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1. 发明授权

US08344519B2 Stacked-die package for battery power management 有权
标题翻译：堆叠式封装，用于电池电源管理
公开(公告)号：US08344519B2
公开(公告)日：2013-01-01
申请号：US13089065
申请日：2011-04-18
申请人： Jun Lu , Allen Chang , Xiaotian Zhang
发明人： Jun Lu , Allen Chang , Xiaotian Zhang
IPC分类号： H01L23/48
CPC分类号： H01L21/823487 , H01L23/4952 , H01L23/49524 , H01L23/49531 , H01L23/49562 , H01L23/49575 , H01L23/58 , H01L24/37 , H01L24/39 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/91 , H01L25/071 , H01L25/074 , H01L25/18 , H01L27/088 , H01L2224/05552 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/37124 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49112 , H01L2224/4917 , H01L2224/49171 , H01L2224/49431 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/85 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H02J7/0031 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A battery protection package assembly is disclosed. The assembly includes a power control integrated circuit (IC) with pins for a supply voltage input (VCC) and a ground (VSS) on a first side of the power control IC. First and second common-drain metal oxide semiconductor field effect transistors (MOSFETs) are electrically coupled to the power control IC. The power control IC and the first and second common-drain metal oxide semiconductor field effect transistors (MOSFET) are co-packaged on a common die pad. The power control IC is vertically stacked on top of one or more of the first and second common-drain MOSFETs. Leads coupled to a supply voltage input (VCC) and a ground (VSS) of the power control IC are on a first side of the common die pad.
摘要翻译：公开了一种电池保护封装组件。该组件包括功率控制集成电路（IC），其具有用于功率控制IC的第一侧上的电源电压输入（VCC）和接地（VSS）的引脚。第一和第二共漏极金属氧化物半导体场效应晶体管（MOSFET）电耦合到功率控制IC。功率控制IC和第一和第二共漏极金属氧化物半导体场效应晶体管（MOSFET）共同封装在公共管芯焊盘上。功率控制IC垂直堆叠在第一和第二共漏极MOSFET中的一个或多个的顶部上。耦合到功率控制IC的电源电压输入（VCC）和接地（VSS）的引线位于公共管芯焊盘的第一侧上。

2. 发明授权

US08049315B2 Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package 有权
标题翻译：在半导体器件中使用离散导电层来重新布线用于半导体器件封装的接合线
公开(公告)号：US08049315B2
公开(公告)日：2011-11-01
申请号：US13007279
申请日：2011-01-14
申请人： Jun Lu , Anup Bhalla , Xiaobin Wang , Allen Chang , Kenny Man Sheng Hu , Xiaotian Zhang
发明人： Jun Lu , Anup Bhalla , Xiaobin Wang , Allen Chang , Kenny Man Sheng Hu , Xiaotian Zhang
IPC分类号： H01L23/495
CPC分类号： H01L21/823487 , H01L23/4952 , H01L23/49524 , H01L23/49531 , H01L23/49562 , H01L23/49575 , H01L23/58 , H01L24/37 , H01L24/39 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/91 , H01L25/071 , H01L25/074 , H01L25/18 , H01L27/088 , H01L2224/05552 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/37124 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49112 , H01L2224/4917 , H01L2224/49171 , H01L2224/49431 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/85 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H02J7/0031 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor package assembly may include a lead frame having a die bonding pad and plurality of leads coupled to the first die bonding pad. A vertical semiconductor device may be bonded to the die bonding pad. The device may have a conductive pad electrically connected to one lead through a first bond wire. An electrically isolated conductive trace may be formed from a layer of conductive material of the first semiconductor device. The conductive trace provides an electrically conductive path between the first bond wire and a second bond wire. The conductive path may either pass underneath a third bond wire thereby avoiding the third bond wire crossing another bond wire, or the conductive path may result in a reduced length for the first and second bond wires that is less than a predetermined maximum length.
摘要翻译：半导体封装组件可以包括引线框架，其具有管芯接合焊盘和耦合到第一管芯接合焊盘的多个引线。垂直半导体器件可以结合到芯片焊盘。该器件可以具有通过第一接合线电连接到一个引线的导电焊盘。电绝缘的导电迹线可以由第一半导体器件的导电材料层形成。导电迹线在第一接合线和第二接合线之间提供导电路径。导电路径可以通过第三接合线下方，从而避免第三接合线穿过另一接合线，或者导电路径可导致第一和第二接合线的长度小于预定最大长度。

3. 发明申请

US20110108998A1 USE OF DISCRETE CONDUCTIVE LAYER IN SEMICONDUCTOR DEVICE TO RE-ROUTE BONDING WIRES FOR SEMICONDUCTOR DEVICE PACKAGE 有权
标题翻译：在半导体器件中使用分离导电层以重新布线用于半导体器件封装
公开(公告)号：US20110108998A1
公开(公告)日：2011-05-12
申请号：US13007279
申请日：2011-01-14
申请人： Jun Lu , Anup Bhalla , Xiaobin Wang , Allen Chang , Man Sheng Hu , Xiaotian Zhang
发明人： Jun Lu , Anup Bhalla , Xiaobin Wang , Allen Chang , Man Sheng Hu , Xiaotian Zhang
IPC分类号： H01L23/52
CPC分类号： H01L21/823487 , H01L23/4952 , H01L23/49524 , H01L23/49531 , H01L23/49562 , H01L23/49575 , H01L23/58 , H01L24/37 , H01L24/39 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/91 , H01L25/071 , H01L25/074 , H01L25/18 , H01L27/088 , H01L2224/05552 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/37124 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49112 , H01L2224/4917 , H01L2224/49171 , H01L2224/49431 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/85 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H02J7/0031 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor package assembly may include a lead frame having a die bonding pad and plurality of leads coupled to the first die bonding pad. A vertical semiconductor device may be bonded to the die bonding pad. The device may have a conductive pad electrically connected to one lead through a first bond wire. An electrically isolated conductive trace may be formed from a layer of conductive material of the first semiconductor device. The conductive trace provides an electrically conductive path between the first bond wire and a second bond wire. The conductive path may either pass underneath a third bond wire thereby avoiding the third bond wire crossing another bond wire, or the conductive path may result in a reduced length for the first and second bond wires that is less than a predetermined maximum length.
摘要翻译：半导体封装组件可以包括引线框架，其具有管芯接合焊盘和耦合到第一管芯接合焊盘的多个引线。垂直半导体器件可以结合到芯片焊盘。该器件可以具有通过第一接合线电连接到一个引线的导电焊盘。电绝缘的导电迹线可以由第一半导体器件的导电材料层形成。导电迹线在第一接合线和第二接合线之间提供导电路径。导电路径可以通过第三接合线下方，从而避免第三接合线穿过另一接合线，或者导电路径可导致第一和第二接合线的长度小于预定最大长度。

4. 发明申请

US20110278709A1 STACKED-DIE PACKAGE FOR BATTERY POWER MANAGEMENT 有权
标题翻译：电池电源管理的堆叠式封装
公开(公告)号：US20110278709A1
公开(公告)日：2011-11-17
申请号：US13089065
申请日：2011-04-18
申请人： Jun Lu , Allen Chang , Xiaotian Zhang
发明人： Jun Lu , Allen Chang , Xiaotian Zhang
IPC分类号： H01L23/495
CPC分类号： H01L21/823487 , H01L23/4952 , H01L23/49524 , H01L23/49531 , H01L23/49562 , H01L23/49575 , H01L23/58 , H01L24/37 , H01L24/39 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/91 , H01L25/071 , H01L25/074 , H01L25/18 , H01L27/088 , H01L2224/05552 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/37124 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49112 , H01L2224/4917 , H01L2224/49171 , H01L2224/49431 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/85 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H02J7/0031 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A battery protection package assembly is disclosed. The assembly includes a power control integrated circuit (IC) with pins for a supply voltage input (VCC) and a ground (VSS) on a first side of the power control IC. First and second common-drain metal oxide semiconductor field effect transistors (MOSFETs) are electrically coupled to the power control IC. The power control IC and the first and second common-drain metal oxide semiconductor field effect transistors (MOSFET) are co-packaged on a common die pad. The power control IC is vertically stacked on top of one or more of the first and second common-drain MOSFETs. Leads coupled to a supply voltage input (VCC) and a ground (VSS) of the power control IC are on a first side of the common die pad.
摘要翻译：公开了一种电池保护封装组件。该组件包括功率控制集成电路（IC），其具有用于功率控制IC的第一侧上的电源电压输入（VCC）和接地（VSS）的引脚。第一和第二共漏极金属氧化物半导体场效应晶体管（MOSFET）电耦合到功率控制IC。功率控制IC和第一和第二共漏极金属氧化物半导体场效应晶体管（MOSFET）共同封装在公共管芯焊盘上。功率控制IC垂直堆叠在第一和第二共漏极MOSFET中的一个或多个的顶部上。耦合到功率控制IC的电源电压输入（VCC）和接地（VSS）的引线位于公共管芯焊盘的第一侧上。

5. 发明授权

US07898092B2 Stacked-die package for battery power management 有权
标题翻译：堆叠式封装，用于电池电源管理
公开(公告)号：US07898092B2
公开(公告)日：2011-03-01
申请号：US11944313
申请日：2007-11-21
申请人： Jun Lu , Allen Chang , Xiaotian Zhang
发明人： Jun Lu , Allen Chang , Xiaotian Zhang
IPC分类号： H02H9/00
CPC分类号： H02J7/0031 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/58 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L25/071 , H01L25/074 , H01L25/18 , H01L2224/32145 , H01L2224/32245 , H01L2224/37124 , H01L2224/40247 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49431 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A stacked-die package for battery protection is disclosed. The battery protection package includes a power control integrated circuit (IC) stacked on top of integrated dual common-drain metal oxide semiconductor field effect transistors (MOSFETs) or two discrete MOSFETs. The power control IC is either stacked on top of one MOSFET or on top of and overlapping both two MOSFETs.
摘要翻译：公开了一种用于电池保护的堆叠式封装。电池保护封装包括堆叠在集成的双共漏极金属氧化物半导体场效应晶体管（MOSFET）或两个分立MOSFET之上的功率控制集成电路（IC）。功率控制IC或者堆叠在一个MOSFET的顶部，或者两个MOSFET的顶部和两个MOSFET重叠。

6. 发明授权

US07884454B2 Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package 有权
公开(公告)号：US07884454B2
公开(公告)日：2011-02-08
申请号：US12209106
申请日：2008-09-11
申请人： Jun Lu , Anup Bhalla , Xiaobin Wang , Allen Chang , Man Sheng Hu , Xiaotian Zhang
发明人： Jun Lu , Anup Bhalla , Xiaobin Wang , Allen Chang , Man Sheng Hu , Xiaotian Zhang
IPC分类号： H01L23/495
CPC分类号： H01L21/823487 , H01L23/4952 , H01L23/49524 , H01L23/49531 , H01L23/49562 , H01L23/49575 , H01L23/58 , H01L24/37 , H01L24/39 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/91 , H01L25/071 , H01L25/074 , H01L25/18 , H01L27/088 , H01L2224/05552 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/37124 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49112 , H01L2224/4917 , H01L2224/49171 , H01L2224/49431 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/85 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H02J7/0031 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor package assembly may include a lead frame having a die bonding pad and plurality of leads coupled to the first die bonding pad. A vertical semiconductor device may be bonded to the die bonding pad. The device may have a conductive pad electrically connected to one lead through a first bond wire. An electrically isolated conductive trace may be formed from a layer of conductive material of the first semiconductor device. The conductive trace provides an electrically conductive path between the first bond wire and a second bond wire. The conductive path may either pass underneath a third bond wire thereby avoiding the third bond wire crossing another bond wire, or the conductive path may result in a reduced length for the first and second bond wires that is less than a predetermined maximum length.

7. 发明申请

US20090128968A1 STACKED-DIE PACKAGE FOR BATTERY POWER MANAGEMENT 有权
标题翻译：电池电源管理的堆叠式封装
公开(公告)号：US20090128968A1
公开(公告)日：2009-05-21
申请号：US11944313
申请日：2007-11-21
申请人： Jun Lu , Allen Chang , Xiaotian Zhang
发明人： Jun Lu , Allen Chang , Xiaotian Zhang
IPC分类号： H02H9/00
CPC分类号： H02J7/0031 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/58 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L25/071 , H01L25/074 , H01L25/18 , H01L2224/32145 , H01L2224/32245 , H01L2224/37124 , H01L2224/40247 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49431 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A stacked-die package for battery protection is disclosed. The battery protection package includes a power control integrated circuit (IC) stacked on top of integrated dual common-drain metal oxide semiconductor field effect transistors (MOSFETs) or two discrete MOSFETs. The power control IC is either stacked on top of one MOSFET or on top of and overlapping both two MOSFETs.
摘要翻译：公开了一种用于电池保护的堆叠式封装。电池保护封装包括堆叠在集成的双共漏极金属氧化物半导体场效应晶体管（MOSFET）或两个分立MOSFET之上的功率控制集成电路（IC）。功率控制IC或者堆叠在一个MOSFET的顶部，或两个MOSFET的顶部和两个MOSFET重叠。

8. 发明申请

US20090008758A1 USE OF DISCRETE CONDUCTIVE LAYER IN SEMICONDUCTOR DEVICE TO RE-ROUTE BONDING WIRES FOR SEMICONDUCTOR DEVICE PACKAGE 有权
标题翻译：在半导体器件中使用分离导电层以重新布线用于半导体器件封装
公开(公告)号：US20090008758A1
公开(公告)日：2009-01-08
申请号：US12209106
申请日：2008-09-11
申请人： Jun Lu , Anup Bhalla , Xiaobin Wang , Allen Chang , Man Sheng Hu , Xiaotian Zhang
发明人： Jun Lu , Anup Bhalla , Xiaobin Wang , Allen Chang , Man Sheng Hu , Xiaotian Zhang
IPC分类号： H01L23/495 , H01L21/58 , H01L23/488
CPC分类号： H01L21/823487 , H01L23/4952 , H01L23/49524 , H01L23/49531 , H01L23/49562 , H01L23/49575 , H01L23/58 , H01L24/37 , H01L24/39 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/91 , H01L25/071 , H01L25/074 , H01L25/18 , H01L27/088 , H01L2224/05552 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/37124 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49112 , H01L2224/4917 , H01L2224/49171 , H01L2224/49431 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/85 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H02J7/0031 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor package assembly may include a lead frame having a die bonding pad and plurality of leads coupled to the first die bonding pad. A vertical semiconductor device may be bonded to the die bonding pad. The device may have a conductive pad electrically connected to one lead through a first bond wire. An electrically isolated conductive trace may be formed from a layer of conductive material of the first semiconductor device. The conductive trace provides an electrically conductive path between the first bond wire and a second bond wire. The conductive path may either pass underneath a third bond wire thereby avoiding the third bond wire crossing another bond wire, or the conductive path may result in a reduced length for the first and second bond wires that is less than a predetermined maximum length.
摘要翻译：半导体封装组件可以包括引线框架，其具有管芯接合焊盘和耦合到第一管芯接合焊盘的多个引线。垂直半导体器件可以结合到芯片焊盘。该器件可以具有通过第一接合线电连接到一个引线的导电焊盘。电绝缘的导电迹线可以由第一半导体器件的导电材料层形成。导电迹线在第一接合线和第二接合线之间提供导电路径。导电路径可以通过第三接合线下方，从而避免第三接合线穿过另一接合线，或者导电路径可导致第一和第二接合线的长度小于预定最大长度。

9. 发明授权

US08122471B2 Method and apparatus for transmitting and downloading setup information 有权
标题翻译：用于发送和下载设置信息的方法和装置
公开(公告)号：US08122471B2
公开(公告)日：2012-02-21
申请号：US11479722
申请日：2006-06-30
申请人： Henry C. Yuen , Daniel S. Kwoh , Allen Chang
发明人： Henry C. Yuen , Daniel S. Kwoh , Allen Chang
IPC分类号： H04N5/445
CPC分类号： H04N5/50 , H04N5/4401 , H04N5/44543 , H04N5/45 , H04N7/088 , H04N7/0884 , H04N7/0887 , H04N7/10 , H04N7/165 , H04N21/42204 , H04N21/4316 , H04N21/4345 , H04N21/435 , H04N21/4383 , H04N21/4524 , H04N21/4622 , H04N21/47 , H04N21/482 , H04N21/4823 , H04N21/6547 , H04N21/84
摘要： Multiple channel maps are embedded in a television transmission and the appropriate-channel corresponding to the particular television service used by the viewer is downloaded for use with the television receiver. Each channel map is accompanied by a channel map identifier which identifies the source of the television transmission and a geographic identifier. The source of a television transmission is automatically detected by monitoring the radio-frequency spectrum allocations of telecast stations. The geographic area identifier is determined by comparison with a user inputted geographic area identifier. The channel map having a channel map identifier corresponding to the detected television transmission source and the user inputted geographic area identifier is downloaded and stored for future use.
摘要翻译：多频道地图被嵌入在电视传输中，并且与观看者使用的特定电视服务对应的适当频道被下载以与电视接收机一起使用。每个频道地图伴随着标识电视传输源和地理标识符的频道映射标识符。通过监视电视台的射频频谱分配，自动检测电视传输的来源。通过与用户输入的地理区域标识符进行比较来确定地理区域标识符。具有与检测到的电视传输源和用户输入的地理区域标识符相对应的频道映射标识符的频道映射被下载并存储以供将来使用。

10. 发明授权

US07893778B2 Flexible low current oscillator for multiphase operations 有权
标题翻译：灵活的低电流振荡器，用于多相操作
公开(公告)号：US07893778B2
公开(公告)日：2011-02-22
申请号：US12488413
申请日：2009-06-19
申请人： Behzad Mohtashemi , Allen Chang
发明人： Behzad Mohtashemi , Allen Chang
IPC分类号： H03B5/24 , H03K3/03
CPC分类号： H03K3/354 , H03K4/502
摘要： An oscillator includes a reference stage and multiple phase stages. The reference stage has a reference transistor having a gate coupled to a voltage reference and a drain coupled to a reference current source. Each phase stage includes a transistor, two current sources, a capacitor, switch, inverter, and latch. The transistor has a drain coupled to a first current source, a gate coupled to a node and a source coupled to the reference transistor's source. The capacitor and switch couple between the node and ground. The second current source couples to the node. The transistor's drain couples to the inverter's input. The inverter's output couples to the latch's set input. The latch's output couples to the switch. The inverter output also couples to the reset input of a subsequent phase stage's latch. The inverter output for a last stage couples to the reset input of a first stage latch.
摘要翻译：振荡器包括参考级和多相级。参考级具有参考晶体管，其具有耦合到参考电流源的电压参考和漏极的栅极。每个相位级包括晶体管，两个电流源，电容器，开关，反相器和锁存器。晶体管具有耦合到第一电流源的漏极，耦合到节点的栅极和耦合到参考晶体管源极的源极。节点与地之间的电容和开关耦合。第二个电流源耦合到节点。晶体管的漏极耦合到逆变器的输入。变频器的输出耦合到锁存器的输入。锁存器的输出耦合到开关。逆变器输出也耦合到后续相位级锁存器的复位输入。最后级的逆变器输出耦合到第一级锁存器的复位输入。

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