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1. 发明授权

US5395895A Resin composition and a molded article utilizing it 失效
标题翻译：树脂组合物和利用它的模塑制品
公开(公告)号：US5395895A
公开(公告)日：1995-03-07
申请号：US78307
申请日：1993-06-17
申请人： Hirotaka Tagoshi , Yasuhiro Mikawa , Masahiro Ueno , Shintaro Inazawa , Katsuaki Tsutsumi , Hiroyuki Hagi , Yukio Okamoto
发明人： Hirotaka Tagoshi , Yasuhiro Mikawa , Masahiro Ueno , Shintaro Inazawa , Katsuaki Tsutsumi , Hiroyuki Hagi , Yukio Okamoto
IPC分类号： C08K5/05 , C08K5/053 , C08K5/06 , C08L23/08 , C08L71/02 , C08F20/08
CPC分类号： C08L23/0876 , C08K5/05 , C08K5/053 , C08K5/06 , C08L71/02
摘要： A thermally reversible crosslinked resin composition comprising a specific ethylenic copolymer, a specific polyhydric alcohol and a specific reaction promoter and a molded article produced by utilizing the resin composition are disclosed. Because the resin composition and the molded article have a high reaction rate of dissociation of the crosslinking during heating and a high reaction rate of formation of the crosslinking during cooling, they can be utilized for various applications, such as melt molding and the like, as the the thermally reversible crosslinked resin composition and the thermally reversible crosslinked molded article which are substantially valuable for commercial application.
摘要翻译： PCT No.PCT / JP92 / 01416 Sec。 371日期：1993年6月17日 102（e）日期1993年6月17日PCT提交1992年11月2日PCT公布。出版物WO93 / 09179 日期：1993年5月13日。公开了一种包含特定乙烯类共聚物，特定多元醇和特定反应促进剂的热可逆交联树脂组合物和通过使用该树脂组合物制备的模塑制品。由于树脂组合物和模塑制品在加热期间的交联反应速率高，冷却时交联反应速度高，所以可以用于熔融成型等各种用途，如热可逆交联树脂组合物和热可逆交联模塑制品，其商业应用基本上是有价值的。

2. 发明申请

US20120094888A1 METHOD FOR REMOVING AN UNCURED PHOTOSENSITIVE COMPOSITION 有权
标题翻译：去除不良光敏组合物的方法
公开(公告)号：US20120094888A1
公开(公告)日：2012-04-19
申请号：US13243090
申请日：2011-09-23
申请人： Masato KANEDA , Yasuhiro MIKAWA , Koji SHIMIZU , Kouichi TERAO
发明人： Masato KANEDA , Yasuhiro MIKAWA , Koji SHIMIZU , Kouichi TERAO
IPC分类号： G03F7/42
CPC分类号： G03F7/168 , G03F7/0007 , G03F7/325
摘要： A photosensitive composition remover used for removal of an uncured photosensitive composition, which remover includes 1 to 80 percent by mass of at least one type of aromatic hydrocarbon having 9 carbon atoms or more within the molecule. The photosensitive composition remover further includes an aprotic polar solvent and/or another solvent other than aprotic polar solvents. The photosensitive composition remover is effective for removal of an uncured photosensitive composition film deposited at the periphery, edges, or back of a substrate or removal of an uncured photosensitive composition deposited at the surface of system members or equipment in a process for forming a photosensitive composition film on a glass substrate, a semiconductor wafer, or the like.
摘要翻译：用于去除未固化的光敏组合物的光敏组合物去除剂，该去除剂包括1至80质量％的至少一种在分子内具有9个或更多碳原子的芳族烃。光敏组合物去除剂还包括非质子极性溶剂和/或非质子极性溶剂以外的其它溶剂。光敏组合物去除剂对于去除沉积在基材的周边，边缘或背面的未固化光敏组合物薄膜或去除沉积在系统构件或设备的表面上的未固化光敏组合物在用于形成光敏组合物的方法中是有效的玻璃基板上的薄膜，半导体晶片等。

3. 发明授权

US08153357B2 Photosensitive composition remover 有权
标题翻译：感光组合物去除剂
公开(公告)号：US08153357B2
公开(公告)日：2012-04-10
申请号：US10582787
申请日：2004-12-14
申请人： Masato Kaneda , Yasuhiro Mikawa , Koji Shimizu , Kouichi Terao
发明人： Masato Kaneda , Yasuhiro Mikawa , Koji Shimizu , Kouichi Terao
IPC分类号： G03F7/30 , G03F7/32 , C11D7/50
CPC分类号： G03F7/168 , G03F7/0007 , G03F7/325
摘要： A photosensitive composition remover used for removal of an uncured photosensitive composition, which remover comprises 1 to 80 percent by mass of at least one type of aromatic hydrocarbon having 9 carbon atoms or more within the molecule. The photosensitive composition remover further comprises an aprotic polar solvent and/or another solvent other than aprotic polar solvents. The photosensitive composition remover is effective for removal of an uncured photosensitive composition film deposited at the periphery, edges, or back of a substrate or removal of an uncured photosensitive composition deposited at the surface of system members or equipment in a process for forming a photosensitive composition film on a glass substrate, a semiconductor wafer, or the like. It is preferably used for removal of a photosensitive composition containing a pigment.
摘要翻译：用于除去未固化的光敏组合物的光敏组合物去除剂，该除去剂包含1至80质量％的至少一种在分子内具有9个或更多个碳原子的芳族烃。光敏组合物去除剂还包含非质子极性溶剂和/或非质子极性溶剂以外的其它溶剂。光敏组合物去除剂对于去除沉积在基材的周边，边缘或背面的未固化光敏组合物薄膜或去除沉积在系统构件或设备的表面上的未固化光敏组合物在用于形成光敏组合物的方法中是有效的玻璃基板上的薄膜，半导体晶片等。优选用于除去含有颜料的感光性组合物。

4. 发明申请

US20080167210A1 Removing Solution for Photosensitive Composition 审中-公开
标题翻译：去除光敏组合物的溶液
公开(公告)号：US20080167210A1
公开(公告)日：2008-07-10
申请号：US11794547
申请日：2006-02-09
申请人： Masato Kaneda , Yasuhiro Mikawa , Kouichi Terao
发明人： Masato Kaneda , Yasuhiro Mikawa , Kouichi Terao
IPC分类号： G03F7/26
CPC分类号： C09D9/005 , G02B5/20 , G03F7/168 , G03F7/422
摘要： A removing solution for photosensitive composition for removal of a pigment-containing photosensitive composition, the solution comprising an alkyleneglycol monoalkyl ether and an aromatic hydrocarbon, as well as one or more solvents selected from among alkyleneglycol monoalkyl ether carboxylic acid esters, alkoxycarboxylic acid esters, alicyclic ketones and acetic acid esters. There is provided a photosensitive composition removing solution with excellent photosensitive composition removal performance.
摘要翻译：用于除去含颜料的光敏组合物的光敏组合物的去除溶液，所述溶液包含亚烷基二醇单烷基醚和芳族烃，以及一种或多种选自亚烷基二醇单烷基醚羧酸酯，烷氧基羧酸酯，脂环族酮和乙酸酯。提供了具有优异的光敏组合物去除性能的光敏组合物去除溶液。

5. 发明授权

US08431333B2 Method for removing an uncured photosensitive composition 有权
标题翻译：去除未固化的光敏组合物的方法
公开(公告)号：US08431333B2
公开(公告)日：2013-04-30
申请号：US13243090
申请日：2011-09-23
申请人： Masato Kaneda , Yasuhiro Mikawa , Koji Shimizu , Kouichi Terao
发明人： Masato Kaneda , Yasuhiro Mikawa , Koji Shimizu , Kouichi Terao
IPC分类号： G03F7/30 , G03F7/32 , B08B3/00
CPC分类号： G03F7/168 , G03F7/0007 , G03F7/325
摘要： A photosensitive composition remover used for removal of an uncured photosensitive composition, which remover includes 1 to 80 percent by mass of at least one type of aromatic hydrocarbon having 9 carbon atoms or more within the molecule. The photosensitive composition remover further includes an aprotic polar solvent and/or another solvent other than aprotic polar solvents. The photosensitive composition remover is effective for removal of an uncured photosensitive composition film deposited at the periphery, edges, or back of a substrate or removal of an uncured photosensitive composition deposited at the surface of system members or equipment in a process for forming a photosensitive composition film on a glass substrate, a semiconductor wafer, or the like.
摘要翻译：用于去除未固化的光敏组合物的光敏组合物去除剂，该去除剂包括1至80质量％的至少一种在分子内具有9个或更多碳原子的芳族烃。光敏组合物去除剂还包括非质子极性溶剂和/或非质子极性溶剂以外的其它溶剂。光敏组合物去除剂对于去除沉积在基材的周边，边缘或背面的未固化光敏组合物薄膜或去除沉积在系统构件或设备的表面上的未固化光敏组合物在用于形成光敏组合物的方法中是有效的玻璃基板上的薄膜，半导体晶片等。

6. 发明申请

US20070161530A1 Photosensitive composition remover 有权
标题翻译：感光组合物去除剂
公开(公告)号：US20070161530A1
公开(公告)日：2007-07-12
申请号：US10582787
申请日：2004-12-14
申请人： Masato Kaneda , Yasuhiro Mikawa , Koji Shimizu
发明人： Masato Kaneda , Yasuhiro Mikawa , Koji Shimizu
IPC分类号： G03F7/42
CPC分类号： G03F7/168 , G03F7/0007 , G03F7/325
摘要： A photosensitive composition remover used for removal of an uncured photosensitive composition, which remover comprises 1 to 80 percent by mass of at least one type of aromatic hydrocarbon having 9 carbon atoms or more within the molecule. The photosensitive composition remover further comprises an aprotic polar solvent and/or another solvent other than aprotic polar solvents. The photosensitive composition remover is effective for removal of an uncured photosensitive composition film deposited at the periphery, edges, or back of a substrate or removal of an uncured photosensitive composition deposited at the surface of system members or equipment in a process for forming a photosensitive composition film on a glass substrate, a semiconductor wafer, or the like. It is preferably used for removal of a photosensitive composition containing a pigment in a process for forming a photosensitive composition film on a substrate in the process of production of a liquid crystal or an organic EL display.
摘要翻译：用于除去未固化的光敏组合物的光敏组合物去除剂，该除去剂包含1至80质量％的至少一种在分子内具有9个或更多个碳原子的芳族烃。光敏组合物去除剂还包含非质子极性溶剂和/或非质子极性溶剂以外的其它溶剂。光敏组合物去除剂对于去除沉积在基材的周边，边缘或背面的未固化光敏组合物薄膜或去除沉积在系统构件或设备的表面上的未固化光敏组合物在用于形成光敏组合物的方法中是有效的玻璃基板上的薄膜，半导体晶片等。在制造液晶或有机EL显示器的过程中，优选用于在基材上形成感光性组合物膜的方法中除去含有颜料的感光性组合物。

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