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1. 发明授权

US08724939B2 Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits 有权
标题翻译：电子和光电集成电路之间增强的低电感互连
公开(公告)号：US08724939B2
公开(公告)日：2014-05-13
申请号：US13421833
申请日：2012-03-15
申请人： Kalpendu Shastri , Bipin Dama , Mark Webster , David Piede
发明人： Kalpendu Shastri , Bipin Dama , Mark Webster , David Piede
IPC分类号： G02B6/12 , G02F1/01 , G02F1/035
CPC分类号： H01P3/00 , G02F1/011 , G02F1/0121 , G02F1/0327 , G02F1/225 , G02F1/2255 , G02F2201/124 , G02F2201/126 , H05K1/0245 , H05K2201/09245 , H05K2201/09254 , H05K2201/10121
摘要： A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.
摘要翻译：在常规电子集成电路（IC）和光电子组件之间布置电信号的配置被形成为在相邻路径上承载相反信号的信号路径阵列，以降低与IC和IC之间的连接相关的电感光电子组件。信号路径阵列可以采取在IC和子组件之间的引线阵列的形式，形成在光电子组件上的导电迹线阵列，或两者。

2. 发明申请

US20120237160A1 Enhanced Low Inductance Interconnections Between Electronic and Opto-Electronic Integrated Circuits 有权
标题翻译：电子和光电子集成电路之间增强的低电感互连
公开(公告)号：US20120237160A1
公开(公告)日：2012-09-20
申请号：US13421833
申请日：2012-03-15
申请人： Kalpendu Shastri , Bipin Dama , Mark Webster , David Piede
发明人： Kalpendu Shastri , Bipin Dama , Mark Webster , David Piede
IPC分类号： G02B6/12
CPC分类号： H01P3/00 , G02F1/011 , G02F1/0121 , G02F1/0327 , G02F1/225 , G02F1/2255 , G02F2201/124 , G02F2201/126 , H05K1/0245 , H05K2201/09245 , H05K2201/09254 , H05K2201/10121
摘要： A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.
摘要翻译：在常规电子集成电路（IC）和光电子组件之间布置电信号的配置被形成为在相邻路径上承载相反信号的信号路径阵列，以降低与IC和IC之间的连接相关联的电感光电子组件。信号路径阵列可以采取在IC和子组件之间的引线阵列的形式，形成在光电子组件上的导电迹线阵列，或两者。

3. 发明授权

US08803269B2 Wafer scale packaging platform for transceivers 有权
标题翻译：收发器晶圆级封装平台
公开(公告)号：US08803269B2
公开(公告)日：2014-08-12
申请号：US13463408
申请日：2012-05-03
申请人： Kalpendu Shastri , Vipulkumar Patel , Mark Webster , Prakash Gothoskar , Ravinder Kachru , Soham Pathak , Rao V. Yelamarty , Thomas Daugherty , Bipin Dama , Kaushik Patel , Kishor Desai
发明人： Kalpendu Shastri , Vipulkumar Patel , Mark Webster , Prakash Gothoskar , Ravinder Kachru , Soham Pathak , Rao V. Yelamarty , Thomas Daugherty , Bipin Dama , Kaushik Patel , Kishor Desai
IPC分类号： H01L31/0232 , H01L29/40 , H01L23/053 , H01L23/12
CPC分类号： H01L25/50 , G02B6/423 , G02B6/4244 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/426 , H01L25/167 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.
摘要翻译：光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义分离光学元件之间的光信号路径。实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

4. 发明申请

US20100316391A1 Optical Interconnection Arrangement For High Speed, High Density Communication Systems 有权
标题翻译：高速，高密度通信系统的光互连布置
公开(公告)号：US20100316391A1
公开(公告)日：2010-12-16
申请号：US12796868
申请日：2010-06-09
申请人： Kalpendu Shastri , Bipin Dama , Mark Webster
发明人： Kalpendu Shastri , Bipin Dama , Mark Webster
IPC分类号： H04B10/12
CPC分类号： H04B10/801 , H04B10/505 , H04B10/516 , H04B10/524 , H04L7/0008 , H04L7/0075
摘要： An optical interconnection arrangement for use in high data applications is presented that eliminates the need for extensive serialization/de-serialization (SERDES) functionality by utilizing pulse amplitude modulation (PAM) techniques to represent the data in the optical domain while utilizing a separate channel for transmitting an optical clock signal, eliminating the need for clock recovery circuitry on the receive end of the arrangement.
摘要翻译：提出了一种用于高数据应用的光互连装置，通过利用脉冲幅度调制（PAM）技术来表示光域中的数据，消除了对广泛的串行/解序列化（SERDES）功能的需要，同时利用单独的信道发送光时钟信号，消除了对该装置接收端的时钟恢复电路的需要。

5. 发明申请

US20100316388A1 HDMI TMDS Optical Signal Transmission Using PAM Technique 有权
标题翻译：使用PAM技术的HDMI TMDS光信号传输
公开(公告)号：US20100316388A1
公开(公告)日：2010-12-16
申请号：US12813562
申请日：2010-06-11
申请人： Kalpendu Shastri , Bipin Dama , Vipulkumar Patel , Mark Webster
发明人： Kalpendu Shastri , Bipin Dama , Vipulkumar Patel , Mark Webster
IPC分类号： H04B10/00
CPC分类号： H04N7/22 , G09G5/006 , G09G2370/12 , G09G2370/18
摘要： An HDMI interconnect arrangement is presented that performs a pulse-amplitude modulation (PAM) conversion of the TMDS audio/video signals in order to simultaneously transmit all three channels over a single optical fiber. The set of three audio/video TMDS channels is applied as an input to a PAM-8 optical modulator, which functions to encode the set of three channels onto an optically-modulated output signal. The modulated optical signal is thereafter coupled into an optical fiber within an active HDMI cable and transmitted to an HDMI receiver (sink). The TMDS CLK signal is not included in this conversion into the optical domain, but remains as a separate electrical signal to be transmitted along a copper signal path within the active HDMI cable.
摘要翻译：呈现HDMI互连布置，其执行TMDS音频/视频信号的脉冲幅度调制（PAM）转换，以便通过单根光纤同时传输所有三个通道。三组音频/视频TMDS通道的组合被用作PAM-8光调制器的输入，PAM-8光调制器用于将三个通道的组合编码到光调制的输出信号上。调制的光信号此后耦合到有源HDMI电缆中的光纤中，并被传输到HDMI接收器（接收器）。 TMDS CLK信号不包含在该转换到光学域中，而是作为单独的电信号保持在有源HDMI电缆内的铜信号路径上传输。

6. 发明授权

US08364042B2 Optical interconnection arrangement for high speed, high density communication systems 有权
标题翻译：用于高速，高密度通信系统的光互连布置
公开(公告)号：US08364042B2
公开(公告)日：2013-01-29
申请号：US12796868
申请日：2010-06-09
申请人： Kalpendu Shastri , Bipin Dama , Mark Webster
发明人： Kalpendu Shastri , Bipin Dama , Mark Webster
IPC分类号： H04B10/00
CPC分类号： H04B10/801 , H04B10/505 , H04B10/516 , H04B10/524 , H04L7/0008 , H04L7/0075
摘要： An optical interconnection arrangement for use in high data applications is presented that eliminates the need for extensive serialization/de-serialization (SERDES) functionality by utilizing pulse amplitude modulation (PAM) techniques to represent the data in the optical domain while utilizing a separate channel for transmitting an optical clock signal, eliminating the need for clock recovery circuitry on the receive end of the arrangement.
摘要翻译：提出了一种用于高数据应用的光互连装置，通过利用脉冲幅度调制（PAM）技术来表示光域中的数据，消除了对广泛的串行/解序列化（SERDES）功能的需要，同时利用单独的信道发送光时钟信号，消除了对该装置接收端的时钟恢复电路的需要。

7. 发明授权

US08340529B2 HDMI TMDS optical signal transmission using PAM technique 有权
标题翻译：使用PAM技术的HDMI TMDS光信号传输
公开(公告)号：US08340529B2
公开(公告)日：2012-12-25
申请号：US12813562
申请日：2010-06-11
申请人： Kalpendu Shastri , Bipin Dama , Vipulkumar Patel , Mark Webster
发明人： Kalpendu Shastri , Bipin Dama , Vipulkumar Patel , Mark Webster
IPC分类号： H04B10/12
CPC分类号： H04N7/22 , G09G5/006 , G09G2370/12 , G09G2370/18
摘要： An HDMI interconnect arrangement is presented that performs a pulse-amplitude modulation (PAM) conversion of the TMDS audio/video signals in order to simultaneously transmit all three channels over a single optical fiber. The set of three audio/video TMDS channels is applied as an input to a PAM-8 optical modulator, which functions to encode the set of three channels onto an optically-modulated output signal. The modulated optical signal is thereafter coupled into an optical fiber within an active HDMI cable and transmitted to an HDMI receiver (sink). The TMDS CLK signal is not included in this conversion into the optical domain, but remains as a separate electrical signal to be transmitted along a copper signal path within the active HDMI cable.
摘要翻译：呈现HDMI互连布置，其执行TMDS音频/视频信号的脉冲幅度调制（PAM）转换，以便通过单根光纤同时传输所有三个通道。三组音频/视频TMDS通道的组合被用作PAM-8光调制器的输入，PAM-8光调制器用于将三个通道的组合编码到光调制的输出信号上。调制的光信号此后耦合到有源HDMI电缆中的光纤中，并被传输到HDMI接收器（接收器）。 TMDS CLK信号不包含在该转换到光学域中，而是作为单独的电信号保持在有源HDMI电缆内的铜信号路径上传输。

8. 发明申请

US20120280344A1 Wafer Scale Packaging Platform For Transceivers 有权
标题翻译：收发器晶圆尺寸封装平台
公开(公告)号：US20120280344A1
公开(公告)日：2012-11-08
申请号：US13463408
申请日：2012-05-03
申请人： Kalpendu Shastri , Vipulkumar Patel , Mark Webster , Prakash Gothoskar , Ravinder Kachru , Soham Pathak , Rao V. Yelamarty , Thomas Daugherty , Bipin Dama , Kaushik Patel , Kishor Desai
发明人： Kalpendu Shastri , Vipulkumar Patel , Mark Webster , Prakash Gothoskar , Ravinder Kachru , Soham Pathak , Rao V. Yelamarty , Thomas Daugherty , Bipin Dama , Kaushik Patel , Kishor Desai
IPC分类号： H01L31/12
CPC分类号： H01L25/50 , G02B6/423 , G02B6/4244 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/426 , H01L25/167 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.
摘要翻译：光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。特别地，硅晶片被用作平台（插入器），用于多个收发器模块的所有部件安装或集成在该平台上，硅插入器的顶表面用作用于定义光信号的参考平面分离的光学元件之间的路径。实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

9. 发明授权

US07657130B2 Silicon-based optical modulator for analog applications 有权
标题翻译：用于模拟应用的硅基光调制器
公开(公告)号：US07657130B2
公开(公告)日：2010-02-02
申请号：US12287366
申请日：2008-10-08
申请人： Kalpendu Shastri , Prakash Gothoskar , Vipulkumar Patel , David Piede , Mark Webster
发明人： Kalpendu Shastri , Prakash Gothoskar , Vipulkumar Patel , David Piede , Mark Webster
IPC分类号： G02F1/035 , G02F1/01 , G02B6/12
CPC分类号： G02F1/0121 , G02F1/2255 , G02F1/2257 , G02F2001/0152
摘要： A silicon-insulator-silicon capacitive (SISCAP) optical modulator is configured to provide analog operation for applications which previously required the use of relatively large, power-consuming and expensive lithium niobate devices. An MZI-based SISCAP modulator (preferably a balanced arrangement with a SISCAP device on each arm) is responsive to an incoming high frequency electrical signal and is biased in a region where the capacitance of the device is essentially constant and the transform function of the MZI is linear.
摘要翻译：硅 - 绝缘体 - 硅电容（SISCAP）光调制器被配置为为先前需要使用相对较大，耗电和昂贵的铌酸锂器件的应用提供模拟操作。基于MZI的SISCAP调制器（优选地，在每个臂上具有SISCAP器件的平衡布置）响应于输入的高频电信号，并且被偏置在器件的电容基本上恒定的区域中，并且MZI的变换函数是线性的

10. 发明授权

US08520984B2 Silicon-based optical modulator with improved efficiency and chirp control 有权
标题翻译：硅基光学调制器，提高效率和啁啾控制
公开(公告)号：US08520984B2
公开(公告)日：2013-08-27
申请号：US12781471
申请日：2010-05-17
申请人： Mark Webster , Russell Romano , Kalpendu Shastri
发明人： Mark Webster , Russell Romano , Kalpendu Shastri
IPC分类号： G02F1/035
CPC分类号： G02F1/2257 , G02F2203/20 , G02F2203/25
摘要： A silicon-based optical modulator exhibiting improved modulation efficiency and control of “chirp” (i.e., time-varying optical phase) is provided by separately biasing a selected, first region of the modulating device (e.g., the polysilicon region, defined as the common node). In particular, the common node is biased to shift the voltage swing of the silicon-based optical modulator into its accumulation region, which exhibits a larger change in phase as a function of applied voltage (larger OMA) and improved extinction ratio. The response in the accumulation region is also relatively linear, allowing for the chirp to be more easily controlled. The electrical modulation input signal (and its inverse) are applied as separate inputs to the second region (e.g., the SOI region) of each arm of the modulator.
摘要翻译：通过分别偏置调制装置的选定的第一区域（例如，定义为共同的多晶硅区域）来提供显示出改善的调制效率和“啁啾”（即，时变光学相位）的控制的硅基光学调制器节点）。特别地，公共节点被偏置以将硅基光调制器的电压摆幅移动到其累积区域中，其随着施加电压（较大的OMA）和改善的消光比而呈现较大的相位变化。积聚区域中的响应也是相对线性的，从而可以更容易地控制啁啾声。电调制输入信号（及其反相）作为分离的输入施加到调制器的每个臂的第二区域（例如，SOI区域）。

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