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1. 发明授权

US6125530A Method and apparatus for handling laser bar 失效
标题翻译：用于处理激光棒的方法和装置
公开(公告)号：US6125530A
公开(公告)日：2000-10-03
申请号：US225269
申请日：1999-01-05
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , Mindaugas Fernand Dautartas
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , Mindaugas Fernand Dautartas
IPC分类号： C23C14/50 , H01S5/02 , B23P19/00
CPC分类号： C23C14/50 , H01S5/0202 , Y10S118/15 , Y10T29/49822 , Y10T29/53 , Y10T29/53283 , Y10T29/53683 , Y10T29/53909
摘要： A system is provided for freeing laser bars stuck in a facet coating fixture. A roller device is provided that rolls into a facet coating fixture channel and applies a downward force to a stuck laser bar. The roller device and coating fixture combination provide an uncomplicated and reliable system for handling the bars.
摘要翻译：提供一种用于释放卡在小面涂装夹具中的激光棒的系统。提供一种辊装置，其滚动到小平面涂覆固定通道中并向卡住的激光条施加向下的力。辊装置和涂层夹具组合提供了一种不复杂和可靠的处理杆的系统。

2. 发明授权

US06263555B1 Method and apparatus for handling laser bar 失效
标题翻译：用于处理激光棒的方法和装置
公开(公告)号：US06263555B1
公开(公告)日：2001-07-24
申请号：US09617245
申请日：2000-07-14
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , Mindaugas Fernand Dautartas
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , Mindaugas Fernand Dautartas
IPC分类号： B23P1900
CPC分类号： C23C14/50 , H01S5/0202 , Y10S118/15 , Y10T29/49822 , Y10T29/53 , Y10T29/53283 , Y10T29/53683 , Y10T29/53909
摘要： A method and apparatus are provided for freeing laser bars stuck in a facet coating fixture. A roller device is provided that rolls into a facet coating fixture channel and applies a downward force to a stuck laser bar. The roller device provides an uncomplicated and reliable system for handling the bars.
摘要翻译：提供了一种用于释放卡在小平面涂装夹具中的激光棒的方法和装置。提供一种辊装置，其滚动到小平面涂覆固定通道中并向卡住的激光条施加向下的力。滚筒装置提供了一种不复杂且可靠的处理条的系统。

3. 发明授权

US6074934A Apparatus for cleaving laser bars 有权
标题翻译：用于切割激光棒的设备
公开(公告)号：US6074934A
公开(公告)日：2000-06-13
申请号：US196956
申请日：1998-11-20
申请人： Mindaugas Fernand Dautartas , Joseph Michael Freund , William Andrew Gault , John Michael Geary , George John Przybylek , Dennis Mark Romero
发明人： Mindaugas Fernand Dautartas , Joseph Michael Freund , William Andrew Gault , John Michael Geary , George John Przybylek , Dennis Mark Romero
IPC分类号： H01S5/02 , H01L21/46
CPC分类号： H01S5/0201 , H01S5/0202
摘要： A method and apparatus are provided for automated cleaving of semiconductor laser bars into laser devices. The structures to be cleaved are sandwiched between two sheets of plastic film and, while supported on a stabilizing surface, are transported between the sheets in a direction perpendicular to scribe marks defining the sides of the laser devices. At one point, the film sheets with the structures between them pass over a raised breaker assembly on the stabilizing surface. A high pressure air source above the breaker assembly provides a blast of air towards each film sheet enclosed structure as it passes over the breaker assembly. This causes the structure to fracture or cleave along the scribe line. As the film sheet pass over the breaker assembly, the structure is cleaved at each successive scribe line. Thus, downstream of the breaker assembly, there are provided a series of separated devices between the two film sheets. Moreover, there is no possibility that the devices will be displaced as a result of any air currents, since they are securely retained between the two film sheets.
摘要翻译：提供了用于将半导体激光棒自动分裂成激光器件的方法和装置。要被切割的结构被夹在两片塑料膜之间，并且在支撑在稳定表面上时，在垂直于限定激光装置的侧面的划线标记的方向在片材之间传送。一方面，具有它们之间的结构的薄膜片通过稳定表面上的升高的断路器组件。断路器组件上方的高压空气源在其穿过断路器组件时向每个膜片封闭结构提供空气。这导致结构沿着划线断裂或切割。当膜片通过断路器组件时，在每个连续的划线处将结构切断。因此，在断路器组件的下游，在两个薄膜片之间提供了一系列分离的装置。此外，由于它们被牢固地保持在两个薄膜片之间，因此任何气流都不会使装置发生位移。

4. 发明授权

US06258403B1 Method for coating facet edges of an optoelectrical device 失效
标题翻译：用于涂覆光电装置的小面边缘的方法
公开(公告)号：US06258403B1
公开(公告)日：2001-07-10
申请号：US09397030
申请日：1999-09-16
申请人： Mindaugas Fernand Dautartas , Joseph Michael Freund , Dennis Mark Romero
发明人： Mindaugas Fernand Dautartas , Joseph Michael Freund , Dennis Mark Romero
IPC分类号： B05D512
CPC分类号： C23C14/50 , C23C14/042
摘要： A holding apparatus including a fixture is described. The fixture of the holding apparatus, which receives a semiconductor laser bar for optical coating, includes a base and a pair of walls. The walls and the base have inner surfaces, and the walls have a top surface upon which the laser bar rests. An extending portion of the semiconductor laser bar fits in a cavity formed by the base and the walls. The facet edges of the laser bar do not extend horizontally beyond the walls of the fixture. A coating apparatus applies a coating to the facet edges of the laser bar without contacting any coating material on the extending portion.
摘要翻译：描述包括固定装置的保持装置。接收用于光学涂层的半导体激光棒的保持装置的固定装置包括基部和一对壁。壁和底座具有内表面，并且壁具有顶表面，激光条放置在该顶表面上。半导体激光棒的延伸部分配合在由基底和壁形成的空腔中。激光棒的小面边缘不会水平延伸超过固定装置的墙壁。涂覆装置将涂层施加到激光棒的小面边缘，而不会在延伸部分上接触任何涂层材料。

5. 发明授权

US6102267A Method and apparatus for non-contact pulsating jet cleaving of a semiconductor material 有权
标题翻译：用于半导体材料的非接触脉动喷射裂开的方法和装置
公开(公告)号：US6102267A
公开(公告)日：2000-08-15
申请号：US208768
申请日：1998-12-10
申请人： Joseph Michael Freund , William Andrew Gault , George John Przybylek , Dennis Mark Romero , John William Stayt, Jr.
发明人： Joseph Michael Freund , William Andrew Gault , George John Przybylek , Dennis Mark Romero , John William Stayt, Jr.
IPC分类号： B28D5/00 , H01L21/00 , H01L21/301 , H01L21/78 , H01L21/46
CPC分类号： H01L21/67092 , B28D5/0011 , B28D5/0052 , H01L21/78
摘要： An apparatus and a method for non-contact cleaving a brittle, non-metallic solid material, such as semiconductor material, glass, quartz, ceramic or like material. A pulsating gas jet directs a jet of gas toward a support structure formed of a non-compliant material. The semiconductor material is positioned on the support structure between a pair of film layers. The semiconductor material is scored in at least one location on the material. A plastic buffer material is adhered to the support structure. The semiconductor material and the film layers are moved along the support structure until the score line is at a ledge of the support structure and underneath the source of gas. The jet of gas applies a sufficient force to cleave the semiconductor material as it passes off the ledge of the support structure, while minimizing vibration and/or turbulence. The buffer provides cushioning and inhibits the formation of fractures during the cleaving process.
摘要翻译：用于非接触地切割脆性非金属固体材料如半导体材料，玻璃，石英，陶瓷或类似材料的装置和方法。脉动气体喷射器将气体射流引向由不顺从材料形成的支撑结构。半导体材料位于一对薄膜层之间的支撑结构上。半导体材料在材料上的至少一个位置上刻痕。塑料缓冲材料粘附到支撑结构上。半导体材料和薄膜层沿着支撑结构移动，直到刻痕线处于支撑结构的凸缘并在气体源的下方。气体射流施加足够的力以在半导体材料离开支撑结构的突出部分时切割半导体材料，同时最小化振动和/或湍流。缓冲液提供缓冲，并在劈裂过程中抑制骨折的形成。

6. 发明授权

US06277234B1 Method and apparatus for removing work pieces adhered to a support 失效
标题翻译：用于去除粘附到支撑件上的工件的方法和装置
公开(公告)号：US06277234B1
公开(公告)日：2001-08-21
申请号：US09323041
申请日：1999-06-01
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , H01L21/6838 , Y10S156/943 , Y10T29/49824 , Y10T156/1132 , Y10T156/1983
摘要： A demounting apparatus is described which releases semiconductor work pieces from an adhesive support structure. The demounting apparatus includes a conduit with a pair of opposed openings. A support structure is placed over one of the openings with a work piece mounted on a lower surface thereof. A vacuum is exerted on the conduit through a constricted outlet, thereby creating a pressure differential. The lower pressure within the demounting apparatus causes the support structure to elastically deform, thereby reducing its adherence on the work piece. The work piece is dislodged from the support structure and caught by a cushion positioned in the other opening. The cushion is pushed inwardly by the pressure differential. Other structures for releasing the work piece are also disclosed.
摘要翻译：描述了从粘合剂支撑结构释放半导体工件的拆卸装置。拆卸装置包括具有一对相对开口的导管。将支撑结构放置在其中一个开口上，其中安装在其下表面上的工件。通过收缩的出口在管道上施加真空，从而产生压力差。拆卸装置内的较低压力导致支撑结构弹性变形，从而减小其对工件的粘附。工件从支撑结构移走并被位于另一个开口中的垫子夹住。缓冲垫被压差向内推。还公开了用于释放工件的其它结构。

7. 发明授权

US06267282B1 Method and apparatus for handling laser bars 有权
标题翻译：用于处理激光棒的方法和装置
公开(公告)号：US06267282B1
公开(公告)日：2001-07-31
申请号：US09285009
申请日：1999-04-01
申请人： Joseph Michael Freund , William Andrew Gault , George John Przybylek , Dennis Mark Romero , John William Stayt, Jr.
发明人： Joseph Michael Freund , William Andrew Gault , George John Przybylek , Dennis Mark Romero , John William Stayt, Jr.
IPC分类号： B26F300
CPC分类号： B28D5/0052 , B28D5/0011 , B28D5/0023 , H01L21/78 , H01S5/0201 , H01S5/028 , Y10T225/10 , Y10T225/12 , Y10T225/16 , Y10T225/18
摘要： An apparatus is provided for cleaving a laser bar into semiconductor chips. The apparatus includes a supporting structure on which a member slides. The apparatus also includes a pair of film layers. The laser bar is positioned between the film layers. A chamber is sealed to the top film layer. The chamber has an inlet through which gas is input. The movement of the member and the downward force caused by the buildup of gas pressure in the chamber induce cleaving of the laser bar at predetermined locations. The laser bar may have score marks at the predetermined locations to produce weak points. Pressure pulses may be coordinated with the movement of the member to break the laser bar at the desired locations.
摘要翻译：提供一种用于将激光棒切割成半导体芯片的装置。该装置包括支撑结构，构件在该支撑结构上滑动。该装置还包括一对薄膜层。激光棒位于膜层之间。一个室被密封到顶部薄膜层。该室具有输入气体的入口。构件的运动和由室内的气体压力的积聚引起的向下的力引起激光棒在预定位置的裂开。激光棒在预定位置可能具有刻痕以产生弱点。压力脉冲可以与构件的运动协调，以在期望的位置处破坏激光棒。

8. 发明授权

US6026557A Method for laser bar facet coating 失效
标题翻译：激光棒刻面涂层方法
公开(公告)号：US6026557A
公开(公告)日：2000-02-22
申请号：US54138
申请日：1998-04-02
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： C23C14/50 , H01S5/028 , B23Q7/00
CPC分类号： C23C14/50 , H01S5/028 , Y10T29/49998
摘要： Apparatus and method for retaining a laser bar during a facet coating operation and releasing the laser bar subsequent to the operation. The apparatus includes a pair of opposing spacers that hold the laser bar when compressed, each spacer including a compliant spring on an inner portion thereof. A compression device applies a force to the spacers sufficient to compress the springs against opposite sides of the laser bar to thereby retain the laser bar during the facet coating operation. Subsequent to the facet coating operation, the compressive force is released to decompress the springs and thereby release the laser bar. Due to the spring action, the laser bar is released without substantially adhering to either one of the spacers.
摘要翻译：在小面涂覆操作期间保持激光棒并在操作之后释放激光棒的装置和方法。该装置包括一对相对的间隔件，其在压缩时保持激光棒，每个间隔件在其内部包括柔性弹簧。压缩装置向间隔件施加足以将弹簧压靠在激光棒的相对侧上的力，从而在小面涂覆操作期间保持激光棒。在小面涂布操作之后，释放压缩力以使弹簧减压，从而释放激光棒。由于弹簧作用，激光棒被释放而基本上不粘附到任一个间隔件。

9. 发明授权

US06274458B1 Method of gas cleaving a semiconductor product 有权
标题翻译：气体切割半导体产品的方法
公开(公告)号：US06274458B1
公开(公告)日：2001-08-14
申请号：US09348462
申请日：1999-07-07
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： H01L2128
CPC分类号： H01L21/67092 , B28D5/0011 , B28D5/0047 , B28D5/0052 , H01L21/304
摘要： A device is provided for cleaving semiconductor products or the like. The device may be formed of an inlet for receiving pressurized gas, an adjustable slot for directing the gas toward the products, and a movable flow control member. According to one aspect of the invention, the flow control member is located within a housing that also defines the inlet and the adjustable slot. A cover may be located on the front of the housing. The cover may have a lower edge that forms one side of the slot. The other side of the slot may be formed by the movable flow control member. The cleave device may have an uncomplicated, compact construction. The cleave device may be operated with a flexible product handling system. That is, the brittle products may be handled within opposed flexible sheets. The sheets may be used to locate the products over a ledge (a cleaving position) where they are bent to cause cleaving along crystal planes initiated at scribe or score lines. Uniform bending forces may applied gently and in a non-destructive fashion across the full widths of the semiconductor products. The pressure and cross sectional dimensions of the sheet flow through the adjustable slot may be precisely controlled, if desired. The invention may be used, for example, to increase production yield by reducing the number of integrated circuits formed with defects due to cracking or splitting of silicon material.
摘要翻译：提供了用于切割半导体产品等的装置。该装置可以由用于接收加压气体的入口，用于将气体引向产品的可调节槽以及可移动流动控制构件形成。根据本发明的一个方面，流量控制构件位于也限定入口和可调节槽的壳体内。盖子可能位于外壳的前部。盖可以具有形成槽的一侧的下边缘。槽的另一侧可以由可移动流动控制构件形成。切割装置可以具有不复杂，紧凑的结构。切割装置可以用柔性产品处理系统操作。也就是说，脆性产品可以在相对的柔性片材内处理。片材可以用于将产品定位在突出部分（裂开位置）上，在它们被弯曲的地方，以沿着在划线或刻痕线处开始的晶面裂开。均匀的弯曲力可以在半导体产品的整个宽度上以非破坏性的方式轻轻施加。如果需要，可以精确地控制通过可调节槽的片材流的压力和横截面尺寸。例如，本发明可以通过减少由于硅材料的破裂或分裂而形成的缺陷而形成的集成电路的数量来增加产量。

10. 发明授权

US06249955B1 Laser bar transport method 有权
标题翻译：激光棒运输方式
公开(公告)号：US06249955B1
公开(公告)日：2001-06-26
申请号：US09417709
申请日：1999-10-13
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： B23Q700
CPC分类号： C23C14/50 , Y10S414/137 , Y10T29/49998 , Y10T29/53974 , Y10T29/53978
摘要： A coating fixture adapted to extricate a jammed connector web is described. The coating fixture includes a pair of vertical supports. Each support has a first portion spaced apart from a second portion. Springs are placed between the first and second portions to allow movement of the first portions relative to the second portions. The second portions may be anchored to prevent their movement.
摘要翻译：描述了适于脱离卡住的连接器网的涂装夹具。涂层固定装置包括一对垂直支撑件。每个支撑件具有与第二部分间隔开的第一部分。弹簧被放置在第一和第二部分之间以允许第一部分相对于第二部分移动。第二部分可以被锚定以防止它们的移动。

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