
申请日：2006-07-04
申请人： Hiroshi Uchida , Ritsuko Azuma
发明人： Hiroshi Uchida , Ritsuko Azuma
IPC分类号： C08L75/04
CPC分类号： C08G18/0823 , C08G18/44 , C08G18/6659 , C08G18/758 , C08L63/00 , C09D175/04 , H05K3/285 , H05K2203/124 , C08L2666/22
摘要： Disclosed is a carboxyl group-containing polyurethane containing a structure derived from a polycarbonate diol (B), the polycarbonate diol (B) having: (i) a number-average molecular weight of 500 to 50,000; (ii) an alkylene group of 8 to 18 carbon atoms in its structure; and (iii) hydroxyl groups at both ends. The carboxyl group-containing polyurethane is suitable as materials of cured products that are excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability.
摘要翻译：公开了含有衍生自聚碳酸酯二醇（B）的结构的含羧基的聚氨酯，所述聚碳酸酯二醇（B）具有：（i）数均分子量为500〜50,000; （ii）其结构中具有8至18个碳原子的亚烷基; 和（iii）两端的羟基。含羧基的聚氨酯适合作为与基材的粘合性优异，翘曲性，柔韧性，耐电镀性，耐焊接性和长期可靠性优异的固化物的材料。

8. 发明申请

US20110272182A1 CARBOXYL GROUP-CONTAINING POLYURETHANE 审中-公开
标题翻译：含羧基的含聚氨酯
公开(公告)号：US20110272182A1
公开(公告)日：2011-11-10
申请号：US13145229
申请日：2010-01-20
申请人： Kazuhiko Ooga , Ritsuko Azuma , Atsushi Umino
发明人： Kazuhiko Ooga , Ritsuko Azuma , Atsushi Umino
IPC分类号： H05K1/00 , C08G18/71 , H05K3/28 , C08K5/06 , C08L75/06 , C08G18/66 , C08K5/101
CPC分类号： H05K3/285 , C08G18/12 , C08G18/341 , C08G18/44 , C08G18/6659 , C08G18/758 , C09D175/04 , C08G18/282
摘要： An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a) that includes an organic residue derived from a dimer diol, a polyisocyanate (b) and a carboxyl group-containing polyol (c).
摘要翻译：本发明的目的是提供具有小的固化翘曲的含羧基的聚氨酯，并且可以得到具有优异的电绝缘性和柔软性的固化产物，含有含羧基的聚氨酯的可固化组合物，并且可以产生具有良好电绝缘性的固化产物性能，由组合物获得的固化产物，用固化产物覆盖的柔性电路板，以及用于制造柔性电路板的工艺。含羧基的聚氨酯可以由包含来自二聚二醇的有机残基，多异氰酸酯（b）和含羧基的多元醇（c））的（多）碳酸酯多元醇（a）的材料得到。

9. 发明授权

US08669306B2 Curable composition 有权
标题翻译：可固化组合物
公开(公告)号：US08669306B2
公开(公告)日：2014-03-11
申请号：US13142234
申请日：2009-12-18
申请人： Kazuhiko Ooga , Kazuya Kimura , Atsushi Umino , Ritsuko Azuma
发明人： Kazuhiko Ooga , Kazuya Kimura , Atsushi Umino , Ritsuko Azuma
IPC分类号： C08K5/15
CPC分类号： H05K3/285 , C08G18/12 , C08G18/3206 , C08G18/341 , C08G18/44 , C08G18/664 , C08G18/6659 , C08G18/758 , C08G59/4269 , C08K5/04 , C08K5/103 , C08K5/1535 , C08L63/00 , C09D175/04 , H05K1/0393 , C08G18/325 , C08L75/04
摘要： It is an object of the present invention to provide a curable composition which provides a cured product excellent in low warpage properties and long-term electrical insulation reliability and causes little bleeding during screen printing. The present invention is a curable composition comprising the following components (a) to (e): a component (a): polyurethane having a functional group capable of curing reaction and a carbonate bond, a component (b): γ-butyrolactone, a component (c): diethylene glycol diethyl ether, a component (d): inorganic fine particles and/or organic fine particles, and a component (e): a compound having two or more epoxy groups in one molecule.
摘要翻译：本发明的目的是提供一种可提供低翘曲性和长期电绝缘可靠性优异的固化产物的可固化组合物，并且在丝网印刷期间引起少量渗色。本发明是包含以下成分（a）〜（e））的固化性组合物：成分（a）：具有能够固化反应的官能团和碳酸酯键的聚氨酯，成分（b）：γ-丁内酯，组分（c）：二甘醇二乙醚，组分（d）：无机细颗粒和/或有机细颗粒，和组分（e）：在一个分子中具有两个或更多个环氧基的化合物。

10. 发明授权

US08575280B2 Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product 有权
标题翻译：热固性树脂组合物，热固性树脂组合物溶液，成膜材料及其固化产物
公开(公告)号：US08575280B2
公开(公告)日：2013-11-05
申请号：US12095990
申请日：2006-12-07
申请人： Hiroshi Uchida , Ritsuko Azuma
发明人： Hiroshi Uchida , Ritsuko Azuma
IPC分类号： C08G18/42 , C08G18/44 , C08G18/48 , C08G18/61 , C08G18/62
CPC分类号： C09D175/14 , C08G18/0823 , C08G18/12 , C08G18/44 , C08G18/4854 , C08G18/61 , C08G18/6576 , C08G18/69 , C08G18/698 , C08G18/758 , C08G59/423 , C08L63/00 , C08L75/04 , H05K1/0393 , H05K3/285 , H05K2203/124 , C08G18/6692 , C08G18/6659 , C08L2666/20
摘要： Disclosed is a thermosetting resin composition including; (A) a carboxyl group-containing polyurethane prepared by using (a) a polyisocyanate compound (b) polyol compounds (c) a carboxyl group-containing dihydroxy compound as raw materials, (B) a curing agent, wherein the polyol compounds (b) are one or more kinds of polyol compound(s) selected from Group (I) and one or more kinds of polyol compound(s) selected from Group (II); Group I: polycarbonate polyol, polyether polyol, polyester polyol, and polylactone polyol, Group II: polybutadiene polyol, polysilicone having terminal hydroxyl groups, and such a polyol that has 18 to 72 carbon atoms and oxygen atoms present only in hydroxyl groups. The thermosetting resin composition can give a protection film for flexible printed circuits that has excellent long-term reliability of electric insulation, flexibility, and low warpage from curing shrinkage, and particularly low tackiness.
摘要翻译：公开了一种热固性树脂组合物，其包含：（A）通过使用（a）多异氰酸酯化合物（b）多元醇化合物（c），含羧基的二羟基化合物作为原料制备的含羧基的聚氨酯，（B）固化剂，其中多元醇化合物（b ）是选自组（I）的一种或多种多元醇化合物和选自组（II）的一种或多种多元醇化合物; 组I：聚碳酸酯多元醇，聚醚多元醇，聚酯多元醇和聚内酯多元醇，组II：聚丁二烯多元醇，具有末端羟基的聚硅氧烷，以及仅具有羟基的碳原子数为18〜72的多元醇和氧原子。热固性树脂组合物可以提供柔性印刷电路用保护膜，该保护膜具有优异的电绝缘性，长期可靠的电绝缘性，柔软性和低硬化收缩翘曲性，特别是低粘性。

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