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1. 发明授权

US07915071B2 Method for chemical mechanical planarization of chalcogenide materials 有权
标题翻译：硫族化物材料的化学机械平面化方法
公开(公告)号：US07915071B2
公开(公告)日：2011-03-29
申请号：US12193303
申请日：2008-08-18
申请人： Junaid Ahmed Siddiqui , Saifi Usmani
发明人： Junaid Ahmed Siddiqui , Saifi Usmani
IPC分类号： H01L21/00
CPC分类号： C09G1/02 , C09K3/1436 , C09K3/1463 , H01L45/06 , H01L45/144 , H01L45/1683
摘要： A method and associated composition for chemical mechanical planarization of a chalcogenide-containing substrate (e.g., germanium/antimony/tellurium (GST)-containing substrate) are described. The composition and method afford low defect levels (e.g., scratches incurred during polishing) as well as low dishing and local erosion levels on the chalcogenide-containing substrate during CMP processing.
摘要翻译：描述了含硫族化物的衬底（例如，含锗/锑（碲（GST））衬底的化学机械平面化的方法和相关组合物）。组合物和方法在CMP处理期间提供低缺陷水平（例如抛光期间产生的划痕）以及含硫属化物的衬底的低凹陷和局部侵蚀水平。

2. 发明申请

US20090057661A1 Method for Chemical Mechanical Planarization of Chalcogenide Materials 有权
标题翻译：硫族化物材料化学机械平面化方法
公开(公告)号：US20090057661A1
公开(公告)日：2009-03-05
申请号：US12193303
申请日：2008-08-18
申请人： Junaid Ahmed Siddiqui , Saifi Usmani
发明人： Junaid Ahmed Siddiqui , Saifi Usmani
IPC分类号： H01L21/306 , H01L29/12
CPC分类号： C09G1/02 , C09K3/1436 , C09K3/1463 , H01L45/06 , H01L45/144 , H01L45/1683
摘要： A method and associated composition for chemical mechanical planarization of a chalcogenide-containing substrate (e.g., germanium/antimony/tellurium (GST)-containing substrate) are described. The composition and method afford low defect levels (e.g., scratches incurred during polishing) as well as low dishing and local erosion levels on the chalcogenide-containing substrate during CMP processing.
摘要翻译：描述了含硫族化物的衬底（例如，含锗/锑（碲（GST））衬底的化学机械平面化的方法和相关组合物）。组合物和方法在CMP处理期间提供低缺陷水平（例如抛光期间产生的划痕）以及含硫属化物的衬底的低凹陷和局部侵蚀水平。

3. 发明申请

US20110165777A1 Method and Slurry for Tuning Low-K Versus Copper Removal Rates During Chemical Mechanical Polishing 审中-公开
标题翻译：化学机械抛光过程中调低低K对铜去除率的方法和浆料
公开(公告)号：US20110165777A1
公开(公告)日：2011-07-07
申请号：US13052457
申请日：2011-03-21
申请人： Junaid Ahmed Siddiqui , Rachel Dianne McConnell , Saifi Usmani
发明人： Junaid Ahmed Siddiqui , Rachel Dianne McConnell , Saifi Usmani
IPC分类号： H01L21/304 , C09K13/00
CPC分类号： H01L21/3212 , C09G1/02 , H01L21/31053
摘要： A composition and associated method for the chemical mechanical planarization (CMP) of metal substrates on semiconductor wafers are described. The composition contains a nonionic fluorocarbon surfactant and a per-type oxidizer (e.g., hydrogen peroxide). The composition and associated method are effective in controlling removal rates of low-k films during copper CMP and provide for tune-ability in removal rates of low-k films in relation to removal rates of copper, tantalum, and oxide films.
摘要翻译：描述了用于半导体晶片上的金属衬底的化学机械平坦化（CMP）的组合物和相关方法。该组合物含有非离子型氟碳表面活性剂和每种类型的氧化剂（例如过氧化氢）。该组合物和相关方法在控制铜CMP期间低k膜的去除速率方面是有效的，并且提供了关于铜，钽和氧化物膜去除率的低k膜去除率的调谐能力。

4. 发明申请

US20080149884A1 Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing 审中-公开
标题翻译：在化学机械抛光过程中调节低k对铜去除率的方法和浆料
公开(公告)号：US20080149884A1
公开(公告)日：2008-06-26
申请号：US11643519
申请日：2006-12-21
申请人： Junaid Ahmed Siddiqui , Rachel Dianne McConnell , Saifi Usmani
发明人： Junaid Ahmed Siddiqui , Rachel Dianne McConnell , Saifi Usmani
IPC分类号： C09K13/00 , B24B1/00 , H01L21/00
CPC分类号： H01L21/3212 , C09G1/02 , H01L21/31053
摘要： A composition and associated method for the chemical mechanical planarization (CMP) of metal substrates on semiconductor wafers are described. The composition contains a nonionic fluorocarbon surfactant and a per-type oxidizer (e.g., hydrogen peroxide). The composition and associated method are effective in controlling removal rates of low-k films during copper CMP and provide for tune-ability in removal rates of low-k films in relation to removal rates of copper, tantalum, and oxide films.
摘要翻译：描述了用于半导体晶片上的金属衬底的化学机械平坦化（CMP）的组合物和相关方法。该组合物含有非离子型氟碳表面活性剂和每种类型的氧化剂（例如过氧化氢）。该组合物和相关方法在控制铜CMP期间低k膜的去除速率方面是有效的，并且提供了关于铜，钽和氧化物膜去除率的低k膜去除率的调谐能力。

5. 发明申请

US20080148652A1 Compositions for chemical mechanical planarization of copper 审中-公开
标题翻译：铜化学机械平面化的组成
公开(公告)号：US20080148652A1
公开(公告)日：2008-06-26
申请号：US11643309
申请日：2006-12-21
申请人： Junaid Ahmed Siddiqui , Rachel Dianne McConnell , Saifi Usmani
发明人： Junaid Ahmed Siddiqui , Rachel Dianne McConnell , Saifi Usmani
IPC分类号： B24B1/00 , C09C1/68
CPC分类号： C09G1/02 , C09K3/1463 , H01L21/3212
摘要： A composition and associated method for chemical mechanical planarization of a copper-containing substrate are described and which afford low defectivity levels on copper during copper CMP processing. The composition comprises a colloidal silica that is substantially free of soluble polymeric silicates.
摘要翻译：描述了一种用于含铜衬底的化学机械平面化的组合物和相关方法，并且在铜CMP处理期间在铜上提供低的缺陷水平。该组合物包含基本上不含可溶性聚合物硅酸盐的胶体二氧化硅。

6. 发明授权

US08722569B2 Peroxide decomposition catalyst particles 有权
标题翻译：过氧化物分解催化剂颗粒
公开(公告)号：US08722569B2
公开(公告)日：2014-05-13
申请号：US11712026
申请日：2007-02-28
申请人： Junaid Ahmed Siddiqui , Kimberly Gheysen Raiford
发明人： Junaid Ahmed Siddiqui , Kimberly Gheysen Raiford
IPC分类号： B01J23/10 , B01J23/46 , H01M4/36
CPC分类号： H01M8/1004 , H01M4/8828 , H01M8/1023 , H01M8/1039 , H01M8/1051 , H01M2008/1095 , H01M2300/0082
摘要： A catalytically active component is provided which comprises particles containing a metal oxide such as silica, metal or metalloid ions such as ions that include boron, and a catalyst. When introduced into the membrane electrode assembly of a fuel cell, the particles increase peroxide radical resistance in a membrane electrode.
摘要翻译：提供了一种催化活性组分，其包含含有金属氧化物如二氧化硅，金属或准金属离子（如包括硼的离子）和催化剂的颗粒。当引入燃料电池的膜电极组件时，颗粒增加膜电极中的过氧化物自由基电阻。

7. 发明授权

US07429338B2 Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization 失效
标题翻译：表面改性胶体研磨剂，包括用于化学机械平面化的稳定的双金属表面涂层硅溶胶
公开(公告)号：US07429338B2
公开(公告)日：2008-09-30
申请号：US11487443
申请日：2006-07-17
申请人： Junaid Ahmed Siddiqui
发明人： Junaid Ahmed Siddiqui
IPC分类号： B44C1/22
CPC分类号： B24B37/044 , C09G1/02 , C09K3/1409 , C09K3/1463 , C23F3/04 , H01L21/3212
摘要： A composition and an associated method for chemical mechanical planarization (or other polishing) are described. The composition includes a surface-modified abrasive modified with at least one stabilizer and at least one catalyst differing from the at least one stabilizer. The composition can further include a medium containing the abrasive and an oxidizing agent (e.g., hydrogen peroxide), wherein the at least one catalyst is adapted to catalyze oxidation of a substrate by the oxidizing agent. Preferably, the abrasive is alumina, titania, zirconia, germania, silica, ceria and/or mixtures thereof, the stabilizer is B, W and/or Al, and the catalyst is Cu, Fe, Mn, Ti, W and/or V. Both the stabilizer and the catalyst are immobilized on the abrasive surface. The method includes applying the composition to a substrate to be polished, such as substrates containing W, Cu and/or dielectrics.
摘要翻译：描述了用于化学机械平面化（或其它抛光）的组合物和相关方法。该组合物包括用至少一种稳定剂和至少一种不同于至少一种稳定剂的催化剂改性的表面改性磨料。组合物还可以包括含有研磨剂和氧化剂（例如过氧化氢）的介质，其中所述至少一种催化剂适于催化由氧化剂氧化底物。优选地，研磨剂是氧化铝，二氧化钛，氧化锆，氧化锗，二氧化硅，二氧化铈和/或其混合物，稳定剂是B，W和/或Al，催化剂是Cu，Fe，Mn，Ti，W和/或V 稳定剂和催化剂都固定在磨料表面上。该方法包括将组合物施加到待抛光的基底，例如含有W，Cu和/或电介质的基底。

8. 发明申请

US20070213209A1 Peroxide decomposition catalyst particles 有权
标题翻译：过氧化物分解催化剂颗粒
公开(公告)号：US20070213209A1
公开(公告)日：2007-09-13
申请号：US11712026
申请日：2007-02-28
申请人： Junaid Ahmed Siddiqui , Kimberly Gheysen Raiford
发明人： Junaid Ahmed Siddiqui , Kimberly Gheysen Raiford
IPC分类号： B01J23/10 , B01J23/46
CPC分类号： H01M8/1004 , H01M4/8828 , H01M8/1023 , H01M8/1039 , H01M8/1051 , H01M2008/1095 , H01M2300/0082
摘要： A catalytically active component is provided which comprises particles containing a metal oxide such as silica, metal or metalloid ions such as ions that include boron, and a catalyst. When introduced into the membrane electrode assembly of a fuel cell, the particles increase peroxide radical resistance in a membrane electrode.
摘要翻译：提供了一种催化活性组分，其包含含有金属氧化物如二氧化硅，金属或准金属离子（如包括硼的离子）和催化剂的颗粒。当引入燃料电池的膜电极组件时，颗粒增加膜电极中的过氧化物自由基电阻。

9. 发明授权

US07247179B2 Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal 有权
标题翻译：用于金属去除的高选择性的化学机械平面化的组成和相关方法
公开(公告)号：US07247179B2
公开(公告)日：2007-07-24
申请号：US10914113
申请日：2004-08-09
申请人： Junaid Ahmed Siddiqui , Timothy Frederick Compton
发明人： Junaid Ahmed Siddiqui , Timothy Frederick Compton
IPC分类号： C09G1/02 , C09G1/04
CPC分类号： H01L21/3212 , C09K3/1409 , C09K3/1463 , Y10T428/259
摘要： A composition and associated methods for chemical mechanical planarization (or other polishing) are described. The composition may comprise an abrasive and a dispersed hybrid organic/inorganic particle. The composition may further comprise an alkyne compound. Two different methods for chemical mechanical planarization are disclosed. In one method (Method A), the CMP slurry composition employed in the method comprises comprise an abrasive and a dispersed hybrid organic/inorganic particle. In another method (Method B), the CMP slurry composition employed in the method comprises comprise an abrasive and an alkyne compound. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated methods (A and B) for metal CMP applications (e.g., tungsten CMP).
摘要翻译：描述了用于化学机械平面化（或其它抛光）的组合物和相关方法。组合物可以包含研磨剂和分散的杂化有机/无机颗粒。组合物还可以包含炔化合物。公开了用于化学机械平面化的两种不同的方法。在一种方法（方法A）中，该方法中使用的CMP浆料组合物包括研磨剂和分散的杂化有机/无机颗粒。在另一种方法（方法B）中，该方法中使用的CMP浆料组合物包括研磨剂和炔化合物。组合物还可以包含氧化剂，在这种情况下，组合物特别适用于金属CMP应用（例如，钨CMP）的相关方法（A和B）。

10. 发明授权

US6117532A Interdraw pretreatment for polyester film 失效
标题翻译：涤纶膜预处理
公开(公告)号：US6117532A
公开(公告)日：2000-09-12
申请号：US960651
申请日：1997-10-30
申请人： Junaid Ahmed Siddiqui , Cornell Chappell, Jr
发明人： Junaid Ahmed Siddiqui , Cornell Chappell, Jr
IPC分类号： C08J7/04 , C09D167/02 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/36
CPC分类号： C08J7/047 , C09D167/02 , C08J2367/02 , C08J2467/00 , Y10S428/91 , Y10T428/24959 , Y10T428/24967 , Y10T428/24975 , Y10T428/265 , Y10T428/269 , Y10T428/2843 , Y10T428/2852
摘要： An oriented polyester film coated on at least one surface with a coating that improves its adhesion to gelatin is disclosed. The dry coating contains one or more sulfopolyesters; one or more tetrablock copolymer resins; and one or more non-volatile polyamines. Other ingredients, such as particulate materials and surfactants, may be present in the coating. The coating is preferably applied at the interdraw stage.
摘要翻译：公开了一种涂覆在具有改善其对明胶的粘合性的涂层的至少一个表面上的取向聚酯膜。干涂层含有一种或多种磺基多酯; 一种或多种四嵌段共聚物树脂; 和一种或多种不挥发性多胺。其他成分，如颗粒材料和表面活性剂，可能存在于涂层中。涂层优选在交织阶段施加。

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