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    • 3. 发明授权
    • Differential poly doping and circuits therefrom
    • 差分多掺杂及其电路
    • US08114729B2
    • 2012-02-14
    • US11870255
    • 2007-10-10
    • Shashank EkboteKamel BenaissaGreg C. BaldwinBorna Obradovic
    • Shashank EkboteKamel BenaissaGreg C. BaldwinBorna Obradovic
    • H01L21/8238
    • G11C11/412H01L21/26513H01L21/28052H01L21/32155H01L21/823842H01L27/0922Y10S257/903
    • A method of fabricating a CMOS integrated circuit and integrated circuits therefrom includes the steps of providing a substrate having a semiconductor surface, forming a gate dielectric layer on the semiconductor surface and a polysilicon including layer on the gate dielectric. A portion of the polysilicon layer is masked, and pre-gate etch implant of a first dopant type into an unmasked portion of the polysilicon layer is performed, wherein masked portions of the polysilicon layer are protected from the first dopant. The polysilicon layer is patterned to form a plurality of polysilicon gates and a plurality of polysilicon lines, wherein the masked portion includes at least one of the polysilicon lines which couple a polysilicon gate of a PMOS device to a polysilicon gate of an NMOS device. Fabrication of the integrated circuit is then completed, wherein the integrated circuit includes at least one first region formed in the masked portion lacking the first dopant in the polysilicon gates from the pre-gate etch implant and at least one second region formed in the unmasked portion having the first dopant in the polysilicon gates from the pre-gate etch implant.
    • 一种制造CMOS集成电路的方法及其集成电路包括以下步骤:提供具有半导体表面的衬底,在半导体表面上形成栅极电介质层,以及在栅极电介质上形成多晶硅。 多晶硅层的一部分被掩蔽,并且执行第一掺杂剂类型的预栅极蚀刻注入到多晶硅层的未屏蔽部分中,其中多晶硅层的掩模部分被保护免受第一掺杂剂的影响。 多晶硅层被图案化以形成多个多晶硅栅极和多条多晶硅线,其中掩模部分包括将PMOS器件的多晶硅栅极耦合到NMOS器件的多晶硅栅极的至少一条多晶硅线路。 然后完成集成电路的制造,其中集成电路包括形成在掩模部分中的至少一个第一区域,该第一区域在预栅极蚀刻植入物的多晶硅栅极中缺少第一掺杂剂,以及形成在未掩模部分中的至少一个第二区域 在栅极蚀刻植入物的多晶硅栅极中具有第一掺杂剂。
    • 4. 发明申请
    • DIFFERENTIAL POLY DOPING AND CIRCUITS THEREFROM
    • 差分多重聚合和电路
    • US20090096031A1
    • 2009-04-16
    • US11870255
    • 2007-10-10
    • Shashank EKBOTEKamel BenaissaGreg C. BaldwinBorna Obradovic
    • Shashank EKBOTEKamel BenaissaGreg C. BaldwinBorna Obradovic
    • H01L27/11H01L21/3205
    • G11C11/412H01L21/26513H01L21/28052H01L21/32155H01L21/823842H01L27/0922Y10S257/903
    • A method of fabricating a CMOS integrated circuit and integrated circuits therefrom includes the steps of providing a substrate having a semiconductor surface, forming a gate dielectric layer on the semiconductor surface and a polysilicon including layer on the gate dielectric. A portion of the polysilicon layer is masked, and pre-gate etch implant of a first dopant type into an unmasked portion of the polysilicon layer is performed, wherein masked portions of the polysilicon layer are protected from the first dopant. The polysilicon layer is patterned to form a plurality of polysilicon gates and a plurality of polysilicon lines, wherein the masked portion includes at least one of the polysilicon lines which couple a polysilicon gate of a PMOS device to a polysilicon gate of an NMOS device. Fabrication of the integrated circuit is then completed, wherein the integrated circuit includes at least one first region formed in the masked portion lacking the first dopant in the polysilicon gates from the pre-gate etch implant and at least one second region formed in the unmasked portion having the first dopant in the polysilicon gates from the pre-gate etch implant.
    • 一种制造CMOS集成电路的方法及其集成电路包括以下步骤:提供具有半导体表面的衬底,在半导体表面上形成栅极电介质层,以及在栅极电介质上形成多晶硅。 多晶硅层的一部分被掩蔽,并且执行第一掺杂剂类型的预栅极蚀刻注入到多晶硅层的未屏蔽部分中,其中多晶硅层的掩模部分被保护免受第一掺杂剂的影响。 多晶硅层被图案化以形成多个多晶硅栅极和多条多晶硅线,其中掩模部分包括将PMOS器件的多晶硅栅极耦合到NMOS器件的多晶硅栅极的至少一条多晶硅线路。 然后完成集成电路的制造,其中集成电路包括形成在掩模部分中的至少一个第一区域,该第一区域在预栅极蚀刻植入物的多晶硅栅极中缺少第一掺杂剂,以及形成在未掩模部分中的至少一个第二区域 在栅极蚀刻植入物的多晶硅栅极中具有第一掺杂剂。
    • 9. 发明授权
    • Lateral bipolar transistor with compensated well regions
    • 具有补偿井区的侧向双极晶体管
    • US08294243B2
    • 2012-10-23
    • US12941415
    • 2010-11-08
    • Kamel Benaissa
    • Kamel Benaissa
    • H01L27/02
    • H01L29/7393H01L29/66325
    • Conduction between source and drain or emitter and collector regions is an important characteristic in transistor operation, particularly for lateral bipolar transistors. Accordingly, techniques that can facilitate control over this characteristic can mitigate yield loss by promoting the production of transistors that have an increased likelihood of exhibiting desired operational performance. As disclosed herein, well regions are established in a semiconductor substrate to facilitate, among other things, control over the conduction between the source and drain regions of a lateral bipolar transistor, thus mitigating yield loss and other associated fabrication deficiencies. Importantly, an additional mask is not required in establishing the well regions, thus further mitigating (increased) costs associated with promoting desired device performance.
    • 源极和漏极或发射极和集电极区域之间的导通是晶体管工作中的一个重要特性,特别是对于横向双极晶体管。 因此,可以促进对该特性的控制的技术可以通过促进具有展现期望的操作性能的可能性增加的晶体管的生产来减轻产量损失。 如本文所公开的,在半导体衬底中建立阱区,以便于除了别的以外,有助于控制横向双极晶体管的源极和漏极区之间的传导,从而减轻产量损失和其它相关的制造缺陷。 重要的是,在建立井区域时不需要额外的掩模,从而进一步降低(增加)与促进期望的设备性能相关的成本。
    • 10. 发明申请
    • LATERAL BIPOLAR TRANSISTOR WITH COMPENSATED WELL REGIONS
    • 具有补偿井区的侧向双极晶体管
    • US20110049678A1
    • 2011-03-03
    • US12941415
    • 2010-11-08
    • Kamel Benaissa
    • Kamel Benaissa
    • H01L29/73
    • H01L29/7393H01L29/66325
    • Conduction between source and drain or emitter and collector regions is an important characteristic in transistor operation, particularly for lateral bipolar transistors. Accordingly, techniques that can facilitate control over this characteristic can mitigate yield loss by promoting the production of transistors that have an increased likelihood of exhibiting desired operational performance. As disclosed herein, well regions are established in a semiconductor substrate to facilitate, among other things, control over the conduction between the source and drain regions of a lateral bipolar transistor, thus mitigating yield loss and other associated fabrication deficiencies. Importantly, an additional mask is not required in establishing the well regions, thus further mitigating (increased) costs associated with promoting desired device performance.
    • 源极和漏极或发射极和集电极区域之间的导通是晶体管工作中的一个重要特性,特别是对于横向双极晶体管。 因此,可以促进对该特性的控制的技术可以通过促进具有展现期望的操作性能的可能性增加的晶体管的生产来减轻产量损失。 如本文所公开的,在半导体衬底中建立阱区,以便于除了别的以外,有助于控制横向双极晶体管的源极和漏极区之间的传导,从而减轻产量损失和其它相关的制造缺陷。 重要的是,在建立井区域时不需要额外的掩模,从而进一步降低(增加)与促进期望的设备性能相关的成本。