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    • 1. 发明申请
    • ELECTRO-OPTICAL DEVICE, DRIVING CIRCUIT OF ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS
    • 电光器件,电光器件驱动电路及电子设备
    • US20080291223A1
    • 2008-11-27
    • US12103380
    • 2008-04-15
    • Katsunori YAMAZAKIKoji SHIMIZU
    • Katsunori YAMAZAKIKoji SHIMIZU
    • G09G5/10
    • G09G3/3677G09G3/3614G09G3/3655G09G3/3666G09G2300/0439G09G2310/0221G09G2310/0262G09G2310/04
    • A driving circuit of an electro-optical device includes scanning lines, data lines, capacitor lines respectively corresponding to the scanning lines, and pixels provided at intersections of the scanning lines and the data lines. The driving circuit includes a scanning line driving circuit that selects the scanning lines in a predetermined order and a capacitor line driving circuit that selects a first power supply line when a first scanning line is selected and selects a second power supply line when a second scanning line that is spaced predetermined lines away from the first scanning line is selected until the first scanning line is selected again to thereby apply a voltage of the selected one of the power supply lines to the capacitor line, the capacitor line driving circuit applying the voltage of the second power supply line to all the capacitor lines when all the scanning lines are not selected.
    • 电光装置的驱动电路包括分别对应于扫描线的扫描线,数据线,电容线以及设置在扫描线和数据线的交点处的像素。 驱动电路包括以预定顺序选择扫描线的扫描线驱动电路和选择第一扫描线时选择第一电源线的电容线驱动电路,并且当第二扫描线选择第二电源线时 选择与第一扫描线相隔的预定线的间隔,直到再次选择第一扫描线,从而将所选择的一个电源线的电压施加到电容线,电容器线驱动电路施加电压 当不选择所有扫描线时,将所有电容器线的第二电源线连接到所有电容线。
    • 3. 发明申请
    • CONTINUOUS COPPER ELECTROPLATING METHOD
    • 连续电镀方法
    • US20090229986A1
    • 2009-09-17
    • US12401113
    • 2009-03-10
    • Naoyuki OMURAToshihisa ISONOKoji SHIMIZUShinji TACHIBANATomohiro KAWASEShunsaku HOSHI
    • Naoyuki OMURAToshihisa ISONOKoji SHIMIZUShinji TACHIBANATomohiro KAWASEShunsaku HOSHI
    • C25D21/18
    • C25D17/00C25D3/38C25D7/123C25D17/001C25D17/002C25D21/18H05K3/241
    • Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel. Plating performance impairing components, which are produced when the copper ion supplying salt is dissolved in the plating bath for replenishing the copper ions, are oxidized and decomposed, whereby defective plating due to the presence of the plating performance impairing components can be prevented.
    • 公开了一种通过在容纳硫酸铜电镀浴的电镀槽中使用不溶性阳极来重复电镀作为阴极的工件的方法,其中提供了不同于电镀槽的铜溶解容器,电镀浴是 转移到铜溶解容器中,并从铜溶解容器返回到电镀槽,用于使电镀槽和铜溶解容器之间的电镀槽循环,将铜离子供应盐装入铜溶解容器中并溶解在镀浴中 使得可以补充由电镀消耗的铜离子,并且将被镀工件连续电镀,其特征在于允许电镀液在阳极侧和阴极侧之间转移,电镀浴返回到 阳极将电镀液从铜溶解容器返回到电镀槽中。 当铜离子供应盐溶解在用于补充铜离子的镀浴中时产生的电镀性能损害部件被氧化分解,从而可以防止由于存在电镀性能损害部件而导致的不良电镀。