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    • 3. 发明授权
    • Magnetic barrier for plasma in chamber exhaust
    • 室内排气等离子体的磁屏障
    • US06863835B1
    • 2005-03-08
    • US09557990
    • 2000-04-25
    • James D. CarducciHamid NoorbakhshEvans Y. LeeHongqing ShanSiamak SalimianPaul E. LuscherMichael D. Welch
    • James D. CarducciHamid NoorbakhshEvans Y. LeeHongqing ShanSiamak SalimianPaul E. LuscherMichael D. Welch
    • H05H1/46C23C16/44C23C16/50H01J37/32H01L21/205H01L21/3065B44C1/22C23C16/00H01L21/306
    • H01J37/32834C23C16/4412H01J37/32623H01J37/3266
    • A plasma chamber apparatus and method employing a magnet system to block the plasma within the chamber interior from reaching the exhaust pump. An exhaust channel between the chamber interior and the pump includes a magnet and at least one deflector that creates turbulence in the flow of exhaust gases. The magnetic field and the turbulence produced by the deflector both increase the rate of recombination of charged particles in the gases, thereby reducing the concentration of charged particles sufficiently to quench the plasma downstream of the magnet and deflector, thereby preventing the plasma body within the chamber from reaching the exhaust pump. The plasma confinement effect of the magnetic field permits the use of a wider and/or less sinuous exhaust channel than would be required to block the plasma without the magnetic field. Therefore, the pressure drop across the exhaust channel can be reduced in comparison with prior art designs that rely entirely on the sinuousness of the exhaust channel to block the plasma. Alternatively, if the magnetic field is strong enough, the magnetic field alone can block the plasma from reaching the exhaust pump without the need for any deflector in the exhaust channel.
    • 一种等离子体室装置和方法,其采用磁体系统阻挡室内的等离子体到达排气泵。 腔室内部和泵之间的排气通道包括一个磁体和至少一个在废气流中产生湍流的偏转器。 由偏转器产生的磁场和湍流都增加了气体中带电粒子的复合速率,从而充分降低了带电粒子的浓度,使得等离子体和导流板的下游猝灭,从而防止了等离子体在腔室内 从到达排气泵。 磁场的等离子体约束效应允许使用比没有磁场阻挡等离子体所需要的更宽和/或更少的弯曲的排气通道。 因此,与完全依赖于排气通道的弯曲度以阻挡等离子体的现有技术设计相比,可以减小排气通道两侧的压降。 或者,如果磁场足够强,则单独的磁场可以阻止等离子体到达排气泵,而不需要排气通道中的任何偏转器。
    • 10. 发明授权
    • Method and apparatus for controlling a temperature of a wafer
    • 用于控制晶片温度的方法和装置
    • US06303895B1
    • 2001-10-16
    • US09588122
    • 2000-06-02
    • Anwar HusainHamid Noorbakhsh
    • Anwar HusainHamid Noorbakhsh
    • B23K1000
    • H01L21/67109
    • A method and apparatus for controlling a temperature of a wafer during processing such as in a gas plasma or nonplasma environment wherein a wafer is positioned on a chuck. The wafer is heated and a pressurized gas is introduced into a space between the wafer and the chuck such that the pressurized gas transfers heat from the wafer to the chuck. Pressure of the pressuried gas is automatically varied such that heat transfer between the wafer and the chuck is varied in response to a difference between an actual wafer temperature and a desired wafer temperature to maintain the desired wafer temperature.
    • 一种用于在处理期间控制晶片的温度的方法和装置,例如在气体等离子体或非等离子体环境中,其中晶片位于卡盘上。 晶片被加热并且加压气体被引入到晶片和卡盘之间的空间中,使得加压气体将热从晶片传递到卡盘。 加压气体的压力自动变化,使得晶片和卡盘之间的热传递响应于实际晶片温度和期望晶片温度之间的差异而变化,以保持期望的晶片温度。