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    • 1. 发明申请
    • Anodised Aluminum, Dielectric, and Method
    • 阳极氧化铝,电介质和方法
    • US20100307800A1
    • 2010-12-09
    • US12278968
    • 2006-02-10
    • Kai Fook Francis WeeJian Hua XuJian Hong Dai
    • Kai Fook Francis WeeJian Hua XuJian Hong Dai
    • H05K1/09B32B15/04C25D11/06C25D5/50H05K1/03
    • H05K1/053C25D11/04C25D11/06H05K2203/0315
    • The invention provides an anodised aluminium product for use in a metal core printed circuit board which in which the anodised layer forms a dielectric, and the resultant metal core printed circuit board has a sandwich structure having a thermal conductivity higher than and a thermal resistance lower than conventional metal core printed circuit boards using alternative dielectric layers, and with improved electrical insulation properties. The invention has application in manufacture of rigid and flexible printed circuit boards which have a metal substrate, manufacture of a heat conductive substrate for semiconductor devices, and electronic devices. While the use of the invention is described in relation to metal core printed circuit boards, the anodising process and anodised aluminium of the invention may have other applications beyond this technology. The invention also provides a method of manufacturing such an anodised aluminium product.
    • 本发明提供一种用于金属芯印刷电路板的阳极氧化铝产品,其中阳极氧化层形成电介质,并且所得金属芯印刷电路板具有导热率高于耐热性的热导率的夹层结构 常规金属芯印刷电路板使用替代电介质层,并具有改善的电绝缘性能。 本发明可用于制造具有金属基板的刚性和柔性印刷电路板,制造用于半导体器件的导热基板和电子器件。 虽然关于金属芯印刷电路板描述了本发明的使用,但是本发明的阳极氧化处理和阳极氧化铝可以具有超出该技术的其它应用。 本发明还提供了一种制造这种阳极氧化铝产品的方法。