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    • 3. 发明申请
    • Apparatus for the generation and supply of fluorine gas
    • 用于生产和供应氟气的设备
    • US20050161321A1
    • 2005-07-28
    • US10500406
    • 2002-12-20
    • Colin KennedyTakako KimuraMinoru InoJun Sonobe
    • Colin KennedyTakako KimuraMinoru InoJun Sonobe
    • B01J4/00C23C16/44C25B1/24C25B15/00C25B15/02H01L21/02H01L21/302
    • C25B15/00C23C16/4405C25B1/245
    • To provide an apparatus for fluorine gas generation and supply that is disposed in the gas supply system of a semiconductor processing system and that in the event of abnormalities in the apparatus enables back up by a safe and inexpensive structure. An apparatus 30 for the generation and supply of gas is disposed in the gas supply system of a semiconductor processing system. This apparatus 30 contains an electrolytic cell 34 that generates fluorine gas and a cylinder 62 that holds a substitute gas selected from the group consisting of nitrogen fluoride, sulfur fluoride, and chlorine fluoride. The electrolytic cell 34 and cylinder 62 are connected to a gas switching section 56 that selectively supplies a gas utilization section with fluorine gas from the electrolytic cell 34 or with substitute gas from the cylinder 62. A controller 40 controls the gas switching section 56 in such a manner that, upon detection of an abnormal state at the electrolytic cell 34 by an electrolytic cell detector 36, substitute gas is supplied from the cylinder 62 to the gas utilization section.
    • 为了提供一种设置在半导体处理系统的气体供给系统中的氟气生成和供给装置,并且在设备的异常情况下可以通过安全且廉价的结构进行备份。 在半导体处理系统的气体供给系统中设置有用于产生和供应气体的装置30。 该装置30包含产生氟气的电解槽34和保持选自氮氟化物,氟化硫和氯氟化物的替代气体的气缸62。 电解槽34和气缸62连接到气体切换部分56,气体切换部分56选择性地向气体利用部分供应来自电解槽34的氟气或来自气缸62的替代气体。 控制器40以这样一种方式控制气体切换部分56,当电解槽检测器36检测到电解槽34处的异常状态时,替代气体从气缸62供应到气体利用部分。
    • 6. 发明申请
    • METHOD OF CLEANING FILM FORMING APPARATUS AND FILM FORMING APPARATUS
    • 清洗成膜装置和薄膜成膜装置的方法
    • US20100012153A1
    • 2010-01-21
    • US12374364
    • 2007-07-26
    • Takamitsu ShigemotoJun Sonobe
    • Takamitsu ShigemotoJun Sonobe
    • B08B9/00C23C16/00
    • C23C16/4405C23C16/34
    • To provide a method of cleaning a film forming apparatus capable of uniformly removing a deposit containing tantalum nitride, titanium nitride, tantalum, or titanium adhering to a wall of a processing chamber of the film forming apparatus at a high etching rate without use of plasma. A method of cleaning a film forming apparatus for removing a deposit containing tantalum nitride, titanium nitride, tantalum, or titanium deposited on a processing chamber of the film forming apparatus after it is used for forming a thin film made of tantalum nitride, titanium nitride, tantalum, or titanium, the cleaning method comprising: a step of supplying process gas containing fluorine gas into the processing chamber of the film forming apparatus; and a step of heating the processing chamber.
    • 提供一种能够在不使用等离子体的情况下以高蚀刻速率均匀地除去附着在成膜装置的处理室的壁上的含有氮化钽,氮化钛,钽或钛的沉积物的清洗成膜装置的方法。 一种清洗成膜装置的方法,该成膜装置用于除去沉积在成膜装置的处理室上的含有氮化钽,氮化钛,钽或钛的沉积物,用于形成由氮化钽,氮化钛, 钽或钛,所述清洗方法包括:将含有氟气的处理气体供给到所述成膜设备的处理室中的步骤; 以及加热处理室的步骤。