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    • 3. 发明申请
    • METHOD OF CLEANING FILM FORMING APPARATUS AND FILM FORMING APPARATUS
    • 清洗成膜装置和薄膜成膜装置的方法
    • US20100012153A1
    • 2010-01-21
    • US12374364
    • 2007-07-26
    • Takamitsu ShigemotoJun Sonobe
    • Takamitsu ShigemotoJun Sonobe
    • B08B9/00C23C16/00
    • C23C16/4405C23C16/34
    • To provide a method of cleaning a film forming apparatus capable of uniformly removing a deposit containing tantalum nitride, titanium nitride, tantalum, or titanium adhering to a wall of a processing chamber of the film forming apparatus at a high etching rate without use of plasma. A method of cleaning a film forming apparatus for removing a deposit containing tantalum nitride, titanium nitride, tantalum, or titanium deposited on a processing chamber of the film forming apparatus after it is used for forming a thin film made of tantalum nitride, titanium nitride, tantalum, or titanium, the cleaning method comprising: a step of supplying process gas containing fluorine gas into the processing chamber of the film forming apparatus; and a step of heating the processing chamber.
    • 提供一种能够在不使用等离子体的情况下以高蚀刻速率均匀地除去附着在成膜装置的处理室的壁上的含有氮化钽,氮化钛,钽或钛的沉积物的清洗成膜装置的方法。 一种清洗成膜装置的方法,该成膜装置用于除去沉积在成膜装置的处理室上的含有氮化钽,氮化钛,钽或钛的沉积物,用于形成由氮化钽,氮化钛, 钽或钛,所述清洗方法包括:将含有氟气的处理气体供给到所述成膜设备的处理室中的步骤; 以及加热处理室的步骤。