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    • 9. 发明申请
    • Encapsulation of organic devices
    • 有机装置封装
    • US20090066240A1
    • 2009-03-12
    • US12290708
    • 2008-11-03
    • Arvid HunzeDebora HenselerKarsten Heuser
    • Arvid HunzeDebora HenselerKarsten Heuser
    • H01J1/62
    • H01L51/5246H01L21/50H01L2251/566
    • Presented an organic light-emitting device (OLED) that includes at least one active region, at least one organic layer, a first glass plate on which the at least one active region is applied, and a second glass plate. The active region is disposed between the first and the second glass plates. The first and second glass plates are at least partially transparent in the near infrared spectral range. The OLED further includes a bonding material that includes a solder glass and is disposed between the first and second glass plates. The bonding material forms at least one frame that surrounds the active region and mechanically connects the first glass plate with the second glass plate and seals the active region. The bonding material absorbs near infrared radiation. The OLED further includes spacer particles that have a mean diameter that maintains a height between the first and second glass plates.
    • 提出了一种有机发光器件(OLED),其包括至少一个有源区,至少一个有机层,其上施加至少一个有源区的第一玻璃板和第二玻璃板。 有源区域设置在第一和第二玻璃板之间。 第一和第二玻璃板在近红外光谱范围内至少部分透明。 OLED还包括包含焊料玻璃并且设置在第一和第二玻璃板之间的接合材料。 接合材料形成至少一个围绕有源区域的框架,并机械地将第一玻璃板与第二玻璃板连接并密封有源区域。 接合材料吸收近红外辐射。 OLED还包括具有保持第一和第二玻璃板之间的高度的平均直径的间隔物颗粒。
    • 10. 发明申请
    • Encapsulation of organic devices
    • 有机装置封装
    • US20060105493A1
    • 2006-05-18
    • US11141476
    • 2005-05-31
    • Arvid HunzeDebora HenselerKarsten Heuser
    • Arvid HunzeDebora HenselerKarsten Heuser
    • H01L51/40H01L21/56
    • H01L51/5246H01L21/50H01L2251/566
    • A method for encapsulating devices, in particular organic devices such as OLED-devices, comprising the steps of depositing organic active material on an active region of a substrate; providing a cap to enclose said organic active material within a space defined by a cap periphery adapted to adhere to the substrate; applying a thermally curable bonding material to said cap periphery or to regions of the substrate adapted to adhere to said cap periphery; mounting said cap onto the substrate so that said bonding material is between said cap periphery and the substrate; and curing the bonding material with electromagnetic radiation in the near infrared range to encapsulate the device. Furthermore, a corresponding batch process is disclosed.
    • 一种用于封装器件的方法,特别是诸如OLED器件的有机器件,包括以下步骤:在衬底的有源区上沉积有机活性材料; 提供盖以将所述有机活性材料包围在由适于粘附到所述基底的帽周边限定的空间内; 将热可固化粘合材料施加到所述盖周边或适于粘附到所述盖周边的所述基板的区域; 将所述盖安装到所述基板上,使得所述接合材料位于所述盖周边和所述基板之间; 并用近红外范围的电磁辐射固化接合材料以封装该装置。 此外,公开了相应的批处理。