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1. 发明授权

US4069961A Contacting head for forming a wire connection on an integrated circuit 失效
标题翻译：用于在集成电路上形成电线连接的接触头
公开(公告)号：US4069961A
公开(公告)日：1978-01-24
申请号：US750896
申请日：1976-12-15
申请人： Karl Nicklaus , Miroslav Tresky
发明人： Karl Nicklaus , Miroslav Tresky
IPC分类号： H01L21/603 , H01L21/607 , B23K21/02
CPC分类号： H01L24/85 , H01L24/78 , H01L2224/45124 , H01L2224/45144 , H01L2224/78313 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/14
摘要： A contacting head for making a wire connection, particularly an aluminum or gold wire connection on an integrated circuit by ultrasonic or thermocompression bonding, in which a contacting arm is provided with a concave contacting tool or a capillary, and supplies ultrasonic or heat energy. The concave contacting tool has a gripper, or the capillary has a wire clamping device for effecting a feed or clamping of the wire during movement of the contacting arm. A driving unit provides for threading the wire through a wire guiding device which is entirely enclosed, and through the concave contacting tool or the capillary. The driving unit also provides for controlling the wire tension and produces a gas stream in the enclosed wire guiding device. A magnetic arrangement with a permanent magnet and a non-ferrous core provides for electrodynamic contact pressure control of the contacting arm and for control of the gripper. The wire supply spool is encapsulated and mounted on a base, together with a housing which is vertically movable on the base and mounts the contacting arm, the driving unit and the gripper or wire clamping device. The wire guiding device connects the wire supply spool to the driving unit, and is in the form of an elastic metal tube for the wire.
摘要翻译：用于通过超声波或热压接在集成电路上形成电线连接的接触头，特别是铝或金线连接，其中接触臂设置有凹接触工具或毛细管，并且提供超声波或热能。凹接触工具具有夹持器，或毛细管具有线夹紧装置，用于在接触臂移动期间实现线的进给或夹紧。驱动单元提供将线穿过整个封闭的线引导装置，并通过凹接触工具或毛细管。驱动单元还提供用于控制线张力并在封闭导线装置中产生气流。具有永磁体和非铁芯的磁性装置提供接触臂的电动接触压力控制和用于控制夹具。电线卷轴被封装并安装在基座上，壳体与可在基座上垂直移动并安装接触臂，驱动单元和夹持器或线夹紧装置的壳体一起。电线导引装置将电线供给线轴连接到驱动单元，并且是用于线的弹性金属管的形式。

2. 发明授权

US4058246A Suction pipette and method of manufacture for receiving of semiconductor crystal plates 失效
标题翻译：用于接收半导体晶体板的吸移管和制造方法
公开(公告)号：US4058246A
公开(公告)日：1977-11-15
申请号：US732103
申请日：1976-10-13
申请人： Karl Nicklaus
发明人： Karl Nicklaus
IPC分类号： H01L21/683 , H01L21/68 , B22F7/06
CPC分类号： H01L21/6838
摘要： A method of manufacturing a suction pipette of sinterable material for receiving substantially rectangular, semiconductor crystal plates. The pipette is formed with a rectangular recess and has walls defining the recess which narrow towards the floor of the recess; an evacuation channel communicates with the floor. The method includes the steps of inserting a binder into the material to be sintered, and fabricating first and second parts for assembly of the pipette, the first part being formed with an open channel and having sidewalls defining the channel. The second part is insertable into the first part and has cam-shaped end projections formed with respective inner walls, and outer walls for making contact with the sidewalls upon insertion of the second part into the first part. The method additionally includes grinding the sidewalls of the first part within the region of the open channel and the outer walls of the projections to a predetermined tapered angle for at least a first portion of the sidewalls, and the outer walls to fittingly abut each other, and heat treating the first and second parts upon insertion of the second part into the first part for uniting the first and second parts by diffusion of the binder within the sinterable material.
摘要翻译：一种用于接收基本上矩形的半导体晶体板的可烧结材料的吸移管的方法。移液管形成有矩形凹槽，并且具有限定朝向凹部的底部变窄的凹部的壁; 疏散通道与地板通信。该方法包括将粘合剂插入待烧结的材料中的步骤，以及制造用于组合移液管的第一和第二部分，第一部分形成有开放通道并具有限定通道的侧壁。第二部分可插入到第一部分中，并且具有形成有相应内壁的凸轮形端部突出部和用于在将第二部件插入到第一部件中时与侧壁接触的外壁。该方法还包括在开口通道的区域内将第一部分的侧壁和突出部分的外壁磨削成预定的锥形角，用于至少第一侧壁的第一部分，并且外壁彼此适配地邻接，以及在将所述第二部件插入所述第一部件中时，通过所述粘合剂在所述可烧结材料内的扩散将所述第一部件和所述第二部件热处理，以使所述第一部件和所述第二部件结合。

3. 发明授权

US5550402A Electronic module of extra-thin construction 失效
标题翻译：超薄结构的电子模块
公开(公告)号：US5550402A
公开(公告)日：1996-08-27
申请号：US156295
申请日：1993-11-23
申请人： Karl Nicklaus
发明人： Karl Nicklaus
IPC分类号： H01L23/50 , B42D15/10 , G06K19/077 , H01L21/56 , H01L23/495 , H01L23/498 , H05K3/34
CPC分类号： G06K19/07747 , G06K19/077 , G06K19/07724 , G06K19/07745 , H01L21/565 , H01L23/4951 , H01L23/49513 , H01L23/49541 , H01L23/49855 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01068 , H01L2924/07802 , H01L2924/10253 , H01L2924/12033 , H01L2924/14 , H05K3/3421
摘要： In the electronic module (M) of extra-thin construction disclosed, it is the principal object to substantially reduce the tendency to fracture of the module's semiconductor chip embedded in the plastic casing of the module (M), notwithstanding the extremely small thickness of the casing. The chip is fitted on the chip pad of a system support formed by a thin metal strip, commonly known as a lead frame. The chip may partly overlap the external contacts of the module that lie on one of the flat sides of the module's plastic casing. Slits in the system support, which form the boundaries of the chip pad and are inevitable lines of weakness in the thin metal strip, are situated at an oblique angle relative to the edges of the square or rectangular chip, preferably at about 45.degree.; hence the slits extend also at an oblique angle to possible fracture lines within the monocrystalline structure of the material used in chip manufacture, because said fracture lines are parallel to the chip's edges. Other slits in the metal strip, which extend from said boundary slits, should preferably also be at an angle relative to the edges of the chip. Further characteristics disclosed relate to the mechanical bond between parts of the system support and the module casing, and the bonding of the entire module (M) to the surrounding plastic material when it is moulded into a supporting body or medium, for example in the manufacture of chip cards.
摘要翻译：在公开的超薄结构的电子模块（M）中，主要目的是显着降低嵌入在模块（M）的塑料外壳中的模块的半导体芯片的断裂倾向，尽管其厚度非常小套管。芯片安装在由通常称为引线框架的薄金属条形成的系统支撑的芯片焊盘上。芯片可以部分地与位于模块的塑料外壳的一个平坦侧上的模块的外部触点重叠。形成芯片焊盘的边界并且薄金属条不可避免的弱线的系统支撑中的狭缝相对于正方形或矩形芯片的边缘倾斜倾斜，优选在约45°; 因此，由于所述断裂线平行于芯片的边缘，狭缝也以与切屑制造中使用的材料的单晶结构内的可能断裂线成倾斜的角度延伸。金属带中从所述边界狭缝延伸的其它狭缝也应优选地相对于芯片的边缘成一角度。所公开的其它特征涉及系统支撑件和模块壳体的部件之间的机械结合，以及当模块（M）模制成支撑体或介质时，整个组件（M）与周围的塑料材料的接合，例如在制造的芯片卡。

4. 发明授权

US3941298A Process of making wire connections in semi-conductor elements 失效
标题翻译：在半导体元件中制造电线连接的过程
公开(公告)号：US3941298A
公开(公告)日：1976-03-02
申请号：US584369
申请日：1975-06-05
申请人： Karl Nicklaus
发明人： Karl Nicklaus
IPC分类号： H01L21/00 , H01L21/607 , H01L21/603
CPC分类号： H01L24/85 , H01L24/78 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/4823 , H01L2224/48464 , H01L2224/78301 , H01L2224/85205 , H01L24/45 , H01L2924/01023 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082
摘要： A process characterized in that a linear spare wire conveyed in a tubular member has a wire piece fused-off and retained, at the fused-off end of the wire piece and the spare wire each there being a sphere fused thereon, the wire piece being displaced transverse to the axis of the spare wire and then together with the tubular member conveying the spare wire is moved forward in the direction of the referred-to axis through a predetermined distance in which, during the forward displacement, the sphere formed at the end of the spare wire contacts the tubular piece and is through the pulling-away from the spare wire moved into a position in which this sphere has with reference to a pressing tool for picking up the wire piece is located at a predetermined fixed distance in the direction of the referred-to axis, the wire piece being conveyed transverse to the referred-to axis toward the pressing tool and being picked up by the latter, upon which the tubular member while retaining of the spare wire is moved back into its outlet position, and at both spheres of the wire piece are by means of the pressing tool pressed onto the heated contact locations of the semi-conductor element, whereby during the pressing-on of the spare wire the subsequent wire piece is fused-off in the above-mentioned manner. In a preferred embodiment of the process, the tubular member remains stationary, and the spare wire is essentially embraced in closely spaced relationship by suitable forceps.
摘要翻译：一种方法，其特征在于，在管状构件中输送的线性备用线具有在所述线材的熔断端和所述备用线上熔融断开并保持的线材，每个所述线上均存在熔合在其上的球，所述线片为然后与输送备用电线的管状部件一起，在被引用的轴线的方向上向前移动一预定的距离，在预定的距离内，向前移动期间形成的球体在末端的备用电线与管状件接触并且通过从被移动到该球体所具有的位置的备用电线拉开，并且相对于用于拾取电线的加压工具位于沿着该方向的预定的固定距离所述线片被横向于所述被引导轴线朝向所述按压工具传送并被所述线材拾取，所述管状构件在保持所述翼梁的同时保持所述翼梁 e线被移回到其出口位置，并且在线片的两个球体处通过按压在半导体元件的加热接触位置上的按压工具，由此在备用电线的按压期间，随后的线材以上述方式熔断。在该方法的优选实施例中，管状构件保持静止，并且备用线基本上以合适的镊子紧密间隔开地包围。

5. 发明授权

US4205773A Contacting device for making a wire connection on a microcircuit 失效
标题翻译：用于在微电路上进行电线连接的接触装置
公开(公告)号：US4205773A
公开(公告)日：1980-06-03
申请号：US938042
申请日：1978-08-30
申请人： Karl Nicklaus
发明人： Karl Nicklaus
IPC分类号： H01L21/603 , H01L21/607 , B23K19/04
CPC分类号： H01L24/85 , H01L24/78 , H01L2224/45015 , H01L2224/45144 , H01L2224/78301 , H01L2224/786 , H01L2224/851 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L24/45 , H01L2924/00014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079
摘要： A contacting device for making a wire connection on a microcircuit by applying ultrasonics or thermocompression. A contacting horn is provided with a capillary which, in turn, is associated with a wire clamping device for feeding or clamping the wire during movement of the contacting horn. The wire clamping device has two clamping members for grasping the wire. The clamping members are movable relative to each other for clamping the wire, and both are arranged to pivot jointly to move the clamped wire in its lengthwise direction. A controllable actuation unit is each associated with the second clamping member which moves relative to the first, and the two clamping members jointly. The clamping members may be formed as a strip for grasping the wire between outer end regions. The second clamping member is mounted on a support of the first clamping member, and its outer end is pressed by a leaf spring fastened to the first clamping member.
摘要翻译：一种接触装置，用于通过施加超声波或热压来在微电路上进行电线连接。接触喇叭设置有毛细管，毛细管又与用于在接触喇叭的运动期间进给或夹紧线材的线夹紧装置相关联。电线夹紧装置具有用于抓住电线的两个夹紧构件。夹紧构件可相对于彼此移动以夹紧线，并且两者被布置成联合枢转以沿着其长度方向移动夹紧的线。可控制的致动单元各自与第二夹紧构件相关联，第二夹紧构件相对于第一夹持构件和两个夹紧构件共同移动。夹紧构件可以形成为用于在外端区域之间抓住线材的条带。第二夹紧构件安装在第一夹紧构件的支撑件上，并且其外端由固定到第一夹紧构件的片簧按压。

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