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1. 发明授权

US06205994B1 Scriber adapter plate 有权
标题翻译：划线器适配板
公开(公告)号：US06205994B1
公开(公告)日：2001-03-27
申请号：US09219783
申请日：1998-12-23
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , Raymond Frank Gruszka
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , Raymond Frank Gruszka
IPC分类号： B28D300
CPC分类号： B28D5/0011 , B28D5/0094 , Y10T225/371 , Y10T225/379
摘要： A scribing machine adapter plate is configured to receive and couple a hoop assembly to a chuck on a scribing machine. The adapter plate includes an upper surface and an inner annular vacuum groove and an outer annular vacuum groove formed in the upper surface. A third vacuum groove extends radially between, and communicates with, the inner and outer grooves. The outer vacuum groove includes a vacuum inlet hole that extends from the groove through the adapter plate to provide communication between a vacuum channel in the chuck and the vacuum grooves in the plate. The polymer film of the hoop assembly is disposed on the upper surface to seal the vacuum grooves to hold the film in place during scribing of materials placed on the film.
摘要翻译：划线机适配器板构造成将箍组件接收并连接到划线机上的卡盘上。适配板包括形成在上表面中的上表面和内环形真空槽和外环形真空槽。第三真空槽在内槽和外槽之间径向延伸并连通。外部真空槽包括从凹槽通过适配器板延伸的真空入口孔，以提供卡盘中的真空通道和板中的真空槽之间的连通。环形组件的聚合物膜设置在上表面上以密封真空槽，以便在放置在膜上的材料的划线期间将膜保持在适当位置。

2. 发明授权

US6088212A Apparatus and method for minimizing electrostatic discharge damage to semiconductor objects 有权
标题翻译：用于最小化对半导体物体的静电放电损伤的装置和方法
公开(公告)号：US6088212A
公开(公告)日：2000-07-11
申请号：US135368
申请日：1998-08-17
申请人： Joseph Michael Freund , Raymond Frank Gruszka , George John Przybylek , Dennis Mark Romero , Nancy Louise Reyes
发明人： Joseph Michael Freund , Raymond Frank Gruszka , George John Przybylek , Dennis Mark Romero , Nancy Louise Reyes
IPC分类号： H01L21/00 , H01L21/673 , H05F1/00
CPC分类号： H01L21/67396 , H01L21/67294
摘要： An apparatus and method for minimizing electrostatic discharge damage to semiconductor objects utilizes an ionized air stream to reduce electrostatic and triboelectric potential build up in and surrounding semiconductor storage containers. The ionized air stream is continuously directed to a designated area where stored semiconductor objects are being removed from. Electrostatic and triboelectric potential is greatly reduced, minimizing the threat of electrostatic discharge and damage.
摘要翻译：用于最小化对半导体物体的静电放电损伤的装置和方法利用电离空气流来减少在半导体存储容器内和周围的静电和摩擦电势。电离空气流连续地被引导到被去除存储的半导体物体的指定区域。静电和摩擦电势大大降低，使静电放电和损坏的威胁最小化。

3. 发明授权

US6109861A Apparatus and method for rotating semiconductor objects 有权
标题翻译：用于旋转半导体物体的装置和方法
公开(公告)号：US6109861A
公开(公告)日：2000-08-29
申请号：US135186
申请日：1998-08-17
申请人： Joseph Michael Freund , Raymond Frank Gruszka , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , Raymond Frank Gruszka , George John Przybylek , Dennis Mark Romero
IPC分类号： H01L21/677 , H01L21/683 , B65G47/24
CPC分类号： H01L21/67294 , H01L21/67718 , H01L21/67721 , H01L21/6838
摘要： A device and method for the automated rotating of semiconductor objects during the fabrication process is disclosed. The device uses a slotted base fixture with a channel, lifting members with ducts, and a vacuum. Semiconductor objects are rotated from a vertical position to a substantially horizontal essentially evenly spaced parallel configuration. The positioning of the semiconductor objects by the device is such that the facet end of each semiconductor object remains undisturbed. The configuration of the semiconductor objects allows for quick and easy transfer to a storage surface or transfer to further semiconductor processing steps.
摘要翻译：公开了一种在制造过程中自动旋转半导体物体的装置和方法。该设备使用具有通道的开槽底架，具有导管的提升构件和真空。半导体物体从垂直位置旋转到基本上水平的基本均匀间隔的平行配置。半导体器件由器件的定位使得每个半导体物体的刻面保持不受干扰。半导体物体的配置允许快速且容易地转移到存储表面或转移到进一步的半导体处理步骤。

4. 发明授权

US06277234B1 Method and apparatus for removing work pieces adhered to a support 失效
标题翻译：用于去除粘附到支撑件上的工件的方法和装置
公开(公告)号：US06277234B1
公开(公告)日：2001-08-21
申请号：US09323041
申请日：1999-06-01
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , H01L21/6838 , Y10S156/943 , Y10T29/49824 , Y10T156/1132 , Y10T156/1983
摘要： A demounting apparatus is described which releases semiconductor work pieces from an adhesive support structure. The demounting apparatus includes a conduit with a pair of opposed openings. A support structure is placed over one of the openings with a work piece mounted on a lower surface thereof. A vacuum is exerted on the conduit through a constricted outlet, thereby creating a pressure differential. The lower pressure within the demounting apparatus causes the support structure to elastically deform, thereby reducing its adherence on the work piece. The work piece is dislodged from the support structure and caught by a cushion positioned in the other opening. The cushion is pushed inwardly by the pressure differential. Other structures for releasing the work piece are also disclosed.
摘要翻译：描述了从粘合剂支撑结构释放半导体工件的拆卸装置。拆卸装置包括具有一对相对开口的导管。将支撑结构放置在其中一个开口上，其中安装在其下表面上的工件。通过收缩的出口在管道上施加真空，从而产生压力差。拆卸装置内的较低压力导致支撑结构弹性变形，从而减小其对工件的粘附。工件从支撑结构移走并被位于另一个开口中的垫子夹住。缓冲垫被压差向内推。还公开了用于释放工件的其它结构。

5. 发明授权

US06267282B1 Method and apparatus for handling laser bars 有权
标题翻译：用于处理激光棒的方法和装置
公开(公告)号：US06267282B1
公开(公告)日：2001-07-31
申请号：US09285009
申请日：1999-04-01
申请人： Joseph Michael Freund , William Andrew Gault , George John Przybylek , Dennis Mark Romero , John William Stayt, Jr.
发明人： Joseph Michael Freund , William Andrew Gault , George John Przybylek , Dennis Mark Romero , John William Stayt, Jr.
IPC分类号： B26F300
CPC分类号： B28D5/0052 , B28D5/0011 , B28D5/0023 , H01L21/78 , H01S5/0201 , H01S5/028 , Y10T225/10 , Y10T225/12 , Y10T225/16 , Y10T225/18
摘要： An apparatus is provided for cleaving a laser bar into semiconductor chips. The apparatus includes a supporting structure on which a member slides. The apparatus also includes a pair of film layers. The laser bar is positioned between the film layers. A chamber is sealed to the top film layer. The chamber has an inlet through which gas is input. The movement of the member and the downward force caused by the buildup of gas pressure in the chamber induce cleaving of the laser bar at predetermined locations. The laser bar may have score marks at the predetermined locations to produce weak points. Pressure pulses may be coordinated with the movement of the member to break the laser bar at the desired locations.
摘要翻译：提供一种用于将激光棒切割成半导体芯片的装置。该装置包括支撑结构，构件在该支撑结构上滑动。该装置还包括一对薄膜层。激光棒位于膜层之间。一个室被密封到顶部薄膜层。该室具有输入气体的入口。构件的运动和由室内的气体压力的积聚引起的向下的力引起激光棒在预定位置的裂开。激光棒在预定位置可能具有刻痕以产生弱点。压力脉冲可以与构件的运动协调，以在期望的位置处破坏激光棒。

6. 发明授权

US6026557A Method for laser bar facet coating 失效
标题翻译：激光棒刻面涂层方法
公开(公告)号：US6026557A
公开(公告)日：2000-02-22
申请号：US54138
申请日：1998-04-02
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： C23C14/50 , H01S5/028 , B23Q7/00
CPC分类号： C23C14/50 , H01S5/028 , Y10T29/49998
摘要： Apparatus and method for retaining a laser bar during a facet coating operation and releasing the laser bar subsequent to the operation. The apparatus includes a pair of opposing spacers that hold the laser bar when compressed, each spacer including a compliant spring on an inner portion thereof. A compression device applies a force to the spacers sufficient to compress the springs against opposite sides of the laser bar to thereby retain the laser bar during the facet coating operation. Subsequent to the facet coating operation, the compressive force is released to decompress the springs and thereby release the laser bar. Due to the spring action, the laser bar is released without substantially adhering to either one of the spacers.
摘要翻译：在小面涂覆操作期间保持激光棒并在操作之后释放激光棒的装置和方法。该装置包括一对相对的间隔件，其在压缩时保持激光棒，每个间隔件在其内部包括柔性弹簧。压缩装置向间隔件施加足以将弹簧压靠在激光棒的相对侧上的力，从而在小面涂覆操作期间保持激光棒。在小面涂布操作之后，释放压缩力以使弹簧减压，从而释放激光棒。由于弹簧作用，激光棒被释放而基本上不粘附到任一个间隔件。

7. 发明授权

US6125530A Method and apparatus for handling laser bar 失效
标题翻译：用于处理激光棒的方法和装置
公开(公告)号：US6125530A
公开(公告)日：2000-10-03
申请号：US225269
申请日：1999-01-05
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , Mindaugas Fernand Dautartas
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , Mindaugas Fernand Dautartas
IPC分类号： C23C14/50 , H01S5/02 , B23P19/00
CPC分类号： C23C14/50 , H01S5/0202 , Y10S118/15 , Y10T29/49822 , Y10T29/53 , Y10T29/53283 , Y10T29/53683 , Y10T29/53909
摘要： A system is provided for freeing laser bars stuck in a facet coating fixture. A roller device is provided that rolls into a facet coating fixture channel and applies a downward force to a stuck laser bar. The roller device and coating fixture combination provide an uncomplicated and reliable system for handling the bars.
摘要翻译：提供一种用于释放卡在小面涂装夹具中的激光棒的系统。提供一种辊装置，其滚动到小平面涂覆固定通道中并向卡住的激光条施加向下的力。辊装置和涂层夹具组合提供了一种不复杂和可靠的处理杆的系统。

8. 发明授权

US6102267A Method and apparatus for non-contact pulsating jet cleaving of a semiconductor material 有权
标题翻译：用于半导体材料的非接触脉动喷射裂开的方法和装置
公开(公告)号：US6102267A
公开(公告)日：2000-08-15
申请号：US208768
申请日：1998-12-10
申请人： Joseph Michael Freund , William Andrew Gault , George John Przybylek , Dennis Mark Romero , John William Stayt, Jr.
发明人： Joseph Michael Freund , William Andrew Gault , George John Przybylek , Dennis Mark Romero , John William Stayt, Jr.
IPC分类号： B28D5/00 , H01L21/00 , H01L21/301 , H01L21/78 , H01L21/46
CPC分类号： H01L21/67092 , B28D5/0011 , B28D5/0052 , H01L21/78
摘要： An apparatus and a method for non-contact cleaving a brittle, non-metallic solid material, such as semiconductor material, glass, quartz, ceramic or like material. A pulsating gas jet directs a jet of gas toward a support structure formed of a non-compliant material. The semiconductor material is positioned on the support structure between a pair of film layers. The semiconductor material is scored in at least one location on the material. A plastic buffer material is adhered to the support structure. The semiconductor material and the film layers are moved along the support structure until the score line is at a ledge of the support structure and underneath the source of gas. The jet of gas applies a sufficient force to cleave the semiconductor material as it passes off the ledge of the support structure, while minimizing vibration and/or turbulence. The buffer provides cushioning and inhibits the formation of fractures during the cleaving process.
摘要翻译：用于非接触地切割脆性非金属固体材料如半导体材料，玻璃，石英，陶瓷或类似材料的装置和方法。脉动气体喷射器将气体射流引向由不顺从材料形成的支撑结构。半导体材料位于一对薄膜层之间的支撑结构上。半导体材料在材料上的至少一个位置上刻痕。塑料缓冲材料粘附到支撑结构上。半导体材料和薄膜层沿着支撑结构移动，直到刻痕线处于支撑结构的凸缘并在气体源的下方。气体射流施加足够的力以在半导体材料离开支撑结构的突出部分时切割半导体材料，同时最小化振动和/或湍流。缓冲液提供缓冲，并在劈裂过程中抑制骨折的形成。

9. 发明授权

US06274458B1 Method of gas cleaving a semiconductor product 有权
标题翻译：气体切割半导体产品的方法
公开(公告)号：US06274458B1
公开(公告)日：2001-08-14
申请号：US09348462
申请日：1999-07-07
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： H01L2128
CPC分类号： H01L21/67092 , B28D5/0011 , B28D5/0047 , B28D5/0052 , H01L21/304
摘要： A device is provided for cleaving semiconductor products or the like. The device may be formed of an inlet for receiving pressurized gas, an adjustable slot for directing the gas toward the products, and a movable flow control member. According to one aspect of the invention, the flow control member is located within a housing that also defines the inlet and the adjustable slot. A cover may be located on the front of the housing. The cover may have a lower edge that forms one side of the slot. The other side of the slot may be formed by the movable flow control member. The cleave device may have an uncomplicated, compact construction. The cleave device may be operated with a flexible product handling system. That is, the brittle products may be handled within opposed flexible sheets. The sheets may be used to locate the products over a ledge (a cleaving position) where they are bent to cause cleaving along crystal planes initiated at scribe or score lines. Uniform bending forces may applied gently and in a non-destructive fashion across the full widths of the semiconductor products. The pressure and cross sectional dimensions of the sheet flow through the adjustable slot may be precisely controlled, if desired. The invention may be used, for example, to increase production yield by reducing the number of integrated circuits formed with defects due to cracking or splitting of silicon material.
摘要翻译：提供了用于切割半导体产品等的装置。该装置可以由用于接收加压气体的入口，用于将气体引向产品的可调节槽以及可移动流动控制构件形成。根据本发明的一个方面，流量控制构件位于也限定入口和可调节槽的壳体内。盖子可能位于外壳的前部。盖可以具有形成槽的一侧的下边缘。槽的另一侧可以由可移动流动控制构件形成。切割装置可以具有不复杂，紧凑的结构。切割装置可以用柔性产品处理系统操作。也就是说，脆性产品可以在相对的柔性片材内处理。片材可以用于将产品定位在突出部分（裂开位置）上，在它们被弯曲的地方，以沿着在划线或刻痕线处开始的晶面裂开。均匀的弯曲力可以在半导体产品的整个宽度上以非破坏性的方式轻轻施加。如果需要，可以精确地控制通过可调节槽的片材流的压力和横截面尺寸。例如，本发明可以通过减少由于硅材料的破裂或分裂而形成的缺陷而形成的集成电路的数量来增加产量。

10. 发明授权

US06249955B1 Laser bar transport method 有权
标题翻译：激光棒运输方式
公开(公告)号：US06249955B1
公开(公告)日：2001-06-26
申请号：US09417709
申请日：1999-10-13
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： B23Q700
CPC分类号： C23C14/50 , Y10S414/137 , Y10T29/49998 , Y10T29/53974 , Y10T29/53978
摘要： A coating fixture adapted to extricate a jammed connector web is described. The coating fixture includes a pair of vertical supports. Each support has a first portion spaced apart from a second portion. Springs are placed between the first and second portions to allow movement of the first portions relative to the second portions. The second portions may be anchored to prevent their movement.
摘要翻译：描述了适于脱离卡住的连接器网的涂装夹具。涂层固定装置包括一对垂直支撑件。每个支撑件具有与第二部分间隔开的第一部分。弹簧被放置在第一和第二部分之间以允许第一部分相对于第二部分移动。第二部分可以被锚定以防止它们的移动。

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