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1. 发明申请

US20100074815A1 Master and Microreactor 审中-公开
标题翻译：主和微反应器
公开(公告)号：US20100074815A1
公开(公告)日：2010-03-25
申请号：US12447392
申请日：2007-10-19
申请人： Kanji Sekihara , Masayoshi Uehira
发明人： Kanji Sekihara , Masayoshi Uehira
IPC分类号： B29C33/42 , B28B1/00 , B81C1/00 , B81B1/00
CPC分类号： B29C33/42 , B29C33/3878 , B81B2201/051 , B81C99/0085
摘要： Mold releasability of a molding die from a master is improved. The master is a mother body of the molding die. The master has a groove corresponding to a flow channel of a resin molded product, and the cross-section of the bottom surface portion of the groove is in the form of a curved surface.
摘要翻译：提高了模具从母模的脱模性。主人是模具的母体。主机具有对应于树脂模制产品的流动通道的凹槽，并且凹槽的底表面部分的横截面为曲面形式。

2. 发明申请

US20100012255A1 Microchip Manufacturing Method 有权
标题翻译： Microchip制造方法
公开(公告)号：US20100012255A1
公开(公告)日：2010-01-21
申请号：US12528989
申请日：2008-02-21
申请人： Kanji Sekihara , Masayoshi Uehira
发明人： Kanji Sekihara , Masayoshi Uehira
IPC分类号： B32B38/10 , B29C65/08
CPC分类号： B01L3/502707 , B01J2219/00511 , B01J2219/00527 , B01J2219/00596 , B01J2219/00605 , B01J2219/0061 , B01J2219/00621 , B01J2219/00637 , B01L2200/0689 , B01L2300/0816 , B01L2300/0887 , B29C65/08 , B29C65/16 , B29C65/1654 , B29C65/48 , B29C66/0224 , B29C66/345 , B29C66/54 , B29C66/71 , B29C66/72324 , B29C66/81267 , B29C66/8322 , B29C66/91411 , B29C66/919 , B29C2793/00 , B29L2031/756 , B81B2201/051 , B81C1/00071 , B81C2203/032 , Y10S156/93 , Y10T156/1168 , B29K2083/00 , B29K2077/00 , B29K2069/00 , B29K2067/003 , B29K2033/20 , B29K2033/12 , B29K2031/04 , B29K2027/08 , B29K2027/06 , B29K2025/06 , B29K2023/12 , B29K2023/083 , B29K2023/06 , B29K2009/00
摘要： Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films (12, 22) representing the functional films on a surface having a flow path channel (11) of a microchip substrate (10) and on a surface having a flow path channel (21) of a microchip substrate (20) respectively; a second step of exfoliating the SiO2 films formed on the microchip substrates (10, 20) except the SiO2 films formed on the flow path channels (11, 21) by a cohesive member; and a third step of placing the microchip substrates (10, 20) one over another in such a way that the surfaces on which the flow path channels (11, 21) are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding.
摘要翻译：提供了一种在流路通道中形成功能膜并结合树脂微芯片基板的微芯片制造方法。该制造方法具有在具有微芯片基板（10）的流路通道（11）的表面上和具有流路通道（21）的表面上形成表示功能膜的SiO 2膜（12,22）的第一工序，的微芯片基板（20）; 第二步骤，除了通过粘合构件在形成在流路通道（11,21）上的SiO 2膜之外，在微芯片基板（10,20）上形成的SiO 2膜剥离; 以及第三步骤，将微芯片基板（10,20）一个一个地放置成使得其上形成有流路通道（11,21）的表面朝向内部，并通过激光焊接，超声波焊接或热压接合。

3. 发明授权

US07901527B2 Microchip manufacturing method 有权
标题翻译： Microchip的制造方法
公开(公告)号：US07901527B2
公开(公告)日：2011-03-08
申请号：US12528989
申请日：2008-02-21
申请人： Kanji Sekihara , Masayoshi Uehira
发明人： Kanji Sekihara , Masayoshi Uehira
IPC分类号： B32B38/10 , B29C65/08
CPC分类号： B01L3/502707 , B01J2219/00511 , B01J2219/00527 , B01J2219/00596 , B01J2219/00605 , B01J2219/0061 , B01J2219/00621 , B01J2219/00637 , B01L2200/0689 , B01L2300/0816 , B01L2300/0887 , B29C65/08 , B29C65/16 , B29C65/1654 , B29C65/48 , B29C66/0224 , B29C66/345 , B29C66/54 , B29C66/71 , B29C66/72324 , B29C66/81267 , B29C66/8322 , B29C66/91411 , B29C66/919 , B29C2793/00 , B29L2031/756 , B81B2201/051 , B81C1/00071 , B81C2203/032 , Y10S156/93 , Y10T156/1168 , B29K2083/00 , B29K2077/00 , B29K2069/00 , B29K2067/003 , B29K2033/20 , B29K2033/12 , B29K2031/04 , B29K2027/08 , B29K2027/06 , B29K2025/06 , B29K2023/12 , B29K2023/083 , B29K2023/06 , B29K2009/00
摘要： Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films (12, 22) representing the functional films on a surface having a flow path channel (11) of a microchip substrate (10) and on a surface having a flow path channel (21) of a microchip substrate (20) respectively; a second step of exfoliating the SiO2 films formed on the microchip substrates (10, 20) except the SiO2 films formed on the flow path channels (11, 21) by a cohesive member; and a third step of placing the microchip substrates (10, 20) one over another in such a way that the surfaces on which the flow path channels (11, 21) are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding.
摘要翻译：提供了一种在流路通道中形成功能膜并结合树脂微芯片基板的微芯片制造方法。该制造方法具有在具有微芯片基板（10）的流路通道（11）的表面上和具有流路通道（21）的表面上形成表示功能膜的SiO 2膜（12,22）的第一工序，的微芯片基板（20）; 第二步骤，除了通过粘合构件在形成在流路通道（11,21）上的SiO 2膜之外，在微芯片基板（10,20）上形成的SiO 2膜剥离; 以及第三步骤，将微芯片基板（10,20）一个一个地放置成使得其上形成有流路通道（11,21）的表面朝向内部，并通过激光焊接，超声波焊接或热压接合。

4. 发明申请

US20100060998A1 Microchip 审中-公开
公开(公告)号：US20100060998A1
公开(公告)日：2010-03-11
申请号：US12532609
申请日：2008-03-10
申请人： Kanji Sekihara , Masayoshi Uehira
发明人： Kanji Sekihara , Masayoshi Uehira
IPC分类号： G02B3/02 , G02B3/00 , G02B5/08 , G02B5/04
CPC分类号： G01N21/05 , G01N21/0303 , G01N2021/0346
摘要： A microchip, including two resin substrates, wherein a groove serving as a channel is formed on a surface of at least one of the two resin substrates, and the surfaces of the two resin substrates are adhered to each other, and the surface carrying the formed groove faces an inner side of the two adhered resin substrates, the microchip is characterized in that a portion of at least one of the two resin substrates structures a portion of a condenser lens to focus light rays, coming from an external section, onto a predetermined position in the groove.
摘要翻译：一种微芯片，包括两个树脂基板，其中在两个树脂基板中的至少一个的表面上形成用作沟道的沟槽，并且两个树脂基板的表面彼此粘合，并且承载形成所述微芯片的特征在于，所述两个树脂基板中的至少一个树脂基板的一部分构成聚光透镜的一部分，以将来自外部部分的光线聚焦到预定的位于凹槽中。

5. 发明授权

US08268112B2 Bonding method of resin member 失效
标题翻译：树脂构件的粘合方法
公开(公告)号：US08268112B2
公开(公告)日：2012-09-18
申请号：US12532665
申请日：2008-03-19
申请人： Kanji Sekihara , Masayoshi Uehira
发明人： Kanji Sekihara , Masayoshi Uehira
IPC分类号： B29C65/16
CPC分类号： B29C66/1122 , B01L3/502707 , B01L2200/12 , B01L2300/0887 , B01L2300/12 , B29C65/1616 , B29C65/1635 , B29C65/1641 , B29C65/1654 , B29C65/1683 , B29C66/0042 , B29C66/006 , B29C66/348 , B29C66/41 , B29C66/53461 , B29C66/71 , B29C66/73161 , B29C66/733 , B29C66/7352 , B29C66/73921 , B29C66/8122 , B29C66/81265 , B29C66/81267 , B29C66/81268 , B29C66/8322 , B29C66/9161 , B29C66/919 , B29C66/929 , B29C66/934 , B29C66/939 , B29K2995/0027 , B29L2031/756 , B29K2905/00 , B29K2905/02 , B29K2905/12 , B29K2909/08 , B29K2833/12 , B29K2869/00 , B29K2033/12 , B29K2823/00 , B29K2023/00 , B29K2023/38 , B29K2069/00
摘要： A method for bonding resin members by laser welding in which melting of a resin member can be prevented on the contact surface with a base or a tool used for bonding. In the bonding method, a resin member (1) is mounted on a base (3) and a surface of the base (3) in contact with the resin member (1) is an optical mirror surface. A surface of the resin member (1) is coated with a light absorbing agent (4), a resin member (2) is placed thereon and then a laser light (10) is irradiated from the resin member (2) side in order to melt the resin on the bonding surface of the resin member (1) and the resin member (2), thereby bonding the resin members together. The laser light (11) penetrated through the bonding surface reaches the contact surface where the resin member (1) and the base (3) are in contact with each other, and since the laser light (11) penetrates the bonding surface without being scattered or absorbed, melting of the resin member can be prevented.
摘要翻译：一种用于通过激光焊接来粘合树脂构件的方法，其中树脂构件的熔化可以在与用于结合的基座或工具的接触表面上被防止。在接合方法中，树脂构件（1）安装在基座（3）上，与树脂构件（1）接触的基座（3）的表面是光学镜面。树脂构件（1）的表面涂覆有光吸收剂（4），树脂构件（2）放置在其上，然后从树脂构件（2）侧照射激光（10），以便在树脂构件（1）和树脂构件（2）的接合表面上熔化树脂，从而将树脂构件粘合在一起。穿过接合表面的激光（11）到达树脂构件（1）和基底（3）彼此接触的接触表面，并且由于激光（11）不分散地穿透接合表面或吸收，树脂部件的熔化。

6. 发明申请

US20100101720A1 Bonding Method of Resin Member 失效
标题翻译：树脂部件的粘合方法
公开(公告)号：US20100101720A1
公开(公告)日：2010-04-29
申请号：US12532665
申请日：2008-03-19
申请人： Kanji Sekihara , Kanji Sekihara
发明人： Kanji Sekihara , Kanji Sekihara
IPC分类号： B32B37/14
CPC分类号： B29C66/1122 , B01L3/502707 , B01L2200/12 , B01L2300/0887 , B01L2300/12 , B29C65/1616 , B29C65/1635 , B29C65/1641 , B29C65/1654 , B29C65/1683 , B29C66/0042 , B29C66/006 , B29C66/348 , B29C66/41 , B29C66/53461 , B29C66/71 , B29C66/73161 , B29C66/733 , B29C66/7352 , B29C66/73921 , B29C66/8122 , B29C66/81265 , B29C66/81267 , B29C66/81268 , B29C66/8322 , B29C66/9161 , B29C66/919 , B29C66/929 , B29C66/934 , B29C66/939 , B29K2995/0027 , B29L2031/756 , B29K2905/00 , B29K2905/02 , B29K2905/12 , B29K2909/08 , B29K2833/12 , B29K2869/00 , B29K2033/12 , B29K2823/00 , B29K2023/00 , B29K2023/38 , B29K2069/00
摘要： A method for bonding resin members by laser welding in which melting of a resin member can be prevented on the contact surface with a base or a tool used for bonding. In the bonding method, a resin member (1) is mounted on a base (3) and a surface of the base (3) in contact with the resin member (1) is an optical mirror surface. A surface of the resin member (1) is coated with a light absorbing agent (4), a resin member (2) is placed thereon and then a laser light (10) is irradiated from the resin member (2) side in order to melt the resin on the bonding surface of the resin member (1) and the resin member (2), thereby bonding the resin members together. The laser light (11) penetrated through the bonding surface reaches the contact surface where the resin member (1) and the base (3) are in contact with each other, and since the laser light (11) penetrates the bonding surface without being scattered or absorbed, melting of the resin member can be prevented.
摘要翻译：一种用于通过激光焊接来粘合树脂构件的方法，其中树脂构件的熔化可以在与用于结合的基座或工具的接触表面上被防止。在接合方法中，树脂构件（1）安装在基座（3）上，与树脂构件（1）接触的基座（3）的表面是光学镜面。树脂构件（1）的表面涂覆有光吸收剂（4），树脂构件（2）放置在其上，然后从树脂构件（2）侧照射激光（10），以便在树脂构件（1）和树脂构件（2）的接合表面上熔化树脂，从而将树脂构件粘合在一起。穿过接合表面的激光（11）到达树脂构件（1）和基底（3）彼此接触的接触表面，并且由于激光（11）不分散地穿透接合表面或吸收，树脂部件的熔化。

7. 发明授权

US09238322B2 Microchip, molding die for microchip, and manufacturing apparatus for manufacturing microchip 有权
标题翻译： Microchip，微芯片成型模具和微芯片制造装置
公开(公告)号：US09238322B2
公开(公告)日：2016-01-19
申请号：US13882352
申请日：2011-10-25
申请人： Kanji Sekihara
发明人： Kanji Sekihara
IPC分类号： B32B3/24 , B29C45/26 , B01L3/00 , B32B3/26 , B32B3/30
CPC分类号： B29C45/263 , B01L3/502707 , B01L2300/0816 , B29C45/2628 , B32B3/266 , B32B3/30 , Y10T428/24331
摘要： A molding die for molding a substrate to be included in a microchip includes a first die and a second die contactable with and separable from the first die. One of the first die and the second die includes a ridge for molding the groove and a columnar first protrusion for molding at least a smallest diameter portion of a hole in the substrate, the portion having the smallest inner diameter. The other of the first die and the second die includes a second protrusion which is formed to be columnar having a diameter larger than the diameter of the first protrusion and contacts with a distal end of the first protrusion to mold the hole so as to extend through the substrate in cooperation with the first protrusion. A microchip also is provided.
摘要翻译：用于模制要包括在微芯片中的基板的模制模具包括第一模具和可与第一模具接触并可分离的第二模具。第一模具和第二模具中的一个包括用于模制凹槽的脊和用于模制基板中的孔的至少最小直径部分的柱状第一突出部，该内径最小的部分。第一模具和第二模具中的另一个包括形成为柱状的第二突起，其具有大于第一突起的直径的直径，并且与第一突起的远端接触以模制孔，以便延伸穿过所述基板与所述第一突出部配合。还提供微芯片。

8. 发明申请

US20110018171A1 Injection Molding Method and Injection Molding Die 有权
标题翻译：注射成型法和注射成型模具
公开(公告)号：US20110018171A1
公开(公告)日：2011-01-27
申请号：US12933914
申请日：2009-03-19
申请人： Kanji Sekihara
发明人： Kanji Sekihara
IPC分类号： B29C45/00 , B29C45/26 , B29C45/40
CPC分类号： B29C45/40 , B29C45/2628
摘要： An injection molding method for a plate-shaped resin substrate, wherein a through-hole whose diameter gradually becomes smaller from one surface to the other surface is provided thereon and fine flow path that connects to the through-hole is provided on the other surface. A cavity is formed by joining one molding die forming one surface with the other molding die forming the other surface. A part of the one molding die that forms the through-hole includes a taper pin that protrudes from the one molding die toward the other molding die. The substrate is formed by filling the cavity with resin material, and the substrate is released from the other molding die by separating the one molding die from the other molding die. By pushing the inner wall of the through-hole with the taper pin projected further toward the other molding die, the substrate is released from the one molding die.
摘要翻译：在其上设置板状树脂基板的注射成型方法，其中从一个表面到另一个表面的直径逐渐变小的通孔，并且在另一个表面上设置有连接到通孔的细流路。通过将形成一个表面的一个成型模具与形成另一个表面的另一个模具接合而形成空腔。形成通孔的一个成型模具的一部分包括从一个成型模朝向另一个成型模具突出的锥销。基板通过用树脂材料填充空腔而形成，并且通过将一个模制模具与另一个模具模具分离而将基板从另一个模制模具释放。通过使锥形销向另一个成型模具进一步推压通孔的内壁，基板从一个模具中释放。

9. 发明授权

US07790070B2 Mold assembly for optical parts and method of setup thereof 失效
标题翻译：用于光学部件的模具组件及其设置方法
公开(公告)号：US07790070B2
公开(公告)日：2010-09-07
申请号：US12439680
申请日：2007-08-27
申请人： Kanji Sekihara , Akihiko Matsumoto , Yoshihiro Okumura
发明人： Kanji Sekihara , Akihiko Matsumoto , Yoshihiro Okumura
IPC分类号： B29C45/78
CPC分类号： B29C45/2606 , B29C45/1742
摘要： A mold assembly that is adapted to clamp fixed mold and movable mold together while making temperature adjustment and inject a molding material into a molding cavity provided therebetween, thereby producing an optical part. The mold assembly is one including fixed platen supporting fixed mold, provided on a part of its mold-side surface with locating hole and including ring of configuration with external and internal surfaces, fitted at its external surface in the locating hole, wherein the fixed mold is provided with a locating projection protruding toward the fixed platen, fitted in the internal surface of the locating hole, and wherein the ring consists of a material whose linear expansion coefficient is smaller than those of the material of the fixed platen and the material of the locating projection.
摘要翻译：一种模具组件，其适于将固定模具和可移动模具夹持在一起，同时进行温度调节并将模塑材料注入设置在其间的模腔中，从而产生光学部件。模具组件包括固定压板支撑固定模具，其模具侧表面的一部分设置有定位孔，并且具有安装在定位孔的外表面处的外表面和内表面的环形结构，其中固定模具设置有向固定台板突出的定位突起，该定位突起嵌入定位孔的内表面，并且其中环由线膨胀系数小于固定台板的材料的材料和定位投影。

10. 发明授权

US07708550B2 Cold runner injection mold having an insulated gate 有权
标题翻译：具有绝缘门的冷流道注塑模具
公开(公告)号：US07708550B2
公开(公告)日：2010-05-04
申请号：US11168632
申请日：2005-06-28
申请人： Kanji Sekihara , Atsushi Naito , Yoshihiro Okumura
发明人： Kanji Sekihara , Atsushi Naito , Yoshihiro Okumura
IPC分类号： B29C45/73
CPC分类号： B29C33/3828 , B29C33/56 , B29C45/2708
摘要： An injection mold and an injection molding apparatus having a movable mold and a fixed mold. Each of the movable/fixed molds has bases, and a runner, a gate and a cavity are formed. The gate is composed of recesses made in mutually opposite end surfaces of sleeve-like heat insulators provided for the bases. Thereby, the gate is heat-insulated, and resin in the gate is prevented from cooling down during a pressure retention step. Thus, the resin keeps fluidity longer.
摘要翻译：一种具有可移动模具和固定模具的注射模具和注射成型装置。每个可移动/固定模具具有基座，并且形成有流道，浇口和空腔。闸门由设置在底座上的套筒状绝热体的相对端面形成的凹部构成。因此，门是隔热的，并且在压力保持步骤期间防止门中的树脂冷却。因此，树脂保持流动性更长。

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