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    • 1. 发明授权
    • Non-volatile memory device with protruding charge storage layer and method of fabricating the same
    • 具有突出电荷存储层的非易失性存储器件及其制造方法
    • US07081651B2
    • 2006-07-25
    • US10186153
    • 2002-06-27
    • Jung-Dal ChoiJong-Woo ParkSeong-Soon ChoChang-Hyun Lee
    • Jung-Dal ChoiJong-Woo ParkSeong-Soon ChoChang-Hyun Lee
    • H01L29/792
    • H01L27/11568H01L27/105H01L27/11573
    • A non-volatile memory device includes a tunnel oxide layer, a charge storage layer, a blocking insulating layer, and a gate electrode that are sequentially stacked, as well as an impurity diffusion layer in an active region at both sides of the gate electrode. The gate electrode crosses active regions between device isolation layers formed in a predetermined area of a semiconductor substrate, and an edge of the charge storage layer is extended to have a protruding part that protrudes from the gate electrode. In order to form a charge storage layer having a protruding part, a stack insulating layer including first to third insulating layers is formed in an active region between the device isolation layers formed in the substrate. A plurality of gate electrodes crossing the active region are formed on the stack insulating layer, and a sidewall spacer is formed on both sidewalls of the gate electrode. Using the sidewall spacer and the gate electrode, the stack insulating layer is etched to form a charge storage layer that protrudes from the sidewall of the gate electrode.
    • 非易失性存储器件包括顺序层叠的隧道氧化物层,电荷存储层,阻挡绝缘层和栅电极,以及栅电极两侧的有源区中的杂质扩散层。 栅电极跨越形成在半导体衬底的预定区域中的器件隔离层之间的有源区,并且电荷存储层的边缘延伸成具有从栅电极突出的突出部分。 为了形成具有突出部分的电荷存储层,在形成在衬底中的器件隔离层之间的有源区域中形成包括第一至第三绝缘层的叠层绝缘层。 在堆叠绝缘层上形成与激活区交叉的多个栅电极,并且在栅电极的两个侧壁上形成侧墙。 使用侧壁间隔物和栅电极,对叠层绝缘层进行蚀刻以形成从栅电极的侧壁突出的电荷存储层。
    • 2. 发明授权
    • Nonvolatile memory devices
    • 非易失性存储器件
    • US08629489B2
    • 2014-01-14
    • US13357350
    • 2012-01-24
    • Chang-Hyun LeeJung-Dal Choi
    • Chang-Hyun LeeJung-Dal Choi
    • H01L29/76
    • H01L27/1052G11C16/0483H01L27/11521H01L27/11524
    • A nonvolatile memory device includes a string selection transistor, a plurality of memory cell transistors, and a ground selection transistor electrically connected in series to the string selection transistor and to the pluralities of memory cell transistors. First impurity layers are formed at boundaries of the channels and the source/drain regions of the memory cell transistors. The first impurity layers are doped with opposite conductivity type impurities relative to the source/drain regions of the memory cell transistors. Second impurity layers are formed at boundaries between a channel and a drain region of the string selection transistor and between a channel and a source region of the ground selection transistor. The second impurity layers are doped with the same conductivity type impurities as the first impurity layers and have a higher impurity concentration than the first impurity layers.
    • 非易失性存储器件包括串选择晶体管,多个存储单元晶体管和与串选择晶体管和多个存储单元晶体管串联电连接的接地选择晶体管。 在存储单元晶体管的沟道和源极/漏极区的边界处形成第一杂质层。 相对于存储单元晶体管的源/漏区,第一杂质层掺杂有相反导电类型的杂质。 第二杂质层形成在串选择晶体管的沟道和漏极区之间的边界处,并且在地选择晶体管的沟道和源极区之间形成。 第二杂质层掺杂有与第一杂质层相同的导电类型杂质,并且具有比第一杂质层更高的杂质浓度。
    • 4. 发明授权
    • Nonvolatile memory devices and methods of operating same to inhibit parasitic charge accumulation therein
    • 非易失性存储器件及其操作方法,以抑制其中的寄生电荷积聚
    • US07864582B2
    • 2011-01-04
    • US12191434
    • 2008-08-14
    • Chang-Hyun LeeJung-Dal ChoiYoung-Ho LimKang-Deog Suh
    • Chang-Hyun LeeJung-Dal ChoiYoung-Ho LimKang-Deog Suh
    • G11C16/06
    • G11C16/0483G11C16/16
    • Methods of operating a charge trap nonvolatile memory device include operations to erase a first string of nonvolatile memory cells by selectively erasing a first plurality of nonvolatile memory cells in the first string and then selectively erasing a second plurality of nonvolatile memory cells in the first string, which may be interleaved with the first plurality of nonvolatile memory cells. This operation to selectively erase the first plurality of nonvolatile memory cells may include erasing the first plurality of nonvolatile memory cells while simultaneously biasing the second plurality of nonvolatile memory cells in a blocking condition that inhibits erasure of the second plurality of nonvolatile memory cells. The operation to selectively erase the second plurality of nonvolatile memory cells may include erasing the second plurality of nonvolatile memory cells while simultaneously biasing the first plurality of nonvolatile memory cells in a blocking condition that inhibits erasure of the first plurality of nonvolatile memory cells.
    • 操作电荷阱非易失性存储装置的方法包括通过选择性地擦除第一串中的第一多个非易失性存储单元,然后选择性地擦除第一串中的第二多个非易失性存储单元来擦除第一串非易失性存储单元的操作, 其可以与第一多个非易失性存储器单元交错。 选择性地擦除第一多个非易失性存储单元的操作可以包括擦除第一多个非易失性存储单元,同时在禁止擦除第二多个非易失性存储单元的阻塞条件下同时偏置第二多个非易失性存储单元。 选择性地擦除第二多个非易失性存储单元的操作可以包括擦除第二多个非易失性存储单元,同时在禁止擦除第一多个非易失性存储单元的阻塞条件下同时偏置第一多个非易失性存储单元。
    • 5. 发明申请
    • Memory device and method of fabricating the same
    • 存储器件及其制造方法
    • US20100327371A1
    • 2010-12-30
    • US12805962
    • 2010-08-26
    • Chang-Hyun LeeJung-dal Choi
    • Chang-Hyun LeeJung-dal Choi
    • H01L27/088H01L21/8239
    • H01L27/115G11C16/0483H01L27/11521H01L27/11524H01L27/11568
    • A nonvolatile memory including a plurality of memory transistors in series, wherein source/drain and channel regions therebetween are of a first type and a select transistor, at each end of the plurality of memory transistors in series, wherein channels regions of each of the select transistors is of the first type. The first type may be n-type or p-type. The nonvolatile memory may further include a first dummy select transistor at one end of the plurality of memory transistors in series between one of the select transistors and the plurality of memory transistors in series and a second dummy select transistor at the other end of the plurality of memory transistors in series between the other select transistor and the plurality of memory transistors in series.
    • 一种非易失性存储器,包括串联的多个存储晶体管,其中在其间的源极/漏极和沟道区域是第一类型和选择晶体管,在多个存储晶体管的每个端部串联,其中每个选择的沟道区域 晶体管是第一类型。 第一种类型可以是n型或p型。 非易失性存储器还可以包括串联在选择晶体管之一和串联的多个存储晶体管之间的多个存储晶体管的一端的第一虚拟选择晶体管,以及多个存储晶体管的另一端的第二虚拟选择晶体管 串联在另一个选择晶体管和多个存储晶体管之间的存储晶体管。
    • 9. 发明申请
    • Nonvolatile Memory Devices Including a Resistor Region
    • 包括电阻器区域的非易失性存储器件
    • US20080246073A1
    • 2008-10-09
    • US12138712
    • 2008-06-13
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • H01L29/00
    • H01L27/105B82Y10/00H01L21/823462H01L27/0629H01L27/11526H01L27/11546H01L27/11568
    • Methods of forming a memory device include forming a device isolation layer in a semiconductor substrate including a cell array region and a resistor region, the device isolation layer extending into the resistor region and defining an active region in the semiconductor substrate. A first conductive layer is formed on the device isolation layer in the resistor region. The semiconductor substrate is exposed in the cell array region. A cell insulation layer is formed on a portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. A second conductive layer is formed on the cell insulation layer in the portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. The second conductive layer is etched to form a cell gate electrode in the cell array region and to concurrently remove the second conductive layer from the resistor region and the first conductive layer is etched in the resistor region to form a resistor.
    • 形成存储器件的方法包括在包括单元阵列区域和电阻器区域的半导体衬底中形成器件隔离层,器件隔离层延伸到电阻器区域中并在半导体衬底中限定有源区域。 在电阻器区域中的器件隔离层上形成第一导电层。 半导体衬底暴露在电池阵列区域中。 电池绝缘层形成在包括电阻器区域中的暴露的电池阵列区域,有源区域和器件隔离层的半导体衬底的一部分上。 在半导体衬底的包括电阻器区域中的暴露的电池阵列区域,有源区域和器件隔离层的部分中的单元绝缘层上形成第二导电层。 蚀刻第二导电层以在电池阵列区域中形成电池栅电极,并且同时从电阻器区域去除第二导电层,并且在电阻器区域中蚀刻第一导电层以形成电阻器。