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1. 发明授权

US5012858A Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit 失效
标题翻译：使用冷却单元冷却半导体器件的方法，在器件和冷却单元之间使用金属果汁冻
公开(公告)号：US5012858A
公开(公告)日：1991-05-07
申请号：US334770
申请日：1989-04-10
申请人： Katsuhide Natori , Isao Watanabe , Koji Katsuyama , Isao Kawamura , Haruhiko Yamamoto , Takeshi Nagai
发明人： Katsuhide Natori , Isao Watanabe , Koji Katsuyama , Isao Kawamura , Haruhiko Yamamoto , Takeshi Nagai
IPC分类号： H01L23/373 , H01L23/36 , H01L23/427 , H01L23/473
CPC分类号： H01L23/4275 , H01L2224/16 , H01L2224/73253
摘要： A method of cooling a semiconductor device with a cooling unit, using a metal sherbet, which is metal being in a state of a mixed phase consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the semiconductor device for transferring heat generated in the semiconductor device to the cooling unit. The metal sherbet is metal, such as In-Ga binary system, in which solids of In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the semiconductor device and the cooling unit.
摘要翻译：一种冷却装置的冷却装置的冷却装置，其特征在于，在所述冷却装置和所述冷却装置之间，使用由液相和固相构成的混合相的状态下的金属果子露用于将在半导体器件中产生的热传递到冷却单元的半导体器件。金属果汁冻是诸如In-Ga二元体系的金属，其中In-Ga固体的固体在半导体器件和冷却单元的正常操作下获得的温度下分散在In和Ga液体中。

2. 发明授权

US4783721A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US4783721A
公开(公告)日：1988-11-08
申请号：US79877
申请日：1987-07-30
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： G02F1/00 , G11B5/64 , G11B11/105 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , G02F1/0036 , G11B11/10591 , G11B5/64 , H01L23/4332 , H01L2224/48091
摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
摘要翻译：一种冷却系统，包括：冷却模块，其具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏置，用于将由所述部件散发的热传递到所述冷却剂;以及用于引导和防止转印板的不正确对准，因为它们朝向电路部件弹性偏压。冷却剂模块可以包括用于在转印板和电路部件之间建立热接触的焊料或低熔点金属。

3. 发明授权

US5126919A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US5126919A
公开(公告)日：1992-06-30
申请号：US261904
申请日：1988-10-25
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： G11B5/64 , G11B11/105 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , G11B11/10586 , G11B11/10591 , G11B5/64 , H01L23/4332 , H01L2224/48091
摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
摘要翻译：冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属用于在转印板和电路部件之间建立热接触。

4. 发明授权

US4920574A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US4920574A
公开(公告)日：1990-04-24
申请号：US79876
申请日：1987-07-30
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , H01L23/4332 , H01L2924/0002
摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant. A series of projections are provided on the heat transfer plate for producing turbulence in the flow of coolant. Alternatively, a cylindrical tubular plate is mounted on the heat transfer plate for increasing the surface area in contact with the flow of coolant.
摘要翻译：一种冷却系统，包括冷却模块，该冷却模块具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏压，以将由部件散发的热量传递给冷却剂。在传热板上提供一系列突起，用于在冷却剂流中产生湍流。或者，圆柱形管板安装在传热板上，用于增加与冷却剂流接触的表面积。

5. 发明授权

US4879632A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US4879632A
公开(公告)日：1989-11-07
申请号：US914942
申请日：1986-10-03
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： G02F1/00 , G11B5/64 , G11B11/105 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , G02F1/0036 , G11B11/10591 , G11B5/64 , H01L23/4332 , H01L2224/48091
摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
摘要翻译：冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属用于在转印板和电路部件之间建立热接触。

6. 发明申请

US20120248076A1 LASER WELDING METHOD AND BATTERY MADE BY THE SAME 审中-公开
标题翻译：激光焊接方法和电池制作
公开(公告)号：US20120248076A1
公开(公告)日：2012-10-04
申请号：US13402434
申请日：2012-02-22
申请人： Hiroshi Hosokawa , Haruhiko Yamamoto
发明人： Hiroshi Hosokawa , Haruhiko Yamamoto
IPC分类号： B23K26/20
CPC分类号： B23K26/22 , B23K26/009 , B23K26/18 , B23K2101/38 , B23K2103/10 , B23K2103/12 , B23K2103/18 , B23K2103/42
摘要： In a laser welding method including irradiating a welding portion between metallic members with a laser beam, the laser welding portion is covered with a cover made of a laser beam transmissive resin, and the metallic members are laser-welded together by irradiating the welding portion with the laser beam through the cover. The cover made of the laser beam transmissive resin may come in contact with the metallic members around the welding portion so that a gap is formed between the cover and the laser welding portion, thereby holding the gap in a hermetically closed state. It is therefore possible to provide a laser welding method between the metallic members for preventing metal particles that have spattered out of the welding portion from dispersing into surrounding areas.
摘要翻译：在激光焊接方法中，包括用激光束照射金属部件之间的焊接部分，激光焊接部分被由激光束透射树脂制成的盖覆盖，并且通过用焊接部分照射焊接部分将金属部件激光焊接在一起激光束通过盖子。由激光束透射树脂制成的盖可以与焊接部分周围的金属部件接触，从而在盖和激光焊接部之间形成间隙，从而将间隙保持在气密闭合状态。因此，可以在用于防止从焊接部分溅出的金属颗粒分散到周围区域中的金属构件之间提供激光焊接方法。

7. 发明授权

US08207949B2 Touch panel, and method for manufacturing touch panel 有权
标题翻译：触控面板及触控面板制造方法
公开(公告)号：US08207949B2
公开(公告)日：2012-06-26
申请号：US12567089
申请日：2009-09-25
申请人： Hirohisa Takahashi , Satoru Takasawa , Isao Sugiura , Atsushi Ota , Satoru Ishibashi , Haruhiko Yamamoto
发明人： Hirohisa Takahashi , Satoru Takasawa , Isao Sugiura , Atsushi Ota , Satoru Ishibashi , Haruhiko Yamamoto
IPC分类号： G06F3/041
CPC分类号： G06F3/041 , G06F3/045 , Y10T29/49117
摘要： A highly durable touch panel is provided. A touch panel according to the present invention includes a deformable flexible panel, and a transparent electrode film containing In2O3 as a primary component and containing Ti is exposed to a surface of a lower electrode film of a display device. Since such a transparent electrode film has a high abrasion resistance as compared to a conventional one (such as, an ITO thin film), the transparent electrode film is neither clouded nor cracked even if the lower electrode film is repeatedly pressed. Therefore, the touch panel according to the present invention is highly durable.
摘要翻译：提供高度耐用的触摸面板。根据本发明的触摸面板包括可变形的柔性面板，并且包含In 2 O 3作为主要成分并且含有Ti的透明电极膜暴露于显示装置的下电极膜的表面。由于这种透明电极膜与以往的透明电极膜相比具有高耐磨性（例如ITO薄膜），所以即使下反射膜反复被压制，透明电极膜也不会发生糊化或者不破裂。因此，根据本发明的触摸面板是高度耐用的。

8. 发明申请

US20100013787A1 TOUCH PANEL, AND METHOD FOR MANUFACTURING TOUCH PANEL 有权
标题翻译：触控面板和制造触摸面板的方法
公开(公告)号：US20100013787A1
公开(公告)日：2010-01-21
申请号：US12567089
申请日：2009-09-25
申请人： Hirohisa TAKAHASHI , Satoru Takasawa , Isao Sugiura , Atsushi Ota , Satoru Ishibashi , Haruhiko Yamamoto
发明人： Hirohisa TAKAHASHI , Satoru Takasawa , Isao Sugiura , Atsushi Ota , Satoru Ishibashi , Haruhiko Yamamoto
IPC分类号： G06F3/041 , H01R43/00
CPC分类号： G06F3/041 , G06F3/045 , Y10T29/49117
摘要： A highly durable touch panel is provided. A touch panel according to the present invention includes a deformable flexible panel, and a transparent electrode film containing In2O3 as a primary component and containing Ti is exposed to a surface of a lower electrode film of a display device. Since such a transparent electrode film has a high abrasion resistance as compared to a conventional one (such as, an ITO thin film), the transparent electrode film is neither clouded nor cracked even if the lower electrode film is repeatedly pressed. Therefore, the touch panel according to the present invention is highly durable.
摘要翻译：提供高度耐用的触摸面板。根据本发明的触摸面板包括可变形的柔性面板，并且包含In 2 O 3作为主要成分并且含有Ti的透明电极膜暴露于显示装置的下电极膜的表面。由于这种透明电极膜与以往的透明电极膜相比具有高耐磨性（例如ITO薄膜），所以即使下反射膜反复被压制，透明电极膜也不会发生糊化或者不破裂。因此，根据本发明的触摸面板是高度耐用的。

9. 发明申请

US20080023972A1 Attachment structure of energy absorbing structure 失效
标题翻译：能量吸收结构的附件结构
公开(公告)号：US20080023972A1
公开(公告)日：2008-01-31
申请号：US11878081
申请日：2007-07-20
申请人： Yoshikazu Ohno , Haruhiko Yamamoto , Takao Ito
发明人： Yoshikazu Ohno , Haruhiko Yamamoto , Takao Ito
IPC分类号： B60R19/24
CPC分类号： B60R19/18 , B60R2019/188
摘要： An attachment structure of an energy absorbing structure includes: a bumper reinforcement that includes an attachment surface, with insertion holes being formed in the attachment surface; an energy absorbing structure disposed in contact with the attachment surface; locking claws that are disposed on the energy absorbing structure and engage with the bumper reinforcement to lock the energy absorbing structure to the bumper reinforcement; and load receiving projections that are disposed on the energy absorbing structure and are inserted into the insertion holes, so that when a load in a direction along the attachment surface acts on the energy absorbing structure, the load receiving projections interfere with inner peripheral portions of the insertion holes and receive the load.
摘要翻译：能量吸收结构的安装结构包括：保险杠加强件，其包括附接表面，在所述附接表面中形成有插入孔; 设置成与所述附接表面接触的能量吸收结构; 锁定爪，其设置在能量吸收结构上并与保险杠加强件接合以将能量吸收结构锁定到保险杠加强件; 以及负载接收突起，其设置在能量吸收结构上并被插入到插入孔中，使得当沿着附着表面的方向上的负载作用在能量吸收结构上时，负载接收突起与内部的插入孔并接收负载。

10. 发明授权

US06621707B2 Liquid-cooled electronic apparatus 失效
公开(公告)号：US06621707B2
公开(公告)日：2003-09-16
申请号：US09968041
申请日：2001-10-02
申请人： Junichi Ishimine , Masahiro Suzuki , Masahiro Miyo , Akihiko Fujisaki , Keizo Takemura , Jie Wei , Hisashi Kawashima , Yoshiaki Udagawa , Haruhiko Yamamoto , Masahiro Mochizuki
发明人： Junichi Ishimine , Masahiro Suzuki , Masahiro Miyo , Akihiko Fujisaki , Keizo Takemura , Jie Wei , Hisashi Kawashima , Yoshiaki Udagawa , Haruhiko Yamamoto , Masahiro Mochizuki
IPC分类号： H05K720
CPC分类号： H05K7/20781 , G06F1/181 , G06F1/20 , G06F1/206 , H01L23/473 , H01L2224/48091 , H01L2924/00014
摘要： An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

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