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1. 发明授权

US5126919A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US5126919A
公开(公告)日：1992-06-30
申请号：US261904
申请日：1988-10-25
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： G11B5/64 , G11B11/105 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , G11B11/10586 , G11B11/10591 , G11B5/64 , H01L23/4332 , H01L2224/48091
摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
摘要翻译：冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属用于在转印板和电路部件之间建立热接触。

2. 发明授权

US4920574A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US4920574A
公开(公告)日：1990-04-24
申请号：US79876
申请日：1987-07-30
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , H01L23/4332 , H01L2924/0002
摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant. A series of projections are provided on the heat transfer plate for producing turbulence in the flow of coolant. Alternatively, a cylindrical tubular plate is mounted on the heat transfer plate for increasing the surface area in contact with the flow of coolant.
摘要翻译：一种冷却系统，包括冷却模块，该冷却模块具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏压，以将由部件散发的热量传递给冷却剂。在传热板上提供一系列突起，用于在冷却剂流中产生湍流。或者，圆柱形管板安装在传热板上，用于增加与冷却剂流接触的表面积。

3. 发明授权

US4879632A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US4879632A
公开(公告)日：1989-11-07
申请号：US914942
申请日：1986-10-03
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： G02F1/00 , G11B5/64 , G11B11/105 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , G02F1/0036 , G11B11/10591 , G11B5/64 , H01L23/4332 , H01L2224/48091
摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
摘要翻译：冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属用于在转印板和电路部件之间建立热接触。

4. 发明授权

US4783721A Cooling system for an electronic circuit device 失效
标题翻译：电子电路装置的冷却系统
公开(公告)号：US4783721A
公开(公告)日：1988-11-08
申请号：US79877
申请日：1987-07-30
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： G02F1/00 , G11B5/64 , G11B11/105 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , G02F1/0036 , G11B11/10591 , G11B5/64 , H01L23/4332 , H01L2224/48091
摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
摘要翻译：一种冷却系统，包括：冷却模块，其具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏置，用于将由所述部件散发的热传递到所述冷却剂;以及用于引导和防止转印板的不正确对准，因为它们朝向电路部件弹性偏压。冷却剂模块可以包括用于在转印板和电路部件之间建立热接触的焊料或低熔点金属。

5. 发明授权

US4719541A Electronic apparatus mounting structure 失效
标题翻译：电子装置安装结构
公开(公告)号：US4719541A
公开(公告)日：1988-01-12
申请号：US924847
申请日：1986-10-10
申请人： Izumi Ono , Haruo Takayama , Yasuo Takahashi , Eichiro Okumura
发明人： Izumi Ono , Haruo Takayama , Yasuo Takahashi , Eichiro Okumura
IPC分类号： H05K7/02 , H05K7/14 , H05K7/20 , H02B1/20
CPC分类号： H05K7/20563 , H05K7/1457
摘要： The present invention relates to a mounting structure for electronic apparatus mounting electronic parts with a high mounting density. The present invention is capable of supplying power to a printed wiring board from a power supply without a voltage drop through a very short wiring distance. Both the power supply and printed wiring board are cooled with a common air cooling fan, and the power supply, bus plate and printed wiring board are integrally assembled and connected.
摘要翻译： PCT No.PCT / JP86 / 00057 Sec。 371日期1986年10月10日第 102（e）日期1986年10月10日PCT提交1986年2月12日PCT公布。出版物WO86 / 05061 日期：1986年8月28日。本发明涉及一种安装密度高的电子部件的电子装置的安装结构。本发明能够通过非常短的布线距离从电源向印刷布线板供电而没有电压降。电源和印刷电路板都用普通的空气冷却风扇冷却，电源，总线板和印刷电路板整体组装和连接。

6. 发明授权

US4627677A Flexible current feeding post 失效
标题翻译：柔性电流供料柱
公开(公告)号：US4627677A
公开(公告)日：1986-12-09
申请号：US738864
申请日：1985-05-29
申请人： Izumi Ono , Iwami Manago , Haruo Takayama , Yasuo Takahashi
发明人： Izumi Ono , Iwami Manago , Haruo Takayama , Yasuo Takahashi
IPC分类号： H02J1/00 , H01R12/52 , H01R35/02 , H01R9/09
CPC分类号： H01R35/02 , H01R12/52
摘要： A flexible current feeding post for electronic modular assemblies interconnects parallel oriented substrates such as printed circuit boards having electrical circuits mounted thereon and bus plates for power supply, for both mechanical assembly and current distribution. The flexible current feeding post comprises a solid, cylindrical stud for connection to a contact surface of one substrate, a conductive bellows connected to the stud and means connecting the conductive bellows to a contact surface of a second substrate, spaced from the first substrate by a desired distance and generally parallel thereto. The flexible current feeding post affords tolerances with respect to mechanical misalignment of the respective contact surfaces of the interconnected substrates and spacing variations therebetween, thus eliminating undesirable distortion of the interconnected substrates and affording enhanced tolerance to thermal distortions of the substrates during operation, and assuring intimate and uniform connections of the feeding post to the corresponding contact surfaces of the substrates to minimize voltage drops thereacross. Flexible current by-pass means are afforded to increase the current handling capacity of the feeding post.
摘要翻译：用于电子模块化组件的柔性电流馈送柱互连平行取向的基板，例如其上安装有电路的印刷电路板和用于电源的总线板，用于机械组装和电流分布。柔性电流馈送柱包括用于连接到一个基板的接触表面的固体圆柱形螺柱，连接到螺柱的导电波纹管和将导电波纹管连接到第二基板的接触表面的装置，第二基板与第一基板间隔开一个期望的距离并且大致与之平行。柔性电流馈送端提供相对于互连基板的相应接触表面的机械未对准的公差以及它们之间的间隔变化，从而消除互连基板的不期望的变形，并且在操作期间提供对基板的热变形的增强的公差，并且确保亲密并且将进料柱均匀地连接到基板的相应的接触表面，以最小化其上的电压降。提供灵活的电流旁通装置以增加馈电柱的当前处理能力。

7. 发明授权

US4688147A Cooling device attached to each surface of electronic parts on a printed-wiring board 失效
标题翻译：连接到印刷电路板上的电子部件的每个表面的冷却装置
公开(公告)号：US4688147A
公开(公告)日：1987-08-18
申请号：US909229
申请日：1986-09-19
申请人： Izumi Ono
发明人： Izumi Ono
IPC分类号： H05K7/20 , H01L23/433 , H01L23/473 , H02B1/00
CPC分类号： H01L23/4735 , H01L23/4332 , H01L2924/0002
摘要： A cooling device located between a cooling plate having a first coolant circulating therein, and an electronic part to be cooled, mounted on a printed-wiring board, comprising a hollow part being thermally conductive, having a hollow chamber through which the first coolant circulates, and connected to the cooling plate by a flange part being thermally conductive, a thermal conduction plate attached to a surface of the electronic part and connected to the flange part by a bellows providing a space among the hollow part, the bellows and the thermal conduction plate, and a second liquid coolant filling the space for transferring heat from the thermal conduction plate to the hollow part by a convection current of the second coolant. The second coolant is made of alloy being chemically inactive to the bellows and having a low melting point so as to be liquid at ordinary temperatures.
摘要翻译：一种位于冷却板之间的冷却装置，其中冷却板具有循环于其中的第一冷却剂和安装在印刷电路板上的要冷却的电子部件，包括具有导热性的中空部分，具有第一冷却剂通过该中空室，并且通过导热性的凸缘部与冷却板连接，导热板，其安装在电子部件的表面，并通过波纹管连接到凸缘部，在中空部，波纹管和导热板之间形成空间以及第二液体冷却剂，其填充用于通过第二冷却剂的对流电流将热量从热传导板传递到中空部分的空间。第二冷却剂由对波纹管化学惰性的合金制成，并具有低熔点以在常温下为液体。

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